Premium Microwave and RF Circuit Board Solutions
RT/duroid substrate materials represent the gold standard in high-frequency circuit board applications, delivering exceptional electrical performance for demanding microwave and RF designs. These advanced PTFE-based composite materials offer unmatched reliability for aerospace, defense, telecommunications, and commercial electronics applications.
What is RT/duroid Substrate Material?
RT/duroid substrates are specialized circuit board materials engineered with polytetrafluoroethylene (PTFE) reinforced with woven glass fiber or ceramic fillers. This unique composition creates a low-loss, dimensionally stable platform ideal for high-frequency electronic circuits operating from MHz to millimeter-wave frequencies.
Key Features & Benefits
Superior Electrical Performance
- Ultra-low dielectric loss (tan ฮด as low as 0.0009)
- Stable dielectric constant across wide frequency range
- Excellent signal integrity with minimal insertion loss
- Outstanding phase stability over temperature
Mechanical Excellence
- Exceptional dimensional stability
- Low coefficient of thermal expansion (CTE)
- High thermal conductivity options available
- Excellent copper peel strength and adhesion
Environmental Reliability
- Wide operating temperature range (-55ยฐC to +200ยฐC)
- Low moisture absorption (<0.02%)
- Chemical resistance to harsh environments
- Long-term aging stability
Popular RT/duroid Product Grades
RT/duroid 5880
- Dielectric constant: 2.20 ยฑ 0.02
- Dissipation factor: 0.0009 at 10 GHz
- Applications: Microstrip antennas, couplers, filters
RT/duroid 6002
- Dielectric constant: 2.94 ยฑ 0.04
- Ceramic-filled for enhanced thermal conductivity
- Applications: Power amplifiers, high-power RF circuits
RT/duroid 6010LM
- Dielectric constant: 10.2 ยฑ 0.25
- High dielectric constant for miniaturization
- Applications: Compact antenna designs, filters
Target Applications
Aerospace & Defense
- Radar systems and phased array antennas
- Electronic warfare equipment
- Satellite communication systems
- Military radio frequency applications
Telecommunications
- 5G infrastructure and base stations
- Microwave point-to-point links
- Antenna systems and feed networks
- RF front-end modules
Commercial Electronics
- Automotive radar and collision avoidance
- Medical imaging equipment
- Test and measurement instruments
- Wireless communication devices
Manufacturing Capabilities
RT/duroid substrates are available in various thicknesses, copper cladding options, and panel sizes to meet diverse design requirements. Compatible with standard PCB fabrication processes while requiring specialized handling techniques for optimal results.
Available Configurations:
- Single and double-sided copper cladding
- Thickness range: 0.005″ to 0.250″ (0.127mm to 6.35mm)
- Copper weights: ยฝ oz to 2 oz (17.5ฮผm to 70ฮผm)
- Panel sizes up to 12″ x 18″ (305mm x 457mm)
Why Choose RT/duroid Substrates?
RT/duroid materials have established themselves as the industry benchmark for high-frequency circuit applications through decades of proven performance. When signal integrity, reliability, and consistent electrical properties are critical to your design success, RT/duroid substrates deliver the performance foundation your most demanding applications require.
The combination of low loss, stable dielectric properties, and excellent manufacturability makes RT/duroid the preferred choice for engineers developing next-generation RF and microwave systems across commercial, military, and space applications.
Technical Support & Design Resources
Our experienced applications engineering team provides comprehensive design support, material selection guidance, and fabrication recommendations to help optimize your high-frequency circuit designs using RT/duroid substrate materials.
