The XA6SLX9-3CSG225Q is a robust automotive-grade Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-6 family, specifically designed for demanding applications requiring enhanced reliability and performance. This device combines cost-effectiveness with advanced features, making it an ideal choice for automotive, industrial, and aerospace applications.
Product Specifications
Core Features
- Part Number: XA6SLX9-3CSG225Q
- Family: Spartan-6 FPGA
- Grade: Automotive (XA)
- Logic Cells: 9,152 logic cells
- Speed Grade: -3 (highest performance)
- Package: CSG225 (225-pin CSBGA)
- Operating Temperature: -40ยฐC to +125ยฐC (automotive grade)
Technical Specifications
- System Gates: Up to 147,443 gates
- Block RAM: 216 Kbits total block RAM
- DSP48A1 Slices: 16 dedicated DSP slices
- User I/O: Up to 172 user I/O pins
- Memory Controller: Integrated memory controller blocks
- Clock Management: Advanced clock management tiles (CMTs)
- Supply Voltage: 1.2V core, 2.5V/3.3V I/O
Performance Characteristics
The XA6SLX9-3CSG225Q delivers exceptional performance with its -3 speed grade, offering the fastest timing characteristics in the Spartan-6 family. The automotive qualification ensures reliable operation across extended temperature ranges and harsh environmental conditions.
Pricing Information
Pricing for the XA6SLX9-3CSG225Q varies based on quantity, lead time, and supplier. Contact authorized distributors for current pricing and availability. Volume discounts are typically available for quantities over 100 units.
Typical Price Range: Contact for quote Availability: Available through authorized Xilinx distributors Lead Time: Standard lead times apply, expedited options available
Documents & Media
Technical Documentation
- Datasheet: Spartan-6 FPGA Data Sheet (DS160)
- User Guide: Spartan-6 FPGA Configuration User Guide (UG380)
- PCB Design Guidelines: Spartan-6 FPGA PCB Design and Pin Planning Guide
- Automotive Documentation: Automotive qualification test reports and reliability data
Development Resources
- Development Kits: Compatible with Spartan-6 evaluation boards
- Software Support: Xilinx ISE Design Suite and Vivado Design Suite
- Reference Designs: Application-specific reference designs available
- Technical Support: Comprehensive online documentation and community forums
Application Notes
- Power management and thermal considerations
- High-speed PCB design guidelines
- EMI/EMC compliance strategies for automotive applications
- Configuration and programming methodologies
Related Resources
Compatible Products
- Development Boards: Spartan-6 FPGA SP601/SP605 Evaluation Kits
- Configuration Devices: Platform Flash and SPI Flash memory devices
- Power Management: Dedicated FPGA power management ICs
- Connectors: High-speed I/O connectors and cable assemblies
Software Tools
- Xilinx ISE Design Suite: Complete design environment for Spartan-6 FPGAs
- Vivado Design Suite: Next-generation design tools with partial support
- ChipScope Pro: Integrated logic analyzer for debugging
- EDK/SDK: Embedded development kit for processor-based designs
Technical Support
- Answer Database: Searchable technical solutions database
- Forums: Active community support and peer assistance
- Training: Online and instructor-led training programs
- Consulting Services: Professional design services and technical consulting
Environmental & Export Classifications
Environmental Compliance
The XA6SLX9-3CSG225Q meets stringent environmental standards required for automotive and industrial applications:
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Compliance: Meets European chemical safety regulations
- Automotive Standards: AEC-Q100 qualified for automotive applications
- Operating Temperature: Extended range -40ยฐC to +125ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Up to 95% non-condensing
Export Classifications
- ECCN: 3A001.a.2.c (US Export Administration Regulations)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to export control regulations
Quality Standards
- ISO 9001: Manufacturing quality management system certified
- ISO/TS 16949: Automotive quality management system compliance
- Zero Defect: Automotive-grade screening and quality processes
- Reliability Testing: Extended burn-in and environmental stress screening
Package Information
- Package Type: CSBGA (Chip Scale Ball Grid Array)
- Pin Count: 225 pins
- Package Size: 13mm x 13mm
- Ball Pitch: 0.8mm
- Package Height: 1.27mm maximum
- Moisture Sensitivity: Level 3 per JEDEC J-STD-020
The XA6SLX9-3CSG225Q represents an excellent balance of performance, reliability, and cost-effectiveness for applications demanding automotive-grade quality and extended temperature operation. Its comprehensive feature set and robust design make it suitable for a wide range of applications from automotive control systems to industrial automation and aerospace electronics.
For detailed technical specifications, pricing, and availability information, consult the official Xilinx documentation or contact authorized distributors.
