1. Product Specifications
Core Features
- Part Number: XC2S200E-6FT256C
- Manufacturer: Xilinx Inc. (now AMD)
- Family: Spartan-IIE FPGA
- Technology: 0.15ฮผm CMOS process
- Supply Voltage: 1.8V
- Package Type: 256-pin Fine-pitch Ball Grid Array (FTBGA)
- Temperature Grade: Commercial (0ยฐC to +85ยฐC)
Technical Specifications
- System Gates: 200,000 gates
- Logic Cells: 5,292 cells
- Configurable Logic Blocks (CLBs): 1,176 CLBs
- Maximum Frequency: 357MHz
- User I/O Pins: 182 (includes 4 global clock/user input pins)
- Block RAM: Up to 288K bits
- Distributed RAM: Up to 221,184 bits
- Digital Clock Managers (DLLs): 4 Delay-Locked Loops
Memory Architecture
- SelectRAM Hierarchical Memory:
- 16 bits/LUT distributed RAM
- Configurable 4K-bit true dual-port block RAM
- Advanced memory management capabilities
I/O Standards Support
Features 19 selectable I/O standards including:
- LVTTL, LVCMOS
- GTL, GTL+
- HSTL, SSTL
- AGP, PCI compliance
- And many more industry standards
2. Pricing Information
Current Market Availability
- Stock Status: New original components available – 2,647+ pieces in stock
- Lead Time: Same-day shipping available from authorized distributors
- Minimum Order Quantity: 1 piece
- Volume Pricing: Available for quantities 60+ pieces
Pricing Tiers
- 1-59 pieces: Request quote from authorized distributors
- 60+ pieces: Volume discounts available
- 500+ pieces: Significant bulk pricing discounts
- Custom quantities: Contact distributors for enterprise pricing
Note: Prices fluctuate based on market conditions and supplier inventory levels. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Official Documentation
- Primary Datasheet: Spartan-IIE FPGA Family Complete Data Sheet (DS077)
- User Guide: Spartan-IIE FPGA Family User Guide
- Package Information: 256-pin FTBGA Package Specifications
- Pinout Diagrams: Complete pin configuration documentation
- Application Notes: Design implementation guidelines
Design Resources
- Reference Designs: Sample projects and implementations
- Constraint Files: UCF files for design implementation
- IBIS Models: Signal integrity analysis models
- Footprint Libraries: PCB layout footprints for major CAD tools
- 3D Models: Mechanical models for thermal and mechanical analysis
Development Tools Documentation
- ISE Design Suite: Legacy development environment documentation
- Impact Programming: Configuration and programming guides
- ChipScope Pro: Debug and verification tool documentation
4. Related Resources
Development Software
- Primary Tool: Xilinx ISE Design Suite (legacy support)
- Programming: Xilinx Impact or equivalent programming tools
- Simulation: ModelSim, ISim support
- Debug Tools: ChipScope Pro for in-system debugging
Compatible Development Boards
Popular evaluation and development platforms supporting XC2S200E-6FT256C:
- Custom evaluation boards from various manufacturers
- University program development kits
- Third-party FPGA development platforms
Technical Support
- Knowledge Base: Comprehensive online documentation
- Community Forums: Active developer community support
- Application Engineers: Direct technical support from distributors
- Training Resources: Online tutorials and design methodology guides
Design Services
- Reference Designs: Pre-verified IP cores and designs
- Consulting Services: Professional FPGA design assistance
- Custom Development: Turnkey FPGA solution providers
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Lead free / RoHS Compliant versions available
- Pb-Free Packaging: Special “G” character versions for lead-free requirements
- REACH Compliance: EU chemical regulation compliant
- Conflict Minerals: Compliant with conflict minerals regulations
Operating Conditions
- Commercial Temperature Range: 0ยฐC to +85ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- MSL Rating: Moisture Sensitivity Level classification available
Export Classification
- ECCN: Export Control Classification Number available upon request
- HTS Code: Harmonized Tariff Schedule classification
- Country of Origin: Manufacturing location information available
- Export Restrictions: Subject to applicable export control regulations
Quality & Reliability
- Quality Grade: Standard commercial grade
- MTBF: Mean Time Between Failure data available
- ESD Protection: Built-in electrostatic discharge protection
- Latch-up Immunity: Enhanced latch-up protection features
Key Benefits of XC2S200E-6FT256C
Cost-Effective Solution
- No NRE Costs: Eliminates non-recurring engineering expenses
- Flexible Development: Rapid prototyping and design iterations
- Field Upgradeable: In-system reprogrammability for post-deployment updates
High Performance Features
- Fast Interconnect: Predictable routing for timing closure
- Multiple Clock Domains: Advanced clocking architecture with DLLs
- Rich I/O Capabilities: Extensive I/O standard support
- Memory Flexibility: Hierarchical memory architecture
Design Security
- Bitstream Encryption: Optional security features for IP protection
- Anti-tamper Features: Hardware-based security capabilities
- Authentication: Secure configuration loading options
Applications
The XC2S200E-6FT256C is ideal for:
- Communications: Protocol processing, baseband processing
- Industrial Control: Motor control, process automation
- Test & Measurement: Signal processing, data acquisition
- Consumer Electronics: Digital signal processing applications
- Automotive: Advanced driver assistance systems (ADAS)
- Medical Devices: Portable medical equipment, imaging systems
Ordering Information
Standard Part Number: XC2S200E-6FT256C
Pb-Free Version: XC2S200E-6FTG256C
Contact authorized distributors for:
- Current pricing and availability
- Technical support and documentation
- Custom packaging and delivery options
- Volume pricing negotiations
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