Product Specifications
Core Architecture
- Device Family: Spartan-3A FPGA
- Logic Cells: 400,000 system gates
- Speed Grade: -4 (high-performance grade)
- Package Type: FTG256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 pins
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
Memory and Processing Features
- Block RAM: 288 Kbits total capacity
- Distributed RAM: Integrated within CLBs
- Multipliers: Dedicated 18×18 multiplier blocks
- Clock Management: Integrated Digital Clock Managers (DCMs)
- I/O Standards: Support for multiple voltage standards including LVTTL, LVCMOS, SSTL, HSTL
Advanced Capabilities
- Configuration Options: Multiple configuration modes including JTAG, SPI, and parallel
- Power Management: Low-power design with multiple power domains
- Signal Integrity: Advanced I/O features for high-speed applications
- Debugging Support: Built-in boundary scan and configuration readback
Pricing Information
The XA3S400-4FTG256I pricing varies based on quantity and distributor. Contact authorized Xilinx distributors for current pricing tiers:
- Sample Quantities: Available through Xilinx direct or authorized partners
- Production Volumes: Volume pricing available with quantity breaks at 100, 500, and 1000+ units
- Lead Time: Standard lead times range from 12-16 weeks for production quantities
Pricing subject to change. Contact your local distributor for the most current XA3S400-4FTG256I pricing and availability.
Documents & Media
Technical Documentation
- XA3S400-4FTG256I Datasheet: Complete electrical specifications and performance characteristics
- Spartan-3A Family User Guide: Comprehensive implementation guide
- Package Drawings: Detailed mechanical specifications for FTG256 package
- Pin Assignment Guide: Complete pinout documentation
- Thermal Management Guidelines: Junction temperature and thermal resistance specifications
Design Resources
- Reference Designs: Pre-validated design examples and application notes
- Constraint Files: UCF templates for pin assignments
- Simulation Models: IBIS and SPICE models for signal integrity analysis
- PCB Layout Guidelines: Best practices for board design and routing
Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete development environment for XA3S400-4FTG256I
- ChipScope Pro: Integrated logic analyzer for debugging
- CORE Generator: IP core library for accelerated development
- iMPACT: Configuration and programming utility
Evaluation Platforms
- Spartan-3A Starter Kit: Development board featuring similar Spartan-3A architecture
- Custom Evaluation Boards: Third-party development platforms supporting FTG256 package
- Reference Designs: Automotive and industrial application examples
Support Resources
- Xilinx Forums: Community support and technical discussions
- Application Notes: Industry-specific implementation guides
- Training Materials: Online courses and certification programs
- Technical Support: Direct access to Xilinx engineering support
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European Restriction of Hazardous Substances directive
- REACH Compliant: Complies with European chemical regulation standards
- Automotive Grade: AEC-Q100 qualified for automotive applications
- Industrial Temperature Range: -40ยฐC to +100ยฐC junction temperature
Export Control Information
- ECCN Classification: 3A001.a.7 (subject to export administration regulations)
- Country of Origin: Manufactured in compliance with international trade regulations
- Export Licensing: May require export license for certain destinations
- Compliance Standards: Meets applicable export control requirements
Quality and Reliability
- Quality System: Manufactured under ISO 9001:2015 certified processes
- Reliability Testing: Extensive qualification testing including thermal cycling, humidity, and mechanical stress
- Statistical Quality Control: Comprehensive testing ensures consistent performance
- Traceability: Full lot traceability for quality assurance and compliance
The XA3S400-4FTG256I represents the pinnacle of FPGA technology, combining high performance with industrial reliability. Whether you’re developing automotive control systems, industrial automation, or telecommunications equipment, this FPGA provides the flexibility and performance needed for next-generation embedded applications.
For technical support, pricing inquiries, or additional information about the XA3S400-4FTG256I, contact your local Xilinx representative or authorized distributor.
