Product Specifications
The XCS30-3PQ240C features a robust architecture built on 90nm process technology, offering an optimal balance of performance, power consumption, and cost-effectiveness. This FPGA incorporates 30,000 system gates with 1,728 logic cells, providing substantial computational resources for complex digital designs.
Key specifications of the XCS30-3PQ240C include:
- Logic Cells: 1,728 configurable logic blocks
- System Gates: 30,000 equivalent gates
- Block RAM: 216 Kbits of distributed memory
- Package Type: 240-pin Plastic Quad Flat Pack (PQFP)
- Speed Grade: -3 (highest performance grade)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- I/O Pins: 173 user I/O pins
- Supply Voltage: 1.2V core, 3.3V I/O
The device supports various I/O standards including LVTTL, LVCMOS, PCI, and differential signaling standards, making the XCS30-3PQ240C highly versatile for interfacing with different system components.
Price
Pricing for the XCS30-3PQ240C varies based on order quantity, distribution channel, and current market conditions. Volume pricing is available for large-scale production requirements. For current pricing information and quantity breaks, contact authorized Xilinx distributors or visit the official Xilinx website. Educational discounts may be available for qualifying institutions and students working with the XCS30-3PQ240C in academic projects.
Documents & Media
Comprehensive documentation supports the XCS30-3PQ240C throughout the entire development cycle. Essential resources include the Spartan-3 FPGA Family Data Sheet, which provides detailed electrical characteristics, timing specifications, and configuration information specific to the XCS30-3PQ240C.
The Spartan-3 FPGA User Guide offers in-depth coverage of architecture details, design considerations, and best practices for implementing designs on the XCS30-3PQ240C. Package and pinout information is available in dedicated packaging guides, ensuring proper PCB layout and signal integrity.
Development tools documentation includes ISE Design Suite tutorials, constraint file templates, and reference designs optimized for the XCS30-3PQ240C. Application notes cover specific implementation topics such as clock management, memory interface design, and power optimization techniques.
Related Resources
The XCS30-3PQ240C integrates seamlessly with Xilinx’s comprehensive development ecosystem. The ISE Design Suite provides complete design entry, synthesis, implementation, and verification capabilities specifically optimized for the XCS30-3PQ240C architecture.
Development boards featuring the XCS30-3PQ240C are available from Xilinx and third-party vendors, offering rapid prototyping capabilities and reference implementations. These boards typically include essential peripherals, clock sources, and I/O interfaces to accelerate development projects.
IP core libraries extend the functionality of the XCS30-3PQ240C with pre-verified designs for common functions such as memory controllers, communication interfaces, and DSP algorithms. The Xilinx IP catalog includes both free and licensed cores compatible with the XCS30-3PQ240C.
Community resources include forums, design contests, and university programs that support learning and innovation with the XCS30-3PQ240C. These platforms provide opportunities to share designs, troubleshoot issues, and collaborate with other engineers working on similar projects.
Environmental & Export Classifications
The XCS30-3PQ240C meets stringent environmental and regulatory standards for commercial and industrial applications. RoHS compliance ensures the device is free from hazardous substances, supporting environmentally responsible manufacturing practices.
Temperature specifications for the XCS30-3PQ240C cover commercial operating ranges, with junction temperature ratings that accommodate various thermal management strategies. The device has been tested and qualified according to JEDEC standards for reliability and long-term operation.
Export classification information for the XCS30-3PQ240C is available through Xilinx export control documentation. Standard commercial FPGAs like the XCS30-3PQ240C typically fall under general commerce classifications, but specific export requirements may vary based on end-use applications and destination countries.
Lead-free packaging options ensure compatibility with modern assembly processes and environmental regulations. The XCS30-3PQ240C packaging meets MSL (Moisture Sensitivity Level) standards for proper handling and storage during manufacturing.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade qualifications where applicable. These certifications demonstrate the reliability and quality standards maintained throughout the XCS30-3PQ240C production process.
The XCS30-3PQ240C represents proven FPGA technology with comprehensive development support, making it an ideal choice for engineers seeking reliable programmable logic solutions for their next-generation designs.
