High-Performance Thermally Conductive PCB Laminate for Power Applications
The Rogers TC350 Enhanced Resin System offers designers a unique combination of low insertion loss and higher thermal conductivity, enabling superior reliability and reduced operating temperatures in high power applications.
Product Overview
TC350 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite designed for use as a printed circuit board substrate. This material is engineered to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss.
Key Technical Specifications
Electrical Properties:
- Dielectric Constant: 3.50 ยฑ 0.05 @ 10 GHz
- Dissipation Factor: 0.0020 @ 10 GHz (typical)
- Thermal Coefficient of Dielectric Constant: -9 ppm/ยฐC (-50ยฐC to 150ยฐC)
Thermal Properties:
- Thermal Conductivity: 0.72-1.00 W/m/K @ 50ยฐC
- Coefficient of Thermal Expansion: 7 ppm/ยฐC (X,Y), 23 ppm/ยฐC (Z)
Physical Properties:
- Density: 2.3 g/cmยณ
- Peel Strength: 7.0 lbs/in (1.2 N/mm)
- UL94 V-0 Flammability Rating
- Lead-Free Process Compatible
Key Benefits
Superior Thermal Management: The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. ย This higher heat transfer within the substrate complements designs using coins, heat sinks or thermal vias to provide designers additional design margin in managing heat.
Enhanced Reliability: Lower operating temperatures and chip-matching thermal expansion characteristics provide better reliability for component attachment prone to solder fatigue, solder softening and joint failure.
Excellent Processing Characteristics: The advanced filler system allows this composite to possess improved drilling performance, resulting in reduced manufacturing costs. TC350 utilizes relatively smooth copper, unlike ceramic hydrocarbons that need to utilize “toothy copper” to achieve acceptable bond.
Applications
TC350 laminates are used in a range of applications including Amplifiers, Combiners, Power Dividers, Couplers and Filters. ย Applicable markets range from Commercial and Consumer to Defense and Aerospace.
Ideal for:
- High-power microwave applications
- Power amplifiers requiring thermal management
- Temperature-sensitive passive components
- RF circuits demanding phase stability
- Industrial heating applications
Manufacturing & Availability
TC350 laminate is supplied with 1/2, 1 or 2 ounce electrodeposited or reverse treat copper on both sides.The material is available in various panel sizes to accommodate multiple circuit layouts and reduce processing costs.
The Rogers TC350โข Enhanced Resin System represents a cost-effective solution for designers requiring high thermal performance, low losses, and reliable processing characteristics in demanding high-frequency applications.
