The XA6SLX75T-2FGG484Q is a high-performance automotive-grade Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned XA Spartan-6 family. This advanced programmable logic device combines exceptional reliability, cost-effectiveness, and automotive compliance to meet the demanding requirements of modern automotive applications.
1. Product Specifications
Core Architecture
- FPGA Family: XA Spartan-6 LXT (Automotive Grade)
- Logic Cells: 74,637 logic elements
- Configurable Logic Blocks (CLBs): 11,662 CLBs
- Process Technology: 45nm CMOS low-power copper process
- Core Voltage: 1.2V (1.14V ~ 1.26V operating range)
- Speed Grade: -2 (high-performance grade)
Memory and DSP Resources
- Block RAM: 3,170,304 bits total (3096 Kbit)
- 18 Kb Block RAMs: Multiple integrated blocks
- DSP48A1 Slices: Second-generation DSP blocks for high-performance signal processing
- Maximum User I/O: 268 I/O pins
- Total Pins: 484-pin configuration
Package Details
- Package Type: FGG484 (Fine-pitch Ball Grid Array)
- Form Factor: 484-pin FBGA (Fine Ball Grid Array)
- Mounting Type: Surface Mount Technology (SMT)
- RoHS Compliance: Yes, fully compliant with environmental standards
Automotive Qualifications
- Temperature Grade: I-Grade (Tj = -40ยฐC to +100ยฐC) / Q-Grade available (Tj = -40ยฐC to +125ยฐC)
- Automotive Standards: AEC-Q100 qualified
- ISO Compliance: Manufactured under ISO-TS16949 standards
- PPAP Documentation: Production Part Approval Process documentation available
- Extended Qualification: Beyond AEC-Q100 qualification available upon request
Performance Characteristics
- Maximum Frequency: Up to 333MHz operation
- Data Transfer Rate: Up to 1,080 Mb/s per differential I/O
- Power Efficiency: Optimized for low static and dynamic power consumption
- Power Management: Hibernate power-down mode for zero power consumption
- Suspend Mode: State and configuration retention with multi-pin wake-up control
I/O and Connectivity
- SelectIO Technology: Multi-voltage, multi-standard interface banks
- I/O Standards: Support for over 40 different I/O standards
- High Logic-to-Pin Ratio: Optimized for connectivity-intensive applications
- Staggered Pad Design: Enhanced signal integrity and routing flexibility
2. Price Information
Pricing for XA6SLX75T-2FGG484Q varies based on quantity and distributor:
- Sample/Low Quantity: Contact authorized distributors for current pricing
- Volume Pricing: Significant discounts available for automotive production volumes
- Lead Time: Typically 12-16 weeks for automotive-grade components
- Minimum Order Quantity: Varies by distributor (typically 25-100 pieces)
Note: Prices are subject to change based on market conditions and availability. Contact authorized Xilinx/AMD distributors for current pricing and availability.
Authorized Distributors:
- Arrow Electronics
- Avnet
- Digi-Key Electronics
- Mouser Electronics
- Future Electronics
3. Documents & Media
Technical Documentation
- Data Sheet: DS162 – Spartan-6 Family Overview (Available from AMD Technical Portal)
- User Guide: UG383 – Spartan-6 FPGA Configuration User Guide
- Package Specification: FGG484 Package Documentation
- Automotive Matrix: Xilinx Automotive Product Selection Guide
- Application Notes: Multiple application-specific documents available
Design Resources
- Pin-out Files: Available in multiple CAD formats (Altium, Cadence, Mentor Graphics)
- IBIS Models: For signal integrity simulation
- Thermal Models: For thermal analysis and design optimization
- Reference Designs: Automotive-specific example designs
- Schematic Symbols: Standard CAD library components
Development Tools
- ISE Design Suite: Complete FPGA design environment (legacy support)
- Vivado Design Suite: Modern design flow support
- ChipScope Pro: Integrated logic analyzer
- CORE Generator: IP core development tool
- iMPACT: Configuration and programming tool
4. Related Resources
Development Platforms
- SP605 Evaluation Kit: Complete development platform for Spartan-6 FPGAs
- Automotive Evaluation Boards: Specialized boards for automotive development
- Protocol Development Kits: PCIe, Ethernet, and other protocol-specific platforms
IP Cores and Solutions
- MicroBlaze Soft Processor: Embedded processor solution
- Memory Controllers: DDR, DDR2, DDR3 controller IP
- Communication Interfaces: UART, SPI, I2C, CAN controller IP
- DSP Functions: Filter design, FFT, and signal processing IP
Software and Simulation
- Embedded Development Kit (EDK): Complete embedded system design
- Platform Studio: Integrated development environment
- ModelSim: Advanced HDL simulation
- MATLAB/Simulink Integration: Model-based design flow
Migration and Upgrade Paths
- Artix-7 Family: Next-generation migration option
- Automotive SoCs: Zynq UltraScale+ automotive portfolio
- Cost-optimized Solutions: Current AMD FPGA alternatives
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Directive: Fully compliant (Restriction of Hazardous Substances)
- REACH Regulation: Compliant with EU chemical safety regulation
- Conflict Minerals: DRC conflict-free sourcing compliance
- WEEE Directive: Waste Electrical and Electronic Equipment compliance
- China RoHS: Compliant with Chinese environmental standards
Quality Standards
- ISO 9001: Quality management system certification
- ISO-TS16949: Automotive quality management standard
- AEC-Q100: Automotive Electronics Council qualification
- JEDEC Standards: Industry-standard reliability testing
- MSL Rating: Moisture Sensitivity Level classification available
Export Classifications
- ECCN Classification: Export Administration Regulations compliance
- HTS Code: Harmonized Tariff Schedule classification
- Country of Origin: Manufacturing location documentation
- Export License: May require export licensing for certain destinations
- ITAR Status: Not subject to International Traffic in Arms Regulations
Packaging and Handling
- ESD Protection: Anti-static packaging and handling procedures
- Moisture Sensitivity: Appropriate MSL rating and baking procedures
- Shelf Life: Long-term storage guidelines and recommendations
- Traceability: Full lot tracking and genealogy documentation
Reliability Data
- MTBF: Mean Time Between Failure calculations available
- Qualification Reports: Comprehensive reliability testing documentation
- Failure Analysis: Support for field failure investigation
- Long-term Availability: Automotive-grade lifecycle support commitment
Note: The XA6SLX75T-2FGG484Q represents AMD Xilinx’s commitment to automotive excellence, combining proven FPGA technology with automotive-grade reliability and compliance. This device is specifically designed for high-volume automotive applications requiring robust performance in challenging environments.
For the most current technical specifications, availability, and pricing information, please consult the official AMD Technical Portal or contact authorized distributors.
