1. Product Specifications
Core Technical Specifications
- Part Number: XCV600E-6BG560I
- Manufacturer: AMD Xilinx (formerly Xilinx)
- Product Family: Virtex-E 1.8V FPGAs
- Technology Node: 0.18μm CMOS process
- Temperature Grade: Industrial (“I” suffix)
Logic Resources
- Logic Gates: 985,882 gates
- Logic Cells: 15,552 cells
- Total RAM Bits: 294,912 total RAM bits
- Configurable Logic Blocks (CLBs): High-density programmable logic
- Maximum Operating Frequency: High-speed operation optimized for industrial applications
Package Information
- Package Type: Ball Grid Array (BGA)
- Pin Count: 560 pins
- Package Code: BG560
- I/O Pins: 404 I/O pins
- Package Style: 560-LBGA Exposed Pad, Metal
- Mounting Type: Surface Mount Technology (SMT)
- Speed Grade: -6 (Commercial speed grade)
Environmental Specifications
- Operating Temperature Range: -40°C to 100°C (TJ) – Industrial Grade
- Storage Temperature: Extended range for harsh environments
- Thermal Design: Exposed pad metal package for excellent thermal dissipation
- Package Design: Metal package construction for enhanced durability
Key Features
- Industrial Temperature Rating: Qualified for -40°C to 100°C operation
- High I/O Density: 404 user I/O pins for extensive connectivity
- Thermal Management: Exposed pad design for efficient heat dissipation
- Robust Construction: Metal package for enhanced reliability
- Legacy Support: Continued availability for existing design maintenance
2. Pricing Information
Current Market Availability
The XCV600E-6BG560I is available through multiple distributors despite its obsolete status, with significant stock levels maintained for legacy system support.
Stock Availability
- High Volume Stock: Multiple distributors report substantial inventory (23,727+ pieces available)
- Immediate Availability: Stock available for immediate shipment
- Global Distribution: Available through international distributor networks
- Quality Assurance: 100% original and genuine components with quality guarantees
Pricing Characteristics
- Legacy Product Pricing: Pricing influenced by obsolete status and limited production
- Volume Discounts: Quantity breaks available for bulk purchases
- Price Fluctuation: Market prices update periodically within 24-hour cycles
- Quote Validity: Typical quotation validity of 5 days due to market volatility
Ordering Considerations
- Lead Times: Immediate shipment for in-stock items
- Minimum Order Quantities: Varies by distributor, single-unit purchases often available
- Authentication: Verify component authenticity through authorized channels
- Warranty Coverage: 365-day warranty offered by select distributors
Payment and Shipping
- Payment Methods: Wire Transfer, PayPal, Credit Cards, Western Union, and other international payment options
- Shipping Options: DHL, UPS, FedEx, TNT, and registered mail services
- International Shipping: Global distribution with proper export documentation
3. Documents & Media
Technical Documentation
- Virtex-E Family Datasheet: Comprehensive technical specifications and electrical characteristics
- Package Information: Detailed 560-LBGA package drawings and mechanical specifications
- Pin Configuration Guide: Complete BG560 pinout diagrams and signal descriptions
- Thermal Characteristics: Junction temperature specifications and thermal management guidelines
Design Resources
- Application Notes: Industrial application design guidelines and best practices
- Reference Designs: Historical implementation examples for industrial systems
- Migration Documentation: Transition guides for obsolete product replacement
- Quality Documentation: Certificate of conformance and test reports
Development Tools
- ISE Design Suite: Legacy development environment compatibility
- Programming Tools: JTAG configuration and programming interface support
- Simulation Models: FPGA timing and behavioral models for design verification
- IP Core Support: Compatible intellectual property cores for accelerated development
Compliance Documentation
- Environmental Reports: RoHS non-compliance documentation and material content
- Export Control: ECCN classification and export licensing requirements
- Quality Certifications: ISO quality system certifications and traceability
- Handling Guidelines: ESD protection and moisture sensitivity handling procedures
4. Related Resources
Legacy Development Support
- ISE Design Tools: Primary development environment for Virtex-E family
- Legacy IP Cores: Historical intellectual property libraries
- Programming Hardware: Compatible JTAG cables and programming interfaces
- Technical Support: Limited technical support for existing designs
Package Alternatives
- XCV600E-6BG560C: Commercial temperature grade variant
- Related Variants: Other BG560 package options within Virtex-E family
- Pin-Compatible Options: Alternative devices with similar pinout configurations
- Capacity Alternatives: XCV300E, XCV400E, XCV800E, and XCV1000E family members
Migration Pathways
- Current Generation FPGAs: Modern AMD Xilinx alternatives for new designs
- Kintex-7 Family: Higher performance migration options
- Artix-7 Series: Cost-effective alternatives for industrial applications
- Zynq UltraScale+: System-on-chip solutions for advanced embedded applications
Technical Resources
- Application Engineering: Limited support for legacy design maintenance
- Community Support: User forums and knowledge bases for troubleshooting
- Third-Party Services: Independent technical support and component-level services
