Advanced Thermal Management Solution for High-Performance Electronics
The Copper Coin PCB represents a breakthrough in localized thermal management technology, designed to address critical heat dissipation challenges in modern electronic systems. This innovative solution integrates strategically placed copper coins directly into the PCB substrate, creating highly efficient thermal pathways that dramatically improve heat transfer from hot spots to larger dissipation areas.
Key Features:
Superior Thermal Conductivity – Embedded copper coins provide exceptional thermal conductivity (401 W/mK), creating direct thermal bridges that efficiently channel heat away from critical components like processors, power amplifiers, and high-current switching devices.
Precision Placement Technology – Copper coins are precisely positioned beneath or adjacent to heat-generating components using advanced manufacturing techniques, ensuring optimal thermal coupling and maximum heat extraction efficiency.
Enhanced PCB Integration – Unlike traditional thermal solutions that add bulk or complexity, copper coins are seamlessly integrated into the PCB stackup during manufacturing, maintaining board thickness constraints while delivering superior thermal performance.
Customizable Design – Available in various sizes, thicknesses, and configurations to match specific thermal requirements. Coin dimensions and placement patterns can be optimized for your unique component layout and thermal profile.
Applications:
Perfect for high-power LED arrays, RF amplifiers, automotive electronics, power converters, gaming hardware, telecommunications equipment, and any application where localized hot spots threaten component reliability or system performance.
Technical Specifications:
- Copper purity: 99.9%+ electrolytic copper
- Thickness range: 0.2mm to 2.0mm
- Diameter options: 3mm to 20mm
- Operating temperature: -55ยฐC to +150ยฐC
- Thermal resistance: Significantly reduced compared to standard FR4
- Compatible with standard PCB manufacturing processes
Benefits:
Extends component lifespan, improves system reliability, enables higher power density designs, reduces need for external heat sinks, and provides cost-effective thermal management without compromising PCB real estate.
Transform your thermal challenges into competitive advantages with Copper Coin PCB technology – where precision engineering meets thermal excellence.
