Product Overview
The XCVU190-2FLGC2104E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Virtex UltraScale series, designed to deliver exceptional performance for demanding applications. This advanced FPGA combines unprecedented power savings with high-performance processing capabilities, making it ideal for data centers, networking equipment, aerospace, defense, and high-performance computing applications.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex UltraScale Series
- Device: XCVU190-2FLGC2104E
- Technology Node: 20nm TSMC Process
- Speed Grade: -2 (Standard Performance)
Logic Resources
- Logic Cells: 2,349,900 cells
- Logic Blocks: 1,074,240 blocks
- System Logic Cells: 150,937,600 equivalent gates
- Maximum Operating Frequency: 725 MHz
Memory and DSP
- Total RAM: 136,090 Kbit
- Block RAM: High-density on-chip memory
- UltraRAM: Advanced memory architecture
- DSP Slices: Optimized for signal processing applications
I/O and Connectivity
- User I/Os: 416 programmable I/Os
- Package: 2104-pin FCBGA (Flip Chip Ball Grid Array)
- Package Code: FLGC2104
- High-Speed Transceivers: GTH and GTY transceivers
- Transceiver Speed: Up to 16.375 Gbps (GTH), 28.21 Gbps (GTY)
Power and Voltage
- Core Supply Voltage: 0.922V to 0.979V
- I/O Supply Voltage: 3.3V
- Clock Management: MMCM (Mixed-Mode Clock Manager), PLL
- Power Optimization: Advanced UltraScale power management
Physical Characteristics
- Package Type: 2104-BBGA, FCBGA
- Mounting Type: Surface Mount
- Operating Temperature: 0ยฐC to 100ยฐC (TJ)
- Pin Count: 2104 pins
Compliance and Standards
- RoHS Status: ROHS3 Compliant
- Environmental Compliance: Lead-free packaging
- Quality Standards: Industrial-grade reliability
2. Pricing Information
Market Positioning
The XCVU190-2FLGC2104E is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities and high-performance specifications.
Pricing Factors
- Volume Discounts: Available for bulk orders
- Lead Time: Standard lead time of 30 weeks from major distributors
- Packaging: Tray packaging for production quantities
- Regional Variations: Pricing may vary by geographic region
Authorized Distributors
- Digi-Key Electronics: Global electronic components distributor
- Newark/element14: Comprehensive electronic design solutions
- Mouser Electronics: Electronic component distributor
- FPGAkey: Specialized FPGA component supplier
- Microchip USA: Semiconductor solutions provider
Note: Contact authorized distributors for current pricing and availability. Prices subject to market conditions and order quantities.
3. Documents & Media
Technical Documentation
- Official Datasheet: Complete technical specifications and electrical characteristics
- User Guide UG575: Package pinout and design guidelines
- Package Files: ASCII and CSV format pinout files
- Application Notes: Design implementation guidelines
- Product Change Notices: Updated specifications and modifications
Design Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Pre-verified intellectual property cores
- Reference Designs: Example implementations and best practices
- Pinout Files: Detailed pin assignment documentation
- CAD Models: 3D models for PCB design integration
Software Tools
- Vivado Design Suite: Synthesis, implementation, and debugging
- Vitis Unified Software Platform: Application development framework
- ChipScope Pro: Real-time debugging and analysis
- ISE Design Suite: Legacy support (limited)
Development Boards
- Evaluation Boards: Available through third-party providers
- Development Kits: ZedBoard, Basys 3, Nexys4-DDR compatible solutions
- Custom Boards: Sundance Solar Express 100 PCIe board
- proFPGA Modules: Professional prototyping solutions
4. Related Resources
Application Areas
- Data Centers: High-performance computing acceleration
- Networking: Optical networking and telecommunications
- Aerospace & Defense: Mission-critical applications
- Financial Trading: Low-latency trading systems
- ASIC Prototyping: Design verification and validation
- Scientific Computing: Research and simulation workloads
Compatible Technologies
- PCIe Gen3: 8-lane host interface support
- CFP4 Optical Modules: High-speed optical networking
- FMC (FPGA Mezzanine Card): Expansion capabilities
- High-Speed Memory: DDR4, HBM integration support
- Serial Protocols: Ethernet, InfiniBand, custom protocols
Development Ecosystem
- Design Communities: Xilinx Developer Forums
- Training Resources: Online courses and tutorials
- Technical Support: AMD Xilinx technical assistance
- Third-Party IP: Extensive library of verified IP cores
- Consulting Services: Professional design services available
Migration and Compatibility
- UltraScale+ Migration: Forward compatibility path
- Legacy Migration: From previous Xilinx FPGA families
- Pin Compatibility: Package migration options
- IP Reuse: Existing design portability
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Directive: Fully compliant with RoHS3 (2015/863/EU)
- REACH Regulation: Compliant with EU chemical safety requirements
- Lead-Free: Environmentally friendly lead-free packaging
- Halogen-Free: Reduced environmental impact materials
- Conflict Minerals: Compliant with conflict minerals regulations
Operating Environment
- Commercial Temperature: 0ยฐC to 85ยฐC ambient
- Junction Temperature: 0ยฐC to 100ยฐC (TJ)
- Humidity: Non-condensing environments
- Altitude: Standard atmospheric pressure ratings
- Vibration/Shock: Industrial-grade mechanical specifications
Export Control Classifications
- ECCN (Export Control Classification Number): Subject to US export regulations
- Country of Origin: Manufactured under AMD Xilinx quality standards
- Export Restrictions: May require export licenses for certain countries
- Technology Transfer: Subject to international trade regulations
Quality and Reliability
- Product Status: Active production status
- Quality Standards: ISO 9001 certified manufacturing
- Reliability Testing: Extensive qualification and stress testing
- Lifecycle Management: Long-term product availability commitment
- Traceability: Full supply chain traceability
Packaging and Shipping
- MSL (Moisture Sensitivity Level): Standard moisture protection
- ESD Protection: Electrostatic discharge safe packaging
- Tray Packaging: Standard production packaging format
- Storage Requirements: Temperature and humidity controlled storage
- Handling Guidelines: Proper handling procedures for sensitive components
Key Benefits of XCVU190-2FLGC2104E
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High Performance: 2.3M+ logic cells with 725 MHz operation
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Advanced Architecture: 20nm UltraScale technology
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Extensive I/O: 416 user I/Os with high-speed transceivers
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Power Efficient: Optimized power consumption
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Industry Compliance: RoHS3 and environmental standards
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Professional Support: Comprehensive development ecosystem
The XCVU190-2FLGC2104E represents the pinnacle of FPGA technology, offering unmatched performance and flexibility for next-generation applications.
