1. Product Specifications
Core Architecture
- Family: Xilinx Virtex-E 1.8V Industrial FPGAs
- Part Number: XCV100E-6PQ240I
- Logic Elements: 2700 configurable cells
- System Gates: 128,236 gates
- Speed Grade: -6 (high-performance tier)
Memory Resources
- Distributed RAM: 38,400 bits
- Embedded Block RAM (EBR): 81,920 bits
- Total RAM: 120,320 bits combined
- RAM Configuration: Flexible dual-port and single-port options
I/O and Connectivity
- User I/O: 158 pins
- SelectI/O Technology: Multiple I/O standard support
- Voltage Levels: Support for 3.3V, 2.5V, 1.8V, and mixed-voltage designs
- High-Speed I/O: Dedicated clock and routing resources
Physical Characteristics
- Package Type: 240-Pin PQFP (Plastic Quad Flat Pack)
- Package Size: 32mm ร 32mm
- Pin Pitch: 0.8mm
- Mounting Type: Surface Mount Technology (SMT)
- Package Height: 3.4mm maximum
Electrical Specifications
- Core Voltage: 1.8V ยฑ 5% (1.71V ~ 1.89V)
- I/O Voltage: 1.8V to 3.3V (depending on I/O bank configuration)
- Maximum Operating Frequency: 250MHz
- Power Consumption: Optimized for low-power applications
- Static Power: Industry-leading low standby current
Environmental Specifications
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial Grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Thermal Resistance (ฮธJA): Specified for thermal management
- Humidity: 85% relative humidity (non-condensing)
- Vibration: MIL-STD-810 compliant options
Advanced Features
- 0.18ฮผm CMOS Technology: 6-layer metal process for enhanced performance
- Place-and-Route Optimized: Architecture designed for efficient implementation
- Clock Management: Dedicated global clock networks and delay-locked loops
- Configuration Options: Multiple programming modes including JTAG and slave serial
2. Pricing Information
Market Analysis
The XCV100E-6PQ240I is readily available through multiple authorized distributors with stock levels of 5000+ pieces reported by major suppliers. As an industrial-grade component with extended temperature range, pricing reflects the enhanced testing and qualification requirements.
Pricing Structure
- Industrial Premium: Typically 15-30% premium over commercial grade variants
- Volume Discounts: Available for quantities of 100+, 500+, and 1000+ units
- Long-term Agreements: Preferred pricing for multi-year supply contracts
- Quick-turn Availability: Stock quantities available for immediate shipment
Cost Factors
- Temperature Screening: Additional testing for -40ยฐC to +100ยฐC operation
- Enhanced Reliability: Extended burn-in and quality assurance testing
- Market Demand: Industrial automation and aerospace applications drive premium
- Legacy Support: Continued availability despite newer FPGA families
Purchasing Channels
- Authorized Distributors: OMO Electronic, Xilinx-ADM, and major component suppliers
- Direct from AMD Xilinx: For high-volume OEM applications
- Franchise Partners: Regional distributors for local support
- Broker Networks: Secondary market for legacy design support
Current Pricing: Contact authorized distributors for RFQ-based pricing due to market volatility and quantity-dependent structures.
3. Documents & Media
Primary Documentation
- Device Datasheet: Virtex-E FPGA Family Complete Specifications (DS003)
- Package Information: 240-Pin PQFP mechanical drawings and thermal data
- Speed Files: Timing models for design implementation and verification
- Pin Configuration: Complete pinout diagrams and I/O bank assignments
Design Resources
- Application Notes: Industrial design guidelines and best practices
- Reference Designs: Proven implementations for common applications
- Migration Guides: Upgrade paths from older FPGA families
- Power Analysis: Consumption models for thermal and power system design
Technical Documentation
- User Guides: Comprehensive development and implementation tutorials
- Design Methodology: Optimization techniques for Virtex-E architecture
- Constraint Files: Timing and placement constraints for synthesis tools
- Programming Guides: Configuration memory and bitstream generation
Quality and Reliability
- Qualification Reports: Industrial temperature testing and validation data
- Reliability Analysis: MTBF calculations and failure rate data
- Application Bulletins: Field deployment considerations and guidelines
- Errata Documentation: Known issues, limitations, and workarounds
Multimedia Resources
- Block Diagrams: System architecture and integration examples
- Thermal Analysis: Heat dissipation patterns and cooling recommendations
- Layout Guidelines: PCB design rules for signal integrity
- Video Tutorials: Implementation examples and tool demonstrations
4. Related Resources
Development Environment
- Vivado Design Suite: Modern development platform with advanced synthesis
- ISE Design Tools: Legacy support for existing Virtex-E projects
- WebPACK: Free development tools for smaller designs
- ChipScope Pro: In-system debugging and verification tools
IP and Libraries
- Core Generator: Pre-verified IP blocks for common functions
- DSP Blocks: Signal processing primitives and algorithms
