1. Product Specifications
Core Architecture
- Device Family: Spartan-3A Automotive
- System Gates: 1,500,000 gates
- Logic Cells: 33,280 equivalent logic cells
- Block RAM: 432 Kbits total block RAM
- Distributed RAM: 412 Kbits
- Multipliers: 32 dedicated 18×18 multipliers
Package Details
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 676 pins
- Package Size: 27mm x 27mm
- Ball Pitch: 1.0mm
- Speed Grade: -4 (fastest speed grade available)
Electrical Characteristics
- Supply Voltage (VCCINT): 1.2V ยฑ5%
- Supply Voltage (VCCAUX): 2.5V ยฑ5%
- Supply Voltage (VCCO): 1.2V to 3.3V
- Maximum Operating Frequency: Up to 200+ MHz
- Power Consumption: Optimized for low-power operation
Temperature Range
- Automotive Grade: -40ยฐC to +125ยฐC junction temperature
- Extended reliability for harsh environments
I/O Capabilities
- User I/O Pins: 372 user I/O pins
- Differential I/O Pairs: 186 pairs
- I/O Standards: Support for LVTTL, LVCMOS, SSTL, HSTL, and differential standards
- High-speed serial connectivity options
2. Pricing Information
The XA3S1500-4FG676 pricing varies based on order quantity and distributor. Typical pricing structure:
- Unit Price (1-99 pieces): Contact authorized distributors for current pricing
- Volume Pricing (100-999 pieces): Significant discounts available
- Production Quantities (1000+ pieces): Custom pricing available
Note: Prices are subject to change based on market conditions. Contact authorized Xilinx distributors for the most current pricing and availability information.
3. Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and timing characteristics
- User Guide: Comprehensive implementation guidelines
- Package and Pinout Information: Detailed pin assignments and package drawings
- Application Notes: Design best practices and implementation examples
- Errata: Known issues and workarounds
Design Resources
- Reference Designs: Proven implementations for common applications
- IP Cores: Pre-verified intellectual property blocks
- Evaluation Boards: Hardware platforms for rapid prototyping
- Software Tools: ISE Design Suite compatibility information
Compliance Documentation
- Automotive Qualification Reports: AEC-Q100 compliance documentation
- Reliability Reports: MTBF and failure rate analysis
- Quality Certifications: ISO/TS 16949 manufacturing quality standards
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete FPGA design environment
- ChipScope Pro: Advanced debugging and verification tools
- ModelSim: HDL simulation software compatibility
- Synthesis Tools: Support for XST and third-party synthesis tools
Evaluation Platforms
- Spartan-3A Evaluation Kit: Complete development platform
- Automotive Reference Designs: Pre-built solutions for automotive applications
- Demo Boards: Application-specific demonstration platforms
Support Resources
- Technical Support: Access to Xilinx technical experts
- Community Forums: Peer-to-peer design assistance
- Training Materials: Online courses and webinars
- Application Engineers: Regional support specialists
Compatible Products
- Configuration Devices: Platform Flash and Serial Flash options
- Power Management: Voltage regulators and power sequencing solutions
- Connectors and Components: Recommended passive components and connectors
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- WEEE Directive: Compliant with electronic waste regulations
- REACH Regulation: Substance of Very High Concern (SVHC) compliant
- Conflict Minerals: Compliant with conflict-free sourcing requirements
Automotive Standards
- AEC-Q100 Qualified: Automotive Electronics Council qualification
- Grade 2 Temperature: -40ยฐC to +125ยฐC automotive temperature range
- ISO/TS 16949: Manufacturing quality management certification
- Functional Safety: Suitable for automotive safety applications
Export Classifications
- ECCN (Export Control Classification Number): Check current ECCN rating
- Country of Origin: Manufacturing location information
- Export Restrictions: Compliance with international trade regulations
- ITAR Status: Not subject to International Traffic in Arms Regulations
Quality and Reliability
- Qualification Level: Automotive grade qualification
- Package Qualification: JEDEC standards compliance
- Moisture Sensitivity Level: MSL-3 classification
- ESD Classification: Class 1C (>1000V) electrostatic discharge protection
Key Applications
The XA3S1500-4FG676 is perfectly suited for:
- Automotive infotainment systems
- Advanced driver assistance systems (ADAS)
- Industrial control and automation
- Communications infrastructure
- Medical equipment
- Aerospace and defense applications
Conclusion
The XA3S1500-4FG676 represents the pinnacle of automotive-grade FPGA technology, combining high performance, reliability, and extensive I/O capabilities in a compact, industry-standard package. Its automotive qualification and extended temperature range make it the ideal choice for mission-critical applications requiring long-term reliability and consistent performance across extreme operating conditions.
