Product Specification
The XC2C384-7FT256C is a high-performance Complex Programmable Logic Device (CPLD) from Xilinx’s acclaimed CoolRunner-II family. This advanced variant features the premium “-7” speed grade and space-efficient FTBGA package, delivering exceptional performance for demanding applications that require both high speed and compact form factor.
Key Technical Specifications:
- Logic Capacity: 9K Gates with 384 Macro Cells
- Logic Blocks: 24 Function Blocks with 16 macrocells per block
- Performance: Superior 7.1ns propagation delay
- Maximum Frequency: Enhanced 217MHz operation (compared to 125MHz for standard variants)
- Technology: Advanced 0.18um CMOS technology
- Supply Voltage: Low-power 1.8V (operating range 1.7V to 1.9V)
- Package: 256-Pin Fine-pitch Thin Ball Grid Array (FTBGA), 17x17mm size
- I/O Pins: 212 user-configurable I/Os
- Power Consumption: Ultra-low power design for enhanced efficiency
- Operating Temperature: Commercial grade (0°C to 70°C)
Advanced Features:
- Advanced Interconnect Matrix (AIM): Low-power interconnection system that feeds 40 true and complement inputs to each Function Block
- Zero Power Design: Minimizes power consumption during standby and operation
- In-System Programmable (ISP): Field-programmable capability for easy updates
- DataGATE Technology: Selectively disable inputs to reduce power consumption
- CoolCLOCK Technology: Dynamic power reduction through advanced clock management
- I/O Banking: Two I/O banks that permit easy interfacing to 3.3V, 2.5V, 1.8V, and 1.5V devices
- Flexible Clocking Options:
- Optional DualEDGE triggered registers
- Clock divider (÷ 2,4,6,8,10,12,14,16)
- Multiple global clocks with phase selection per macrocell
- JTAG Support: IEEE Standard 1149.1/1532 Boundary-Scan for programming, prototyping, and testing
- Non-volatile Technology: Instant-on capability with no configuration memory
The XC2C384-7FT256C combines high-speed operation with low power consumption in a compact BGA package. The “-7” speed grade designation indicates superior performance compared to standard “-10” variants, making this component ideal for applications where both processing speed and power efficiency are critical requirements.
Price
The XC2C384-7FT256C is available through authorized distributors with tiered pricing based on volume:
- Small quantities (1-89 units): Approximately $200-220 per unit
- Medium volumes (90-359 units): Approximately $180-195 per unit
- Larger volumes (360-719 units): Approximately $140-155 per unit
- High volumes (720-899 units): Approximately $125-140 per unit
- Very high volumes (900-8999 units): Approximately $110-125 per unit
- Mass production (9000+ units): Approximately $103-110 per unit
Important purchasing notes:
- This product is typically marked as Non-Cancellable and Non-Returnable (NCNR)
- Current market availability may affect pricing
- Many vendors require submission of a quote request for exact pricing
- The XC2C384-7FT256C is available in tray packaging for production environments
For the most current pricing and availability, it’s recommended to request a quote from authorized Xilinx (now AMD) distributors.
Documents & Media
Comprehensive documentation is available to support your development with the XC2C384-7FT256C:
- Product Datasheet (DS095): Detailed technical specifications for the XC2C384 family
- CoolRunner-II Family Datasheet (DS090): Overview of the entire CoolRunner-II CPLD family features
- Application Notes: Implementation guides and design best practices
- Pin Diagrams and Package Information: Detailed FTBGA pinout for PCB design
- Timing Models: For accurate simulation and verification
- IBIS Models: For signal integrity analysis
- Package Thermal Models: For thermal analysis and management
- Design Resources: Tools for PCB layout and design verification
All documentation can be accessed through Xilinx’s documentation portal or from authorized distributors’ websites. The datasheet provides critical information about electrical characteristics, timing parameters, and package dimensions necessary for successful implementation.
Related Resources
Development Tools:
- Xilinx ISE Design Suite: Comprehensive development environment supporting the XC2C384-7FT256C
- Vivado Design Suite: Modern design environment for newer projects
- WebPACK Tools: Free development tools for smaller designs
Programming Support:
- In-System Programming: For field updates and configuration
- IEEE Standard 1149.1/1532 Boundary-Scan (JTAG): For programming, prototyping, and testing
- JTAG Command Initiation: For standard FPGA configuration
Compatible Development Boards:
Several development boards are suitable for evaluation and prototyping with the XC2C384 family, including:
- ZedBoard
- Basys 3 board
- TinyFPGA BX
- Nexys4-DDR
- Terasic DE10-Nano
- Digilent Arty S7
Application Areas:
The XC2C384-7FT256C is particularly well-suited for:
- High-performance computing systems
- Telecommunications equipment
- High-speed interface applications
- Portable and battery-operated devices
- Industrial control systems
- Consumer electronics
- Medical devices
Environmental & Export Classifications
Environmental Specifications:
- RoHS Status: Not RoHS Compliant (please note for environmental requirements)
- Operating Temperature Range: Commercial grade (0°C to 70°C)
- Storage Temperature: Standard semiconductor storage conditions
- Moisture Sensitivity Level: Standard handling requirements
- Packaging: ESD-protected packaging available
- Quality Management: Manufactured under ISO 9001 quality management systems by many distributors
Export Classifications:
- ECCN: 3A991D
- HTSUS Code: 8542.39.0001
- Product Status: Many vendors list as “Last Time Buy” (check availability)
- Warranty: Varies by distributor (some offer up to 365 days)
The XC2C384-7FT256C combines high-speed performance with a space-efficient FTBGA package design, making it ideal for applications where board space is limited but performance requirements are demanding. Its superior speed grade provides enhanced performance for timing-critical applications, while the BGA package offers excellent thermal characteristics and signal integrity.
