Product Specifications
The XA3S500EFTG256-4I features comprehensive technical specifications that meet stringent military and industrial requirements:
Core Architecture:
- 500,000 system gates providing substantial logic capacity
- Spartan-3A FPGA architecture with advanced 90nm process technology
- Military temperature range: -55ยฐC to +125ยฐC junction temperature
- Industrial-grade reliability and extended operating conditions
Package Details:
- FTBGA256 package (Fine-Pitch Ball Grid Array)
- 256-pin configuration in compact 17mm x 17mm footprint
- Lead-free RoHS compliant construction
- Speed grade -4I for high-performance applications
Logic Resources:
- Configurable Logic Blocks (CLBs) for flexible design implementation
- Distributed RAM and shift register capabilities
- Dedicated multipliers for DSP applications
- Phase-locked loops (PLLs) for clock management
I/O Capabilities:
- Multiple I/O standards support including LVTTL, LVCMOS, and differential signaling
- High-speed serial connectivity options
- Flexible voltage operation supporting various interface requirements
Price Information
Pricing for the XA3S500EFTG256-4I varies based on quantity, supplier, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Military-grade components like the XA3S500EFTG256-4I typically command premium pricing due to their enhanced specifications and reliability testing.
Documents & Media
Essential documentation for the XA3S500EFTG256-4I includes:
Technical Documentation:
- Spartan-3A FPGA Family Complete Data Sheet
- XA3S500EFTG256-4I Product Specification
- Package mechanical drawings and thermal characteristics
- Pin assignment and ball map documentation
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- Programming and configuration guidelines
- PCB design recommendations for FTBGA256 package
Quality and Reliability:
- Military specification compliance documentation
- Reliability test reports and qualification data
- Environmental testing results and certifications
Related Resources
The XA3S500EFTG256-4I integrates seamlessly with Xilinx’s comprehensive development ecosystem:
Development Tools:
- Xilinx ISE Design Suite for design implementation
- ChipScope Pro for debugging and verification
- Xilinx Platform Studio for embedded processor designs
- ModelSim simulation environment support
Companion Products:
- Other Spartan-3A family members for scalable solutions
- Xilinx configuration memory devices
- Development boards and evaluation kits
- Power management solutions optimized for FPGA applications
Support Resources:
- Xilinx technical support and documentation portal
- Application engineering assistance
- Training courses and certification programs
- Community forums and user groups
Environmental & Export Classifications
The XA3S500EFTG256-4I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant lead-free construction
- REACH regulation compliance for European markets
- Conflict minerals reporting program participation
- Green packaging and shipping materials
Military Standards:
- MIL-STD-883 testing and qualification procedures
- Extended temperature range qualification: -55ยฐC to +125ยฐC
- Enhanced radiation tolerance for aerospace applications
- Accelerated life testing and burn-in procedures
Export Control Classification:
- Export Administration Regulations (EAR) classification
- International Traffic in Arms Regulations (ITAR) compliance
- Country-specific export licensing requirements
- End-use and end-user restrictions apply
Quality Certifications:
- ISO 9001 quality management system compliance
- AS9100 aerospace quality standard certification
- Military specification MIL-PRF-38535 qualification
- Automotive qualification standards where applicable
The XA3S500EFTG256-4I represents a premium solution for applications demanding high reliability, extended temperature operation, and military-grade performance. Its combination of substantial logic capacity, robust package design, and comprehensive support ecosystem makes it an excellent choice for mission-critical applications in aerospace, defense, and industrial markets.
For detailed technical specifications, current availability, and application support, consult with authorized Xilinx distributors and field application engineers who can provide customized guidance for your specific XA3S500EFTG256-4I implementation requirements.
