1. Product Specifications
Core Architecture
- Family: Xilinx QPro Virtex 2.5V Radiation-Hardened FPGAs
- Part Number: XQVR1000-3CG560I
- Technology Node: 0.22ฮผm CMOS process with 5-layer metal
- Operating Voltage: 2.5V core voltage
- Speed Grade: -3 (industrial temperature range)
Physical Characteristics
- Package Type: CG560 (Ceramic Grid Array)
- Pin Count: 560 pins
- I/O Count: 404 user I/O pins
- Temperature Grade: Industrial (-40ยฐC to +85ยฐC)
- Package Size: BGA (Ball Grid Array) format
Logic Resources
- System Gates: Approximately 1,124,022 gates
- Logic Cells: 27,648 cells
- Block RAM: Multiple embedded memory blocks
- Maximum Frequency: Up to 294MHz
- Radiation Hardening: Total Ionizing Dose (TID) and Single Event Effects (SEE) resistant
Key Features
- Advanced 5-layer metal interconnect architecture
- Optimized for place-and-route efficiency
- High-speed programmable interconnect resources
- Built-in radiation tolerance for space applications
- Compatible with Xilinx development tools
2. Price Information
Pricing Note: The XQVR1000-3CG560I is a specialized radiation-hardened component with pricing that varies based on:
- Quantity Requirements: Volume discounts available for large orders
- Market Conditions: Pricing fluctuates based on supply and demand
- Certification Requirements: Additional costs for specific space/military certifications
- Lead Time: Expedited delivery may affect pricing
Contact Information: For current pricing and availability, please contact authorized Xilinx distributors or electronic component suppliers. Typical pricing ranges for radiation-hardened FPGAs of this caliber start from several thousand dollars per unit.
3. Documents & Media
Official Documentation
- Datasheet: QPro Virtex 2.5V Radiation-Hardened FPGAs Commercial Data Sheet
- User Guide: QPro Virtex Configuration and Programming Guide
- Application Notes: Radiation Effects Characterization Reports
- Pinout Documentation: CG560 Package Pin Assignment Files
Development Resources
- Design Tools: Xilinx Vivado Design Suite compatibility
- IP Cores: Access to Xilinx IP catalog for radiation-hardened applications
- Reference Designs: Space and aerospace application examples
- Simulation Models: SPICE and timing models available
Quality Documentation
- Test Reports: Radiation testing and qualification data
- Reliability Data: Mean Time Between Failures (MTBF) calculations
- Certificate of Conformance: Available upon request
- Traceability Reports: Full manufacturing lot traceability
4. Related Resources
Development Tools
- Xilinx Vivado Design Suite: Complete design environment for synthesis, implementation, and debugging
- ISE Design Tools: Legacy support for older design flows
- ChipScope Pro: Real-time debugging and analysis
- Programming Tools: iMPACT and other configuration utilities
Evaluation Platforms
- Development Boards: Custom evaluation boards available through partners
- Reference Kits: Application-specific starter kits
- Prototyping Solutions: Socket adapters and breakout boards
Technical Support
- Application Engineers: Dedicated support for radiation-hardened designs
- Online Resources: Xilinx Support Portal with knowledge base
- Training Programs: Specialized courses for aerospace applications
- Community Forums: FPGA developer community support
Complementary Products
- Configuration Memory: Radiation-hardened configuration PROMs
- Power Management: Space-qualified power supply solutions
- Interface Components: Radiation-tolerant transceivers and I/O expanders
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Compliance: European chemical regulation conformity
- Conflict Minerals: Certified conflict-free sourcing
- ISO 14001: Environmental management system certified manufacturing
Export Control Classifications
- ECCN: Export Control Classification Number applicable for dual-use technology
- ITAR Status: Subject to International Traffic in Arms Regulations review
- Export License: May require export license for certain destinations
- Country Restrictions: Limited availability in certain countries due to export controls
Quality Standards
- NASA Standards: Compliant with NASA parts selection guidelines
- MIL-STD Qualification: Military standard testing and qualification
- ESA Requirements: European Space Agency approved components list
- QML-Q: Qualified Manufacturers List – Q Level certification
Radiation Specifications
- Total Ionizing Dose (TID): >100 krad(Si) radiation tolerance
- Single Event Upset (SEU): Characterized and tested for space environments
- Single Event Latchup (SEL): LETth >75 MeVยทcmยฒ/mg
- Displacement Damage: Neutron and proton radiation effects characterized
Applications
The XQVR1000-3CG560I is ideally suited for:
- Satellite Systems: Communication, navigation, and earth observation satellites
- Space Exploration: Deep space missions and planetary exploration vehicles
- Defense Systems: Military radar, electronic warfare, and secure communications
- Nuclear Facilities: Control systems in high-radiation environments
- Medical Equipment: Radiation therapy and diagnostic imaging systems
- Research Facilities: High-energy physics experiments and accelerators
Conclusion
The XQVR1000-3CG560I represents the pinnacle of radiation-hardened FPGA technology, combining Xilinx’s proven Virtex architecture with specialized radiation tolerance features. This makes it an essential component for mission-critical applications where reliability in harsh environments is paramount.
For technical specifications, pricing inquiries, or application support, contact your authorized Xilinx distributor or visit the official Xilinx website for the most current information regarding the XQVR1000-3CG560I.
