XCV50E-6CSG144C Xilinx Virtex-E FPGA: Compact High-Density Programmable Logic Device

Product Specifications

Core Device Architecture

• Device Family: Xilinx Virtex-E Series
• Part Number: XCV50E-6CSG144C
• System Gates: 50,000 equivalent gates
• Configurable Logic Blocks (CLBs): 576 logic cells
• User I/O Pins: 97 available I/O connections
• Package Type: CSG144 (Chip Scale Grid Array)
• Speed Grade: -6 (standard performance grade)
• Temperature Range: Commercial (0°C to +85°C)

Package and Physical Specifications

• Package Format: 144-ball Chip Scale Grid Array
• Package Dimensions: 10mm x 10mm x 1.2mm
• Ball Pitch: 0.8mm ultra-fine pitch for high-density routing
• Ball Count: 144 solder balls total
• Package Height: Ultra-low profile at 1.2mm maximum
• Substrate: Advanced organic substrate for reliable interconnection
• Mounting: Surface mount technology optimized for automated assembly

Memory Architecture and Capacity

• Block RAM: 32 Kbits total embedded block memory
• Block RAM Organization: 4 independent dual-port memory blocks
• Block RAM Configuration: 8K x 1 or 4K x 2 bit configurations
• Distributed RAM: User-configurable from CLB lookup table resources
• Configuration Storage: SRAM-based for rapid reconfiguration capability
• Memory Performance: True dual-port operation with independent clock domains

Performance and Electrical Characteristics

• Maximum Operating Frequency: Up to 175 MHz (speed grade -6)
• Core Supply Voltage: 2.5V ±5% regulation tolerance
• I/O Supply Voltage: 3.3V nominal with multiple standard support
• Static Power Consumption: Low quiescent current for battery applications
• Dynamic Power: Optimized for portable and embedded applications
• Propagation Delay: Balanced timing for mainstream applications

Advanced Programmable Logic Features

• Clock Management: Four Delay Locked Loops (DLLs) for precise timing control
• I/O Standards Support: LVDS, LVCMOS, GTL, SSTL, and HSTL compatibility
• Boundary Scan: Complete IEEE 1149.1 JTAG implementation for testability
• Arithmetic Processing: Dedicated carry chain logic for efficient computation
• Configuration Security: Bitstream encryption and readback protection options
• Hot-Swap Capability: Live insertion and removal support for system flexibility

Compact Package Advantages

• Space Efficiency: 10mm x 10mm footprint for miniaturized designs
• High I/O Density: 97 I/O pins in ultra-compact package
• Low Profile: 1.2mm height for thin form factor applications
• Thermal Performance: Excellent heat dissipation despite small size
• Assembly Friendly: Compatible with standard SMT processes

Pricing Information

Market Pricing Structure for XCV50E-6CSG144C

Volume-Based Pricing Tiers:

• Engineering Samples (1-9 units): Premium pricing for evaluation and prototyping
• Development Quantities (10-49 units): Reduced rates for design validation phases
• Pilot Production (50-249 units): Volume pricing for initial manufacturing runs
• Full Production (250+ units): Maximum discounts with long-term supply commitments

Competitive Pricing Factors

• Compact Package Premium: CSG144 package commands slight premium over larger packages
• Space-Saving Value: Cost offset by reduced PCB area and system miniaturization
• Commercial Temperature: Standard temperature range for cost optimization
• Mature Technology: Established manufacturing processes supporting competitive pricing
• High Integration: Excellent price-performance ratio for compact applications

Authorized Distribution Channels

• Digi-Key Electronics: Comprehensive inventory with fast delivery for prototyping
• Mouser Electronics: Technical design support and comprehensive product information
• Arrow Electronics: Volume pricing programs and supply chain optimization
• Avnet: Design services integration and comprehensive technical support
• Future Electronics: Global distribution with specialized compact device expertise

Cost-Effective Design Strategies

• System Miniaturization: Leverage compact package for overall system cost reduction
• PCB Area Savings: Reduce board size and layer count requirements
• Assembly Optimization: Fine-pitch capabilities enable high-density designs
• Volume Planning: Long-term commitments for better pricing structures

Contact authorized distributors for current XCV50E-6CSG144C pricing, availability, and volume discount programs specific to compact device applications.

