Product Specifications
Core Architecture
- Device Family: Spartan-II FPGA
- Logic Cells: 300,000 system gates equivalent
- CLB Array: 24 x 24 configurable logic blocks
- Total CLBs: 576 configurable logic blocks
- Logic Cell Count: 6,912 logic cells
- Block RAM: 40 Kbits distributed across multiple blocks
Package Details
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 456 pins
- Package Designation: FG456
- Speed Grade: -6 (commercial temperature range)
- Operating Temperature: 0ยฐC to +85ยฐC
Memory and I/O Features
- Distributed RAM: 110 Kbits
- Block SelectRAM: 40 Kbits organized in 2 blocks of 4K x 4 bits
- Maximum User I/O: 284 pins
- Dedicated Clock Inputs: 4 global clock buffers
- Phase-Locked Loops (PLLs): 4 digital clock managers
Performance Characteristics
- Maximum System Frequency: Up to 200+ MHz
- Power Consumption: Optimized for low-power operation
- Configuration Memory: SRAM-based for fast reconfiguration
- Programming Options: JTAG, slave serial, master serial modes
Pricing Information
The XC2S300E-6FG456C pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing:
- Single Unit: Contact for quote
- Volume Pricing: Available for quantities of 100+ units
- Development Boards: Available separately for prototyping
- Educational Discounts: Available for qualified institutions
Note: Prices subject to change based on market conditions and availability
Documents & Media
Technical Documentation
- Datasheet: XC2S300E complete electrical and timing specifications
- User Guide: Spartan-II FPGA family comprehensive design guide
- Package Information: FG456 pinout diagrams and mechanical drawings
- PCB Design Guidelines: Layout recommendations and routing guidelines
- Configuration Guide: Programming and configuration procedures
Design Resources
- Reference Designs: Sample projects and application notes
- IP Core Library: Pre-verified intellectual property blocks
- Constraint Files: UCF templates for design implementation
- Simulation Models: VHDL and Verilog behavioral models
Software Tools
- ISE Design Suite: Complete development environment
- ChipScope Pro: Integrated logic analyzer for debugging
- EDK: Embedded development kit for processor-based designs
Related Resources
Development Tools
- Spartan-II Development Boards: Complete evaluation platforms
- Programming Cables: USB and parallel cable options
- Debug Tools: ChipScope Pro analyzer and integrated logic analyzer
Compatible Devices
- XC2S200E-6FG456C: Lower-density alternative
- XC2S400E-6FG456C: Higher-density option in same package
- XC2S600E-6FG680C: Larger package variant
Application Areas
- Communications: Protocol processing and packet switching
- Industrial Control: Motor control and sensor interfacing
- Medical Devices: Signal processing and data acquisition
- Automotive: Engine control and safety systems
- Test Equipment: Pattern generation and signal analysis
Support Resources
- Technical Support: Xilinx Answer Database and support forums
- Training: Online courses and certification programs
- Design Services: Third-party design consultation services
- Community: Active user forums and design communities
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European Union RoHS directive requirements
- Lead-Free: Compatible with lead-free soldering processes
- Halogen-Free: Environmentally friendly package materials
- REACH Compliant: Meets European chemical safety regulations
Operating Conditions
- Operating Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 85% non-condensing
- ESD Protection: Human Body Model (HBM) Class 1C
Export Classifications
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- CCATS: Available upon request
- Country of Origin: Manufactured in various Xilinx facilities
- Export License: May be required for certain destinations
Quality Standards
- ISO 9001: Quality management system certified
- Automotive Grade: AEC-Q100 qualified versions available
- Reliability Testing: Extensive qualification and stress testing
- MSL Rating: Moisture Sensitivity Level 3
Package Marking
- Device Code: XC2S300E-6FG456C clearly marked on package
- Date Code: Manufacturing date and lot identification
- Speed Grade: -6 speed grade designation
- Package Type: FG456 package identifier
The XC2S300E-6FG456C represents an excellent balance of performance, features, and cost-effectiveness, making it a preferred choice for engineers developing sophisticated digital systems that require reliable, high-performance FPGA solutions.
