1. Product Specifications
Core Architecture
- Device Family: Spartan-IIE
- Part Number: XC2S150E-6FTG256I
- Logic Cells: 150,000 system gates
- Configurable Logic Blocks (CLBs): 1,728
- Input/Output Blocks: 173 user I/Os
- Speed Grade: -6 (high performance)
- Package Type: 256-pin Fine-Pitch Ball Grid Array (FTBGA)
- Package Dimensions: 17mm ร 17mm
Memory and Storage
- Block RAM: 72 Kbits total
- Distributed RAM: Available through LUT configuration
- Configuration Memory: SRAM-based
- Configuration Modes: Master Serial, Slave Serial, Master Parallel, Slave Parallel, Boundary Scan
Performance Characteristics
- Operating Voltage: 2.5V core, 3.3V I/O
- Maximum Frequency: Up to 200 MHz (speed grade dependent)
- Power Consumption: Low power CMOS technology
- Operating Temperature Range: Industrial grade (-40ยฐC to +85ยฐC)
Connectivity and I/O Features
- Digital Clock Managers (DCMs): 4 DCMs for clock management
- Differential I/O Standards: LVDS, LVPECL support
- Single-Ended I/O Standards: LVCMOS, LVTTL, PCI, GTL+
- Dedicated Carry Logic: Fast arithmetic operations
- Multipliers: Dedicated 18ร18 multipliers
2. Price Information
The XC2S150E-6FTG256I pricing varies based on order quantity, supplier, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability:
- Small Quantity (1-99 units): Contact for quote
- Medium Volume (100-999 units): Volume discounts available
- Large Volume (1000+ units): Competitive pricing with long-term agreements
- Lead Time: Typically 4-12 weeks depending on inventory levels
Note: Prices are subject to change based on market conditions and component availability. Contact authorized distributors for real-time pricing and stock information.
3. Documents & Media
Technical Documentation
- XC2S150E-6FTG256I Datasheet: Complete electrical and mechanical specifications
- Spartan-IIE Family Data Sheet: Comprehensive family overview and features
- Configuration User Guide: Detailed configuration procedures and modes
- Package and Pinout Information: Mechanical drawings and pin assignments
- AC/DC Switching Characteristics: Timing specifications and electrical parameters
Development Tools
- ISE Design Suite: Complete development environment for Spartan-IIE devices
- ChipScope Pro: Integrated logic analyzer for debugging
- CORE Generator: IP core library and customization tools
- Impact: Configuration and programming software
Application Notes
- Clock Management: Best practices for DCM usage and clock distribution
- High-Speed Design: Guidelines for achieving optimal performance
- Power Management: Techniques for minimizing power consumption
- Migration Guide: Upgrading from previous Spartan generations
4. Related Resources
Development Boards and Kits
- Spartan-IIE Starter Kit: Complete development platform with XC2S150E-6FTG256I
- Evaluation Boards: Custom boards for specific application testing
- Reference Designs: Pre-built designs for common applications
Compatible Components
- Configuration Memory: Platform Flash PROMs and SPI Flash devices
- Clock Sources: Crystal oscillators and clock generators
- Power Management: Switching regulators and linear regulators
- Interface Components: Level translators and signal conditioning circuits
Software and IP Cores
- Xilinx IP Cores: DSP, networking, and interface IP blocks
- Third-Party IP: Partner ecosystem solutions
- Reference Designs: Open-source and commercial design examples
- Community Resources: Forums, tutorials, and user-contributed content
Training and Support
- Online Training: Xilinx University Program courses
- Technical Support: Direct access to Xilinx engineering support
- Documentation Portal: Comprehensive online resource library
- Community Forums: Peer-to-peer support and knowledge sharing
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with RoHS directive 2011/65/EU
- REACH Regulation: Compliant with European REACH requirements
- Halogen-Free: Available in halogen-free package options
- Lead-Free: Pb-free solder ball attachment (industrial standard)
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
Operating Conditions
- Temperature Range: -40ยฐC to +85ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Thermal Resistance: ฮธJA = 32ยฐC/W (typical with airflow)
Export and Regulatory Classifications
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized Tariff Schedule (HTS): 8542.39.0001
- Country of Origin: Manufacturing location varies by production facility
- FCC Compliance: Designed for use in FCC Part 15 Class B applications
- CE Marking: Compliant with European electromagnetic compatibility standards
Quality and Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: Extensive qualification per JEDEC standards
- Mean Time Between Failures (MTBF): >1,000,000 hours at 25ยฐC
- Electrostatic Discharge (ESD): Human Body Model >2kV, Machine Model >200V
Packaging and Shipping
- Anti-Static Packaging: Industry-standard ESD protective packaging
- Tape and Reel: Available for automated assembly processes
- Tray Packaging: Alternative packaging for manual handling
- Documentation: Certificate of Compliance and test reports included
The XC2S150E-6FTG256I represents an excellent balance of performance, cost, and environmental responsibility, making it suitable for deployment in diverse applications while meeting stringent regulatory requirements worldwide.
