Advanced High-Performance Circuit Board Solution for Next-Generation Electronics
Our Liquid Crystal Polymer (LCP) High Frequency PCBs deliver exceptional electrical performance for demanding applications requiring superior signal integrity and minimal loss characteristics. Engineered with cutting-edge LCP substrate technology, these circuit boards offer unmatched performance in high-frequency, high-speed digital, and RF/microwave applications.
Key Features
Superior Electrical Properties
- Ultra-low dielectric constant (Dk: 2.9-3.2) for minimal signal distortion
- Extremely low dissipation factor (Df: 0.002-0.004) reducing signal loss
- Excellent frequency stability up to 110 GHz
- Outstanding impedance control and signal integrity
Exceptional Thermal Performance
- Wide operating temperature range: -55°C to +200°C
- Low coefficient of thermal expansion (CTE) matching copper
- Superior thermal cycling reliability
- Excellent dimensional stability across temperature variations
Advanced Material Properties
- High tensile strength and flexural modulus
- Excellent chemical resistance to acids, bases, and solvents
- Low moisture absorption (<0.04%) for consistent performance
- Outstanding flame retardancy (UL-94 V-0 rated)
Precision Manufacturing
- Tight thickness control (±0.0005″)
- Smooth surface finish for optimal conductor adhesion
- Excellent via reliability and plating adhesion
- Compatible with standard PCB fabrication processes
Applications
- 5G/6G Communications – Base stations, antennas, and RF modules
- Automotive Radar – ADAS systems, collision avoidance, parking sensors
- Aerospace & Defense – Satellite communication, radar systems, electronic warfare
- High-Speed Digital – Servers, data centers, high-performance computing
- Medical Devices – MRI equipment, diagnostic instruments
- Test & Measurement – Network analyzers, oscilloscopes, signal generators
Specifications
| Parameter | Value |
|---|---|
| Dielectric Constant (10GHz) | 2.9 – 3.2 |
| Dissipation Factor (10GHz) | 0.002 – 0.004 |
| Glass Transition Temperature | >280°C |
| Thermal Conductivity | 0.2 W/m·K |
| Volume Resistivity | >10¹⁶ Ω·cm |
| Breakdown Voltage | >100 kV/mm |
| Maximum Layer Count | 20+ layers |
Why Choose LCP High Frequency PCBs?
LCP substrate technology represents the pinnacle of high-frequency PCB materials, offering performance advantages that traditional materials simply cannot match. The unique molecular structure of liquid crystal polymers provides inherently low loss characteristics while maintaining excellent mechanical properties and thermal stability.
Perfect for applications where signal integrity is critical and performance cannot be compromised, our LCP PCBs enable designers to push the boundaries of what’s possible in high-frequency electronic systems.
Ready to optimize your high-frequency designs? Contact our technical team to discuss your specific requirements and discover how LCP technology can enhance your next project.
