Product Specification
The XA6SLX16-2FTG256I is a robust Spartan-6 FPGA (Field-Programmable Gate Array) designed for demanding applications requiring high reliability and extended temperature operation. This advanced programmable logic device features 14,579 logic cells and 576Kb of block RAM, making it ideal for aerospace, defense, and industrial applications.
Key Technical Features:
- Logic Elements: 14,579 logic cells with 4-input LUTs
- Memory: 576Kb total block RAM capacity
- Package Type: 256-pin Fine-Pitch Ball Grid Array (FTBGA)
- Speed Grade: -2 (optimized for balanced performance and power)
- Temperature Range: Industrial grade (-40ยฐC to +100ยฐC)
- Operating Voltage: 1.2V core, 2.5V/3.3V I/O
- DSP Slices: 32 dedicated DSP48A1 slices for signal processing
- I/O Pins: Up to 186 user I/O pins
- Configuration: Multiple configuration options including SPI, BPI, and JTAG
The XA6SLX16-2FTG256I incorporates advanced power management features and supports various I/O standards, making it versatile for mixed-signal applications and system integration.
Price
Pricing for the XA6SLX16-2FTG256I varies based on quantity, distribution channel, and current market conditions. Contact authorized distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. The industrial temperature grade and extended reliability features position this FPGA in the premium pricing tier within the Spartan-6 family.
Documents & Media
Technical Documentation:
- Datasheet: Complete electrical specifications and pin configuration
- User Guide: Comprehensive implementation guidelines and best practices
- Package Information: Mechanical drawings and thermal characteristics
- Migration Guide: Transition information from other FPGA families
- Application Notes: Design examples for common use cases
- Errata: Latest silicon revision notes and workarounds
Development Resources:
- Reference Designs: Validated IP cores and design examples
- Simulation Models: IBIS and SPICE models for signal integrity analysis
- PCB Layout Guidelines: Routing recommendations and power delivery design
- Thermal Management: Heat dissipation strategies and thermal modeling data
Related Resources
Development Tools:
- Xilinx ISE Design Suite: Complete development environment for the XA6SLX16-2FTG256I
- ChipScope Pro: Integrated logic analyzer for debugging
- PlanAhead: Advanced design planning and analysis tool
- XPower Analyzer: Power estimation and optimization utility
Compatible IP Cores:
- Memory controllers (DDR2/DDR3, SRAM)
- Communication interfaces (Ethernet, USB, PCIe)
- Digital signal processing blocks
- Soft processor cores (MicroBlaze)
Evaluation Platforms:
- Development boards featuring the XA6SLX16-2FTG256I
- Reference design kits for rapid prototyping
- Third-party evaluation modules and carrier boards
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Lead-free packaging meets environmental standards
- REACH Compliant: Complies with EU chemical regulations
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC junction temperature)
- Moisture Sensitivity Level: MSL 3 per JEDEC J-STD-020
- ESD Rating: HBM Class 2 (โฅ2000V), CDM Class C4 (โฅ750V)
Export Classifications:
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing location
- Export License: May require export license for certain destinations
Quality Standards:
- Qualification Level: Industrial grade qualification
- Reliability: MTBF data available upon request
- Quality System: ISO 9001 certified manufacturing
- Traceability: Full lot traceability and CoC available
The XA6SLX16-2FTG256I represents an excellent choice for applications requiring proven FPGA technology with industrial-grade reliability and comprehensive development ecosystem support.
