Product Specifications
Core Architecture
- Device Family: Xilinx Spartan-3E FPGA
- Logic Cells: 500,000 system gates
- Package Type: FTG256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 pins
- Speed Grade: -4 (high-performance variant)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Memory Configuration
- Block RAM: 360 Kbits distributed RAM
- Distributed RAM: 40 Kbits
- Configuration Memory: Fast configuration support
- Memory Interface: Multiple memory controller support
I/O Capabilities
- User I/O Pins: Up to 190 user-configurable I/O
- Differential Pairs: High-speed LVDS support
- Voltage Standards: Multiple I/O voltage standards (1.2V to 3.3V)
- Signal Integrity: Advanced signal integrity features
Performance Features
- Maximum Frequency: Up to 320 MHz system performance
- DSP Capabilities: Integrated multipliers for signal processing
- Clock Management: Digital Clock Manager (DCM) for precise timing
- Power Management: Low-power design with multiple power domains
Pricing Information
The XA3S500E-4FTG256I pricing varies based on quantity and supplier. Contact authorized distributors for current pricing:
- Unit Price (1-99 pieces): Contact for quote
- Volume Pricing (100+ pieces): Significant discounts available
- Extended Temperature Range: Premium pricing for industrial applications
- Long-term Availability: Supported through authorized channels
Note: Prices subject to change based on market conditions and quantity requirements. Contact Xilinx authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation guidelines
- Package Information: Detailed pinout and mechanical drawings
- Application Notes: Design implementation best practices
- Errata: Known issues and workarounds
Development Resources
- ISE Design Suite: Compatible development environment
- Reference Designs: Pre-verified application examples
- IP Cores: Extensive intellectual property library
- Simulation Models: VHDL and Verilog behavioral models
- Constraint Files: UCF templates for rapid development
Media Resources
- Product Videos: Technical overview presentations
- Webinars: Design methodology training sessions
- White Papers: Advanced implementation strategies
- Case Studies: Real-world application examples
Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment
- ChipScope Pro: Advanced debugging and analysis
- CORE Generator: IP core customization tool
- iMPACT: Configuration and programming utility
Evaluation Platforms
- Spartan-3E Starter Kit: Complete development platform
- Custom Evaluation Boards: Third-party development solutions
- Reference Designs: Proven implementation examples
- Application Kits: Specific use-case development platforms
Support Resources
- Technical Support: Comprehensive engineering assistance
- Community Forums: Peer-to-peer development support
- Training Programs: Professional development courses
- Partner Network: Authorized design service providers
Compatible Products
- Configuration Devices: Platform Flash and SPI Flash memory
- Power Management: Switching regulators and LDOs
- Clock Sources: Crystal oscillators and clock generators
- Interface Components: Level translators and buffers
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Lead-free and environmentally friendly
- REACH Regulation: European chemical safety standards
- Conflict Minerals: Responsible sourcing certification
- ISO 14001: Environmental management system compliance
Operating Conditions
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity Range: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
Export Classifications
- ECCN: Export Control Classification Number compliance
- Country of Origin: Manufacturing location designation
- Export Restrictions: Applicable trade regulation compliance
- Licensing Requirements: Government authorization where required
Quality Standards
- Automotive Grade: AEC-Q100 qualified variants available
- Military Standards: MIL-STD-883 testing compliance
- Quality Certification: ISO 9001 manufacturing standards
- Reliability Testing: Extended qualification and burn-in
Package Environmental Data
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- Peak Reflow Temperature: 260ยฐC lead-free compatible
- Storage Requirements: Dry pack shipping and storage
- Handling Procedures: ESD-sensitive device protocols
The XA3S500E-4FTG256I represents cutting-edge FPGA technology, combining high performance with industrial-grade reliability. Whether you’re developing advanced signal processing applications, implementing custom computing solutions, or creating next-generation embedded systems, this versatile FPGA provides the programmable logic resources and performance capabilities needed for success in demanding applications.
