XCV300E-6FGG256C – Xilinx Virtex-E Compact Commercial FPGA Product Description

1. Product Specifications

Core Features

• Manufacturer: Xilinx (now AMD)
• Part Number: XCV300E-6FGG256C
• Family: Virtex-E 1.8V FPGAs
• Speed Grade: -6 (Cost-optimized performance grade)
• Temperature Grade: Commercial (C-TEMP)
• Technology Node: 0.18μm 6-layer metal CMOS process
• Series: Virtex®-E

Logic Resources & Performance

• System Gates: 411,955 gates
• Logic Gates: 82,944K gates
• Logic Elements/Cells: 6,912 cells
• LABs/CLBs: 1,536 Configurable Logic Blocks
• Total RAM Bits: 131,072 bits embedded block RAM
• Number of I/O: 176 user I/O pins
• Maximum Frequency: 357MHz internal performance (speed grade -6)

Package & Physical Specifications

• Package Type: 256-Pin FGG (Fine-pitch Grid Array)
• Package Designation: FGG256 (Fine-pitch Grid Array with 256 pins)
• Package Dimensions: Compact FBGA footprint
• Pin Count: 256 pins
• Mounting Type: Surface Mount
• Ball Pitch: Fine-pitch for high-density applications

Electrical Specifications

• Core Voltage (VCCINT): 1.71V ~ 1.89V (Nominal 1.8V)
• I/O Voltage (VCCIO): Configurable based on I/O standards
• Operating Temperature Range: 0°C ~ 85°C (Commercial grade)
• Power Consumption: Optimized low-power 1.8V operation
• Voltage Supply Range: 1.71V ~ 1.89V

Compact Package Advantages

• Space Efficiency: High logic density in minimal PCB footprint
• Fine-Pitch Design: Maximum pin utilization in compact form factor
• Cost-Effective Assembly: Standard FBGA assembly processes
• Thermal Performance: Efficient heat dissipation through ball grid array
• Signal Integrity: Short interconnects for improved electrical performance

2. Price Information

Market Status & Availability

• Product Status: Obsolete/Legacy component (End-of-Life)
• Current Availability: Good stock levels from multiple distributors
• Stock Status: Active inventory available:
  • Ovaga Technologies: Large stock available
  • OMO Electronic: Stock available, can ship immediately
  • Various distributors: Multiple sourcing options

Cost-Effective Positioning

• Speed Grade Advantage: Lower cost compared to -7 and -8 speed grades
• Commercial Grade Savings: Reduced cost vs industrial temperature variants
• Compact Package Benefits: Lower assembly costs due to smaller footprint
• Legacy Pricing: Competitive pricing for existing design support

Pricing Strategy

• Performance-Cost Optimization: 357MHz performance at significant cost savings
• Volume Availability: Good stock levels enable competitive volume pricing
• Commercial Grade Economics: Cost-effective for controlled environment applications
• Package Efficiency: Cost benefits from compact, standard FBGA assembly

Sourcing Recommendations

• Primary Sources: Multiple distributors with confirmed stock availability
• Secondary Sources: Electronic component brokers with verified inventory
• Quality Assurance: Original AMD Xilinx parts with full traceability
• Warranty Coverage: Standard 1-year warranty from authorized distributors

3. Documents & Media

Technical Documentation

• Primary Datasheet: Xilinx DS003 – Virtex-E 1.8V Field Programmable Gate Arrays
• 99-Page Datasheet: Comprehensive technical specifications available
• User Guide: Virtex-E FPGA Complete Data Sheet and User Guide
• Configuration Manual: Virtex-E Configuration User Guide
• Package Documentation: 256-Pin FGG FBGA package specifications

Design Resources

• Pinout Information: Detailed 256-Pin FGG FBGA pinout diagrams
• Configuration Details: Pinout configuration on page 28 and 69 of datasheet
• Package Outline: Dimensional data on page 70 of datasheet
• Part Numbering: System details on pages 2-5 of datasheet
• IBIS Models: Signal integrity simulation models for compact package design

Compact Design Documentation

• PCB Layout Guidelines: Design rules for fine-pitch FBGA mounting
• Assembly Instructions: SMT assembly guidelines for 256-pin FBGA
• Thermal Management: Heat dissipation strategies for compact packages
• Signal Integrity: Design practices for high-density routing
• Package Models: Thermal and electrical package models

Speed Grade Specific Resources

• Timing Specifications: Speed grade -6 specific timing characteristics (357MHz)
• Performance Optimization: Guidelines for cost-effective design implementation
• Power Analysis: Speed grade -6 power consumption in commercial conditions
• Application Guidelines: Optimal use cases for moderate-speed applications

Media & Support Files

• Product Images: High-resolution package photos and dimensional drawings
• Block Diagrams: Internal architecture and signal flow diagrams
• Performance Charts: Speed grade comparison and commercial temperature operation
• Application Examples: Commercial application reference designs

4. Related Resources

Development Tools & Software

• Primary Development Suite: ISE Design Suite (Recommended for Virtex-E)
  • ISE Foundation or ISE WebPack
  • XST (Xilinx Synthesis Technology)
  • Place and Route (PAR) tools with speed grade -6 timing optimization
  • TRCE timing analyzer with commercial temperature models
• Configuration Tools: iMPACT programming software
• Simulation Support: ModelSim, ISim integration with FGG256 models