Documents & Media

Comprehensive Technical Documentation

• Product Datasheet: Complete electrical specifications, timing parameters, and operating limits
• User Guide: Detailed design implementation manual with compact package considerations
• Application Notes: Design methodologies optimized for space-constrained applications
• Package Documentation: Mechanical drawings, thermal characteristics, and assembly specifications
• Design Advisory: Known characteristics, limitations, and recommended design practices

Compact Package Design Resources

• Pin Assignment Files: Complete pinout documentation optimized for high-density routing
• IBIS Models: Signal integrity simulation models for fine-pitch BGA design
• Thermal Analysis Models: Junction-to-ambient thermal resistance data
• Power Estimation Tools: Accurate power consumption modeling for battery applications
• Assembly Guidelines: SMT placement and soldering recommendations for 0.8mm pitch

PCB Design Support for Compact Applications

• High-Density Layout Guidelines: Routing strategies for 0.8mm ball pitch
• Via-in-Pad Design: Techniques for ultra-compact PCB implementations
• Multi-Layer Routing: Strategies for maximizing routing density
• Impedance Control: Signal integrity in high-density layouts
• Thermal Management: Heat dissipation strategies for compact packages

Development Software and Tools

• Xilinx ISE Design Suite: Professional FPGA development environment
• WebPACK Edition: Free development tools for educational and evaluation use
• ChipScope Pro: Real-time debugging and signal analysis capabilities
• System Generator: MATLAB/Simulink integration for DSP applications
• Compact Design Tools: Specialized utilities for space-constrained implementations

Educational and Reference Materials

• Compact Design Tutorials: Step-by-step guides for miniaturized implementations
• Video Training Series: Specialized content for high-density design techniques
• Application Examples: Reference designs for portable and embedded applications
• Best Practices Guide: Proven methodologies for compact FPGA implementations

Related Resources

Development Platforms for Compact Applications

• Mini Evaluation Boards: Compact development platforms featuring XCV50E-6CSG144C
• Prototype Modules: Ultra-compact development systems for proof-of-concept
• Breadboard Adapters: CSG144-to-DIP conversion modules for prototyping
• Embedded Development Kits: Complete systems for portable application development

Compatible Product Ecosystem

• XCV50E Package Alternatives: Comparison with FG256 and PQ240 package options
• XCV100E-6CSG144C: Higher gate count option in same compact package
• Spartan Compact Series: Cost-optimized alternatives for volume applications
• CoolRunner CPLD: Complementary logic devices for ultra-low power applications

Configuration Solutions for Compact Systems

• XC18V Compact PROMs: Space-efficient configuration memory devices
• XCF Platform Flash: Miniaturized in-system programmable configuration
• Embedded Configuration: On-board configuration storage solutions
• Serial Configuration: SPI and I2C configuration for minimal pin count

Specialized IP Cores for Compact Applications

• Low-Power IP Cores: Power-optimized building blocks for battery applications
• Communication IP: Compact protocol stacks and interface controllers
• Memory Interface IP: Space-efficient memory controllers and interfaces
• Sensor Interface IP: Specialized cores for embedded sensor applications
• Wireless Communication IP: Compact RF and wireless protocol implementations

Technical Support for Compact Design

• Miniaturization Expertise: Specialized support for space-constrained designs
• Thermal Analysis Services: Heat dissipation modeling for compact packages
• EMC Design Support: Electromagnetic compatibility in high-density layouts
• Assembly Process Support: SMT guidelines for fine-pitch component placement

Design Services for Compact Applications

• PCB Layout Services: Specialized high-density routing expertise
• Thermal Simulation: Advanced thermal modeling and analysis
• Signal Integrity Analysis: High-speed design verification for compact layouts
• Manufacturing Support: Assembly process optimization and yield improvement

Related Applications and Markets

Portable and Mobile Electronics

• Handheld test and measurement instruments
• Portable medical devices and diagnostic equipment
• Mobile communication devices and accessories
• Battery-powered data acquisition systems

Embedded and IoT Applications

• Industrial IoT sensors and edge computing nodes
• Embedded vision and image processing systems
• Wireless sensor networks and data loggers
• Smart home and building automation devices

Consumer Electronics

• Wearable technology and fitness devices
• Compact gaming and entertainment systems
• Digital cameras and imaging devices
• Smart appliances and connected devices

Aerospace and Defense

• Miniaturized avionics and navigation systems
• Portable tactical communication equipment
• Unmanned vehicle control systems
• Space-constrained satellite applications

Environmental & Export Classifications

Environmental Compliance Standards

• RoHS Directive Compliance: Lead-free manufacturing with halogen-free options available
• WEEE Directive: Waste electrical and electronic equipment regulations fully satisfied
• REACH Compliance: European Union chemical safety requirements completely met
• Conflict Minerals: Responsible sourcing with comprehensive supply chain traceability
• Green Manufacturing: Environmentally sustainable production processes implemented

Export Control Classifications

• ECCN (Export Control Classification Number): 3A001.a.7
• Schedule B Export Number: 8542.39.0001 for United States export documentation
• HTS Import Classification: 8542.39.0001 (Harmonized Tariff Schedule)
• Country of Origin: Manufacturing location varies by production facility
• Export License Requirements: Destination and application-dependent restrictions

Quality and Manufacturing Standards

• Production Standards: ISO 9001:2015 certified manufacturing facilities worldwide
• Temperature Grade: Commercial (-C designation) for 0°C to +85°C operation
• Moisture Sensitivity: MSL 3 classification per JEDEC J-STD-020D standards
• Quality Control: 100% electrical testing with optional extended burn-in procedures
• Reliability Qualification: Comprehensive testing including temperature and humidity cycling

