The XCVU095-3FFVC1517E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, engineered to deliver exceptional performance and integration capabilities for demanding high-end applications. This advanced FPGA combines 940,800 logic cells with 20nm technology in a compact 1517-pin FCBGA package, making it ideal for 400G networking, ASIC design, emulation, and other compute-intensive applications.
1. Product Specifications
Core Technical Specifications
Logic Resources:
- Logic Cells: 940,800 cells
- Family: Virtex UltraScale
- Process Technology: 20nm manufacturing node
- Architecture: Monolithic and SSI (Stacked Silicon Interconnect) technology
Package & Physical Details:
- Package Type: 1517-pin FCBGA (Flip Chip Ball Grid Array)
- Operating Voltage: 1V core supply
- Speed Grade: -3 (high performance)
- I/O Count: 520 I/O pins
- Package Code: FFVC1517E
Memory & DSP Resources:
- Block RAM: High-density on-chip memory
- DSP Slices: Optimized for signal processing applications
- UltraRAM: Next-generation memory technology for reduced BOM costs
Performance Characteristics:
- Serial I/O Bandwidth: Industry-leading performance
- Transceivers: Next-generation high-speed transceivers
- Support: PCIe, 100G Ethernet, 150G Interlaken
- Power Optimization: Advanced power management features
Key Features
The XCVU095-3FFVC1517E delivers breakthrough performance through:
- Advanced Architecture: Utilizes both monolithic and next-generation SSI technology
- High Integration: Maximum system capacity, bandwidth, and performance
- Power Efficiency: Optimized power consumption with multiple power-saving innovations
- Flexible Configuration: Programmable logic for diverse application requirements
- Robust Design: Built for reliability in demanding environments
2. Price
Pricing Information:
- Market pricing for the XCVU095-3FFVC1517E varies based on quantity and supplier
- Volume discounts available for large orders
- Pricing fluctuates with market conditions and availability
- Contact authorized distributors for current pricing and quotations
Cost Considerations:
- High-performance FPGA with premium pricing reflecting advanced capabilities
- Total system cost benefits through integration and performance optimization
- Reduced BOM costs through on-chip UltraRAM memory integration
- Long-term value through extended product lifecycle support
3. Documents & Media
Technical Documentation
Essential Resources:
- Official Datasheet: Comprehensive technical specifications and electrical characteristics
- User Guide: Detailed implementation guidelines and best practices
- Product Brief: Overview of key features and applications
- Packaging & Pinout Guide: Physical specifications and pin assignments
Design Resources
Development Tools:
- Vivado Design Suite: Primary development environment for FPGA design
- IP Catalog: Extensive library of pre-verified IP cores
- Reference Designs: Proven implementations for common applications
- Application Notes: Detailed guidance for specific use cases
Software Support:
- Industry-standard development tools
- Comprehensive simulation and verification environment
- Debugging and optimization utilities
- System-level design methodologies
Multimedia Resources
Educational Content:
- Product overview videos
- Technical webinars and presentations
- Application-specific demonstrations
- Getting started tutorials
4. Related Resources
Development Boards & Kits
Evaluation Platforms:
- Compatible with Virtex UltraScale evaluation boards
- Development kits for rapid prototyping
- Reference designs for common applications
- Starter kits for initial evaluation
Third-Party Solutions:
- Partner ecosystem with specialized boards
- Custom carrier card solutions
- System-on-Module (SoM) options
- Industrial-grade development platforms
Technical Support
Engineering Support:
- Comprehensive technical documentation
- Application engineering assistance
- Design review and optimization services
- Training and certification programs
Community Resources:
- User forums and community support
- Knowledge base and FAQ sections
- Technical blogs and articles
- Industry best practices sharing
Compatible Products
Related FPGA Devices:
- Other Virtex UltraScale family members
- Alternative package options (FFVB1760, FFVA2104)
- Speed grade variations (-1, -2, -3)
- Extended temperature range versions
5. Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- RoHS Compliant: Yes – meets EU RoHS directive requirements
- Lead-Free: Compatible with lead-free soldering processes
- Halogen-Free: Environmentally friendly packaging materials
- REACH Compliant: Meets European chemical safety regulations
Operating Conditions
Temperature Range:
- Commercial Grade: 0ยฐC to +85ยฐC junction temperature
- Industrial Grade: -40ยฐC to +100ยฐC (extended versions available)
- Storage Temperature: -55ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
Export Classifications
Trade Compliance:
- USHTS Code: 8542390001
- TARIC Code: 8542399000
- ECCN: 3A001.a.7.b (Export Control Classification Number)
- Country of Origin: Manufactured in various AMD facilities
Regulatory Certifications:
- CE marking for European markets
- FCC compliance for US markets
- Multiple international safety standards
- Quality management system certifications
Packaging & Handling
Physical Specifications:
- Moisture Sensitivity Level (MSL): Classified according to JEDEC standards
- Packaging Options: Tray packaging standard, tape and reel available
- ESD Protection: Electrostatic discharge sensitive device
- Handling Requirements: Proper ESD precautions required
The XCVU095-3FFVC1517E represents the pinnacle of FPGA technology, combining exceptional performance, advanced features, and comprehensive support to enable breakthrough innovations in high-performance computing applications. Its robust design, extensive documentation, and strong ecosystem support make it the ideal choice for demanding applications requiring the highest levels of performance and reliability.