Hardware Development Resources

• Programming Hardware:
  • Xilinx Platform Cable USB/Parallel
  • JTAG programming interfaces for FBGA packages
  • Boundary scan test equipment for 256-pin FBGA
• Development Platforms: Limited availability (legacy products)
• Socket Solutions: 256-pin FBGA socket adapters for prototyping

Compatible Components

• Configuration Memory:
  • Xilinx Serial PROMs for commercial applications
  • Platform Flash configuration devices
  • External SPI flash memory solutions
• Power Management:
  • Commercial-grade 1.8V core voltage regulators
  • Compact power supply solutions for space-constrained designs
• Clock Management: Standard oscillators for 357MHz commercial applications

Compact Design Considerations

• PCB Layout: High-density routing strategies for FGG256 package
• Assembly Process: SMT assembly best practices for fine-pitch FBGA
• Thermal Management: Heat dissipation in space-constrained commercial designs
• Signal Integrity: Managing trace routing in compact form factors
• Cost Optimization: Balancing performance with budget constraints

Modern Migration Path

Recommended Alternatives for New Designs:

• Artix-7 Series: XC7A35T, XC7A50T (Higher performance, compact packages)
• Spartan-7 Series: XC7S25, XC7S50 (Cost-optimized with compact form factors)
• Zynq-7000: XC7Z010, XC7Z020 (For embedded processing in compact designs)
• MAX 10: Intel alternative for cost-sensitive compact applications

Technical Support Resources

• Legacy Support: Technical assistance for compact FPGA applications
• Migration Consulting: Guidance for transitioning to current families
• Community Resources: FPGA forums and compact design communities
• Training Materials: Compact FPGA design optimization and cost-effective practices

5. Environmental & Export Classifications

Environmental Compliance

• RoHS Status: Contains Lead / RoHS Non-Compliant (Legacy product)
• Lead-Free Availability: Limited lead-free versions may be available
• REACH Regulation: EU REACH regulation compliance required
• Environmental Standards: Commercial electronic component classification

Temperature & Operating Conditions

• Operating Temperature: 0°C ~ 85°C (Commercial grade specification)
• Commercial Grade Applications: Optimized for controlled environment use
• Storage Temperature: -65°C to +150°C
• Relative Humidity: 5% to 95% non-condensing
• Thermal Characteristics: Efficient heat dissipation through FBGA design

Reliability & Quality Standards

• Quality Grade: Commercial standard qualification
• ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
• Reliability Testing: JEDEC standard commercial qualification
• Package Reliability: FBGA package with proven assembly reliability
• Qualification Standards: Commercial temperature cycling and stress testing

Export Control & Classifications

• ECCN (Export Control Classification Number): 3A001.a.7.a
• HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
• Country of Origin: Manufacturing location dependent
• Export Restrictions: Subject to US Export Administration Regulations (EAR)

Packaging & Handling

• Package Standards: Surface mount FBGA with fine-pitch ball grid
• Anti-Static Requirements: ESD protective packaging mandatory
• Moisture Control: Dry pack shipping in moisture barrier bags
• Physical Protection: Anti-static handling for FBGA packages
• Traceability: Full lot traceability for commercial applications

Commercial Applications

Ideal Applications:

• Consumer electronics (space-constrained designs)
• Office and commercial equipment
• Telecommunications (commercial environments)
• Industrial equipment (controlled environments)
• Educational and development platforms
• Compact embedded systems

Environmental Advantages:

• Commercial temperature range (0°C to 85°C)
• Compact form factor for space-constrained applications
• Cost-effective for controlled environment designs
• Efficient thermal management through FBGA package

Compliance Certifications

• ISO Standards: Manufacturing under ISO 9001 quality systems
• IPC Standards: Package and assembly standards compliance
• JEDEC Standards: Commercial grade electronic component specifications
• Assembly Standards: Standard FBGA assembly process compatibility

Disposal & Environmental Impact

• WEEE Directive: Compliance with waste electrical equipment directive
• Conflict Minerals: Responsible sourcing compliance where applicable
• Recycling Programs: Electronic waste recycling participation
• Material Content: Silicon, copper, lead (legacy), and standard materials
• Environmental Impact: Commercial-grade environmental specifications

Regional Compliance

• North America: FCC compliance for commercial electronic equipment
• Europe: CE marking requirements for commercial equipment
• Asia Pacific: Local commercial equipment regulations
• Commercial Standards: Meets commercial electronics environmental requirements

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Compact Commercial FPGA Notice: The XCV300E-6FGG256C represents an excellent choice for space-constrained commercial applications requiring moderate performance at cost-effective pricing. The fine-pitch 256-pin FBGA package provides optimal logic density in a compact footprint, making it ideal for applications where board space is at a premium. The speed grade -6 delivers 357MHz performance at significant cost savings compared to higher speed grades, while the 176 I/O pins provide adequate connectivity for many commercial designs. The commercial temperature range (0°C to 85°C) is perfect for office, consumer, and controlled industrial environments. This legacy product offers proven technology with good availability from multiple distributors, making it an excellent choice for existing designs and cost-sensitive applications requiring compact form factors. For new designs, migration to current FPGA families with modern development tools and enhanced performance is recommended.