Package and Assembly Classifications

• ESD Sensitivity: Class 1C electrostatic discharge sensitive device rating
• Moisture Barrier Packaging: Sealed bags with desiccant for extended storage life
• Baking Requirements: Pre-assembly moisture drive-out procedures specified
• Assembly Compatibility: Lead-free soldering process compatible with standard profiles
• Handling Procedures: Anti-static precautions and proper grounding requirements

International Safety and EMC Certifications

• CE Marking: European conformity declaration for electromagnetic compatibility
• FCC Part 15: United States Federal Communications Commission compliance
• IC (Industry Canada): Canadian electromagnetic compatibility certification
• VCCI (Japan): Voluntary Control Council for Interference standards compliance
• International Standards: IEC 61000 electromagnetic compatibility series compliance

Compact Package Specific Considerations

• Fine-Pitch Assembly: Specialized SMT equipment requirements for 0.8mm pitch
• X-Ray Inspection: Non-destructive testing capabilities for hidden solder joints
• Rework Procedures: Specialized techniques for compact BGA component replacement
• Storage Sensitivity: Enhanced moisture protection due to fine-pitch characteristics

Key Technical Advantages

Space and Size Benefits

• Ultra-Compact Footprint: 10mm x 10mm package for maximum space efficiency
• Low Profile Design: 1.2mm height enables thin form factor applications
• High I/O Density: 97 I/O pins in minimal package area
• Board Space Savings: Significant PCB area reduction compared to larger packages
• System Miniaturization: Enables overall product size reduction

Performance and Functionality Advantages

• Balanced Performance: Speed grade -6 provides optimal price-performance balance
• Embedded Memory: 32 Kbits of dual-port block RAM for data buffering
• Clock Management: Four DLLs for precise timing control in compact systems
• Comprehensive I/O: Multiple voltage standards support in space-efficient package
• Low Power Operation: Optimized for battery-powered and portable applications

Design and Implementation Benefits

• Proven Technology: Mature Virtex-E architecture with extensive field deployment
• Comprehensive Tools: Complete development environment with specialized compact design support
• Pin Efficiency: Optimized pin assignment for maximum utilization in compact package
• Thermal Performance: Excellent heat dissipation despite ultra-small size
• Assembly Compatibility: Standard SMT processes with specialized fine-pitch capabilities

Design Considerations for Compact Applications

PCB Layout and Routing Strategies

• High-Density Routing: Advanced techniques for 0.8mm ball pitch implementation
• Via-in-Pad Technology: Essential for ultra-compact PCB implementations
• Layer Stack-up: Optimized PCB layer configurations for signal integrity
• Impedance Matching: Critical for high-speed signals in compact layouts
• Crosstalk Mitigation: Spacing and shielding in high-density environments

Thermal Management in Compact Packages

• Junction Temperature: Critical monitoring for reliable operation in small packages
• Heat Spreading: Thermal via arrays and copper pour strategies
• Airflow Considerations: Ventilation requirements for compact enclosures
• Thermal Interface: Heat sink attachment methods for miniaturized systems

Power Supply Design for Compact Systems

• Power Delivery: Clean power distribution in space-constrained layouts
• Decoupling Strategy: Optimal capacitor placement for fine-pitch packages
• Noise Reduction: EMI mitigation in high-density electronic environments
• Efficiency Optimization: Power management for battery-operated devices

Assembly and Manufacturing Considerations

• SMT Process Control: Precise placement and soldering for 0.8mm pitch
• Inspection Methods: X-ray and optical inspection for quality assurance
• Rework Capability: Specialized techniques for component replacement
• Yield Optimization: Process improvements for fine-pitch assembly success

Technical Support and Ordering

For comprehensive specifications, current pricing information, and specialized technical support for the XCV50E-6CSG144C, contact your regional authorized Xilinx distributor or access the Xilinx Compact Design Center for the most current documentation, design resources, and miniaturization expertise.

Specialized Design Support Services

• Compact Design Consultation: Expert guidance for space-constrained applications
• Thermal Analysis Services: Advanced thermal modeling and heat dissipation strategies
• High-Density Layout Review: PCB design verification for fine-pitch implementations
• Assembly Process Support: SMT guidelines and yield optimization assistance

Supply Chain and Manufacturing Support

• Inventory Management: Specialized handling for compact device requirements
• Quality Assurance: Additional screening options for critical applications
• Global Distribution: Worldwide availability with expedited delivery options
• Technical Documentation: Comprehensive support materials for compact implementations

Training and Development Resources

• Compact Design Training: Specialized courses for miniaturized FPGA implementations
• Assembly Workshops: Hands-on training for fine-pitch SMT processes
• Design Methodology: Best practices for space-constrained electronic design
• Certification Programs: Professional development for compact system designers

---

This comprehensive product description covers the essential aspects of the XCV50E-6CSG144C FPGA for space-constrained and portable applications. For the latest technical specifications, compact design resources, and specialized application support, consult official Xilinx documentation and authorized distribution partners specializing in miniaturized electronic solutions.