- Replacement Services: Component matching and substitute recommendation services
Industrial Applications
Primary Use Cases:
- Automotive Electronics: Engine control systems and automotive communication interfaces
- Aerospace Systems: Avionics equipment requiring industrial temperature operation
- Defense Applications: Military equipment and ruggedized electronic systems
- Industrial Automation: Process control systems and factory automation equipment
- Medical Equipment: Medical devices requiring industrial-grade reliability
- Test and Measurement: Instrumentation requiring wide temperature operation
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS non-compliant due to lead content in package materials
- Lead Content: Contains lead in solder materials and package construction
- REACH Compliance: Subject to EU chemical safety requirements for lead-containing products
- Environmental Impact: Requires proper e-waste disposal procedures
- Material Declaration: Complete material content documentation available
Industrial Temperature Rating
- Operating Range: -40°C to 100°C junction temperature (TJ)
- Storage Temperature: Extended storage temperature range for harsh environments
- Thermal Cycling: Qualified for industrial temperature cycling requirements
- Thermal Management: Exposed pad design for enhanced thermal performance
- Reliability Testing: Extensive qualification testing for industrial applications
Package and Handling Requirements
- Moisture Sensitivity: Standard moisture sensitivity level requirements
- ESD Protection: Electrostatic discharge (ESD) protection during handling and assembly
- Storage Conditions: Controlled humidity and temperature storage requirements
- Assembly Guidelines: Surface mount assembly recommendations for 560-LBGA package
- Quality Control: Pre-shipment inspection and quality verification procedures
Export Control Classifications
- ECCN Classification: Export Control Classification Number per US regulations
- USHTS Code: United States Harmonized Tariff Schedule classification
- TARIC Code: European customs tariff classification
- Export Restrictions: Potential restrictions for certain end-use applications
- Documentation Requirements: Proper export documentation for international shipments
Manufacturing and Quality
- Obsolete Status: Product marked as obsolete with limited manufacturing support
- Quality Assurance: Maintained quality standards for remaining inventory
- Traceability: Manufacturing lot traceability for quality control
- Testing Standards: Standard electrical and functional testing procedures
- Packaging Standards: Anti-static packaging with proper component protection
Regulatory Compliance
- Safety Standards: Compliance with applicable electrical safety standards
- Automotive Qualification: Suitable for automotive electronics applications
- Military Standards: Compatible with military and aerospace qualification requirements
- Medical Device Compatibility: Suitable for medical equipment applications
- Industrial Standards: Compliance with industrial automation and control system requirements
Industrial Applications and Design Considerations
Target Applications
The XCV600E-6BG560I is specifically designed for industrial applications requiring:
Harsh Environment Operation:
- Temperature extremes from -40°C to +100°C
- Vibration and shock resistance
- Extended operational lifetime requirements
- High reliability in critical applications
System Integration:
- 404 I/O pins for extensive system connectivity
- High-speed signal processing capabilities
- Real-time control and monitoring systems
- Interface with industrial communication protocols
Design Advantages
- Industrial Temperature Range: Qualified for extreme temperature applications
- Thermal Performance: Exposed pad package for superior heat dissipation
- High I/O Count: Extensive connectivity for complex industrial systems
- Proven Architecture: Mature Virtex-E architecture with established design methodologies
- Legacy Support: Continued availability for maintenance and production support
Migration Considerations
For new designs, consider modern alternatives that offer:
- Improved Performance: Higher logic density and operating frequencies
- Lower Power Consumption: Advanced process technologies for reduced power
- Enhanced Features: Modern I/O standards and integrated features
- Long-Term Support: Extended product lifecycle and development tool support
Summary
The XCV600E-6BG560I represents a robust industrial-grade FPGA solution from Xilinx’s Virtex-E family, specifically designed for applications requiring operation in harsh environmental conditions. With its industrial temperature rating of -40°C to +100°C, 404 I/O pins, and proven architecture, this device serves critical roles in automotive, aerospace, defense, and industrial automation applications.
While marked as obsolete, the device remains available through multiple distributors with substantial stock levels, ensuring continued support for existing designs and legacy systems. The exposed pad metal package provides excellent thermal management, making it suitable for high-performance applications in challenging environments.
For new designs, customers should evaluate current-generation AMD Xilinx FPGA families that offer superior performance, power efficiency, and long-term support while maintaining compatibility with industrial requirements. The comprehensive migration resources and development tools available ensure smooth transition paths from legacy Virtex-E designs to modern programmable logic solutions.
