Product Specifications
Core Architecture
The XC3SD1800A-5FG676I features a robust architecture built on advanced 90nm process technology, delivering superior performance while maintaining low power consumption. This FPGA incorporates dedicated DSP48A slices optimized for multiply-accumulate operations, essential for high-speed signal processing applications.
Key Technical Specifications:
- Logic Cells: 1,800,000 system gates equivalent
- Speed Grade: -5 (high-performance variant)
- Package Type: FG676 Fine-pitch Ball Grid Array
- Temperature Range: Industrial grade (-40ยฐC to +100ยฐC)
- I/O Pins: 502 user I/O pins
- Block RAM: 648 Kbits total block RAM
- DSP Slices: 84 dedicated DSP48A slices
- Clock Management: 8 Digital Clock Managers (DCMs)
- Supply Voltage: 1.2V core, 3.3V/2.5V/1.8V I/O
Performance Characteristics
The XC3SD1800A-5FG676I delivers exceptional processing capabilities with its optimized architecture. The -5 speed grade ensures maximum performance for time-critical applications, while the industrial temperature rating guarantees reliable operation in harsh environments.
Pricing Information
Current Market Pricing for XC3SD1800A-5FG676I:
- Single unit pricing: Contact authorized distributors for current rates
- Volume pricing: Significant discounts available for quantities over 100 units
- Lead time: Typically 12-16 weeks for standard orders
- Availability: In production, available through Xilinx authorized distributors worldwide
Note: Pricing varies based on order quantity, delivery requirements, and market conditions. Contact your local Xilinx representative for detailed quotations.
Documents & Media
Technical Documentation
Essential design resources for XC3SD1800A-5FG676I implementation:
- Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation guidelines and best practices
- Package Information: Detailed pinout diagrams and mechanical drawings
- Speed Files: Timing models for accurate design verification
- Power Estimation Tools: Guidelines for thermal and power analysis
Development Resources
- Reference Designs: Pre-validated application examples
- IP Core Library: Optimized intellectual property blocks
- Software Tools: ISE Design Suite compatibility information
- Application Notes: Implementation-specific guidance documents
Related Resources
Development Tools
The XC3SD1800A-5FG676I integrates seamlessly with Xilinx’s comprehensive development ecosystem:
Software Support:
- Xilinx ISE Design Suite for complete design flow
- ChipScope Pro for real-time debugging
- AccelDSP Synthesis Tool for algorithm optimization
- ModelSim simulation environment compatibility
Hardware Platforms:
- Compatible evaluation boards for rapid prototyping
- Development kits with pre-configured reference designs
- Third-party module options for custom implementations
Companion Devices
Recommended components for system-level designs:
- Power management ICs optimized for Spartan-3A DSP requirements
- High-speed memory interfaces (DDR2, QDR-II)
- Clock generation and distribution solutions
- Configuration memory devices
Environmental & Export Classifications
Environmental Compliance
The XC3SD1800A-5FG676I meets stringent environmental standards ensuring responsible manufacturing and deployment:
Regulatory Compliance:
- RoHS Compliant: Lead-free package construction
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Responsible sourcing certification
- ISO 14001: Environmental management system certified manufacturing
Export Control Classifications
Trade Compliance Information:
- ECCN (Export Control Classification Number): 3A001.a.2.c
- HTS Code: 8542.31.0001
- Country of Origin: Various (check specific lot codes)
- Export License: May be required for certain destinations
Quality Standards
- Automotive Grade: AEC-Q100 qualified variants available
- Military Grade: Extended temperature and screening options
- Quality Management: ISO 9001:2015 certified manufacturing processes
The XC3SD1800A-5FG676I represents a powerful solution for engineers requiring high-performance FPGA capabilities with proven reliability and comprehensive development support. Its combination of advanced DSP features, flexible I/O options, and robust environmental specifications makes it suitable for a wide range of demanding applications across multiple industries.
