10µ” (10 microinch) Gold Plated Circuit Boards represent a high-quality solution in printed circuit board manufacturing, offering a precise balance between performance and cost-effectiveness. The 10 microinch gold plating thickness provides excellent conductivity and corrosion resistance while optimizing material usage.
Key features include:
- Superior conductivity and low contact resistance
- Excellent protection against oxidation and corrosion
- Ideal for applications requiring multiple insertion cycles
- Compatible with various soldering techniques
- Enhanced durability compared to thinner gold platings
The 10µ” gold layer is typically applied over a nickel underlayer, forming an ENIG (Electroless Nickel Immersion Gold) finish. This combination ensures strong adhesion and prevents nickel diffusion through the gold layer.
These boards are widely used in telecommunications, computing, aerospace, and high-reliability electronics. They excel in applications requiring a balance between performance and cost, offering better durability than flash gold (2-5µ”) while being more economical than hard gold (30µ” or more).
10µ” Gold Plated Circuit Boards provide an optimal solution for many high-performance electronic products, ensuring reliable connections and long-term stability in challenging environments.