- Memory Controllers: Interface IP for external memory systems
- Communication Protocols: Ethernet, PCIe, and serial interface cores
Development Hardware
Compatible evaluation and development platforms:
- ML300 Series: Dedicated Virtex-E development boards
- Custom Evaluation Kits: Application-specific development platforms
- Third-Party Boards: Compatible solutions from design partners
- Prototyping Systems: Modular development environments
Support Ecosystem
- Technical Forums: Community-driven knowledge sharing and support
- Application Engineers: Direct support from AMD Xilinx field teams
- Training Programs: Online and instructor-led FPGA design courses
- Design Services: Third-party consulting and implementation support
Migration and Alternatives
- Pin-Compatible Options: Different speed grades and package variants
- Temperature Variants: Commercial and extended commercial alternatives
- Upgrade Path: Migration to newer Xilinx FPGA families
- Competitive Alternatives: Cross-reference for multi-sourcing strategies
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Directive: Fully compliant with RoHS 2011/65/EU and 2015/863 amendments
- Lead-Free Processing: Available with lead-free solder and package materials
- REACH Regulation: Compliant with European chemical safety requirements
- WEEE Directive: Supports responsible end-of-life recycling and disposal
Industrial Certifications
- IEC 61000: Electromagnetic compatibility (EMC) compliance
- ISO 9001: Manufacturing quality management certification
- UL Recognition: Safety certification for commercial and industrial use
- CE Marking: European conformity marking for applicable directives
Environmental Classifications
- Moisture Sensitivity Level (MSL): Level 3 classification per J-STD-020
- Peak Reflow Temperature: 260ยฐC lead-free soldering compatibility
- Storage Requirements: Dry pack shipping with moisture barrier bags
- Handling Procedures: ESD-sensitive device requiring proper handling protocols
Export Control Information
- ECCN Classification: 3A001.a.7 – Export Control Classification Number
- HTS Code: 8542.31.0001 – Harmonized Tariff Schedule classification
- Country of Origin: Various manufacturing locations with proper documentation
- Trade Compliance: Adherence to international export/import regulations
Quality and Reliability Standards
- Industrial Grade Testing: -40ยฐC to +100ยฐC operational temperature validation
- Extended Qualification: Enhanced screening for high-reliability applications
- AEC-Q100: Available with automotive industry qualification
- MIL-STD Compliance: Military standard testing options for defense applications
Packaging and Shipping
- Anti-Static Protection: ESD-safe packaging with proper grounding
- Moisture Control: Dry pack with humidity indicator cards
- Temperature Monitoring: Cold chain management for temperature-sensitive shipments
- Traceability: Lot tracking and chain of custody documentation
Conflict Minerals Compliance
- 3TG Reporting: Tin, tantalum, tungsten, and gold sourcing transparency
- Responsible Sourcing: Supply chain auditing for conflict-free materials
- Due Diligence: Comprehensive supplier verification and documentation
- Annual Reporting: SEC conflict minerals reporting compliance
Applications
The XCV100E-6PQ240I excels in demanding applications requiring:
Industrial Automation
- Process Control: Real-time control systems for manufacturing
- Motor Drives: High-performance servo and inverter control
- Sensor Fusion: Multi-sensor data processing and analytics
- Safety Systems: Critical control and monitoring applications
Transportation Systems
- Railway Signaling: Train control and communication systems
- Automotive Electronics: Engine management and safety systems
- Aerospace Avionics: Flight control and navigation systems
- Marine Electronics: Navigation and communication equipment
Telecommunications Infrastructure
- Base Station Controllers: Wireless infrastructure equipment
- Network Switches: High-speed data routing and switching
- Protocol Processing: Communication protocol implementation
- Test Equipment: Network analysis and measurement instruments
Summary
The XCV100E-6PQ240I represents robust, industrial-grade FPGA technology from AMD Xilinx’s Virtex-E family, specifically designed for harsh environment applications requiring extended temperature operation. With its -40ยฐC to +100ยฐC operating range, 2700 logic elements, and 158 I/O pins, this device provides exceptional reliability and performance for mission-critical applications. Comprehensive development tool support, extensive documentation, and full environmental compliance make the XCV100E-6PQ240I an ideal choice for industrial automation, transportation, and telecommunications applications where reliability cannot be compromised.
For current pricing, availability, and technical support, contact authorized AMD Xilinx distributors or submit an RFQ through qualified industrial component suppliers. Industrial-grade components typically require lead times of 12-16 weeks for large volume orders.
