The XCVU095-1FFVB2104I is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ series, engineered for demanding applications requiring exceptional processing power and flexibility. This advanced programmable logic device delivers superior performance for high-bandwidth applications across aerospace, defense, communications, and data center markets.
Product Specifications
The XCVU095-1FFVB2104I features robust specifications that make it ideal for complex digital signal processing and high-speed computing applications:
Core Architecture:
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 914,000
- CLB LUTs: 537,600
- Block RAM: 38.4 Mb total block RAM
- UltraRAM: 360 Mb distributed memory
- DSP Slices: 768 DSP48E2 slices
Package Details:
- Package Type: FFVB2104 (Flip-Chip Fine-Pitch BGA)
- Pin Count: 2104 pins
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Speed Grade: -1 (standard performance)
I/O and Connectivity:
- High-Performance I/O: 520 pins
- High-Range I/O: 156 pins
- Transceivers: 80 GTH transceivers
- PCIe Support: Gen3 x16 and Gen4 x8
- Memory Interfaces: DDR4-2666, DDR3, QDR-IV support
Price
The XCVU095-1FFVB2104I is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities and industrial-grade specifications. Contact authorized Xilinx distributors for current pricing, volume discounts, and availability. Pricing varies based on order quantity, delivery timeline, and regional market conditions.
Documents & Media
Technical Documentation:
- Complete datasheet with electrical characteristics and timing specifications
- Product selection guide and migration documentation
- PCB design guidelines and layout recommendations
- Power estimation tools and thermal management guides
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application examples
- Hardware development kits and evaluation boards
- Programming and configuration guides
Support Materials:
- Errata documents and known issues
- Package outline drawings and mechanical specifications
- Soldering and assembly guidelines
- Quality and reliability reports
Related Resources
Development Tools:
- Vivado Design Suite for synthesis and implementation
- Vitis unified software platform for embedded development
- ChipScope Pro for debugging and verification
- ModelSim simulator for functional verification
Compatible Products:
- Zynq UltraScale+ MPSoCs for hybrid ARM/FPGA solutions
- Kintex UltraScale+ FPGAs for cost-optimized alternatives
- Versal ACAP devices for next-generation adaptive computing
Application Areas:
- 5G wireless infrastructure and beamforming
- Machine learning inference acceleration
- Video processing and broadcast equipment
- High-frequency trading systems
- Radar and electronic warfare applications
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting template available
- Green packaging initiatives supported
Export Control Information:
- ECCN (Export Control Classification Number): Available upon request
- Country of origin: Manufactured in advanced semiconductor facilities
- Export licensing requirements vary by destination country
- Compliance with international trade regulations
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive grade versions available (XCVU095-1FFVB2104E)
- Extended temperature range options for harsh environments
- Comprehensive quality assurance and testing protocols
The XCVU095-1FFVB2104I represents the pinnacle of FPGA technology, combining exceptional performance with industrial-grade reliability for mission-critical applications requiring the highest levels of processing capability and system integration flexibility.
