Description
Board Type: Flexible Aluminum Substrate
Layers: single-sided
Board thickness: 0.2mm
Surface treatment: OSP
Product Name: Ultra-thin COB Aluminum Substrate/COB Flexible Aluminum Substrate/COB Bendable Aluminum Substrate
Product Thickness: Flexible 0.2MM (Tolerance ±0.03MM) Product Type: Aluminum Substrate
Nominal copper foil thickness: 35 µm (1 oz/ft²) Soldermask / oil: white film / black film / white oil, etc.
Substrate: copper/adhesive ED
Surface finish: OSP. Confirm the coating specification for the proposed process.
Fire rating: 94-V0
Insulation Material: Organic resin
Insulation layer thickness: Thin type
Temperature Resistance Test: Thermal Shock 288℃10SEC
Flame Retardant Characteristics: VO Board
Dielectric Constant: PI3.5AD3.9
Technical Processing: Calendered Foil
Insulation Resin: Polymillimide Resin (PI)
Storage environment: Vacuum storage away from light, temperature <25℃ humidity <70
