The XC3S250E4TQG144C is a high-performance field-programmable gate array (FPGA) from Xilinx’s proven Spartan-3E family, designed to deliver exceptional value for cost-sensitive applications. This versatile FPGA combines advanced functionality with power efficiency, making it an ideal choice for embedded systems, digital signal processing, and prototyping applications.
Product Specifications
The XC3S250E4TQG144C features a robust architecture built on proven 90nm process technology. This FPGA contains 250,000 system gates with 5,888 logic cells, providing ample resources for complex digital designs. The device includes 36 dedicated multipliers and 216 Kbits of block RAM, enabling efficient implementation of DSP algorithms and data buffering applications.
Key specifications of the XC3S250E4TQG144C include 172 user I/O pins in a compact 144-pin TQFP package, operating across a commercial temperature range of 0ยฐC to 85ยฐC. The device supports multiple I/O standards including LVTTL, LVCMOS, and differential signaling options. With a core voltage of 1.2V and I/O voltage compatibility from 1.2V to 3.3V, the XC3S250E4TQG144C integrates seamlessly into diverse system architectures.
The FPGA operates at speeds up to 200 MHz, with dedicated clock management resources including digital clock managers (DCMs) for precise timing control. Internal configuration memory eliminates the need for external configuration devices in many applications, simplifying board design and reducing system cost.
Pricing Information
The XC3S250E4TQG144C offers excellent value positioning within the Spartan-3E family. Pricing varies based on order quantities, with volume discounts available for production quantities. The device typically ranges from $15 to $25 per unit in moderate volumes, making it highly competitive for cost-sensitive applications requiring FPGA functionality.
Educational institutions and development projects may qualify for additional pricing considerations. For current pricing and availability, contact authorized Xilinx distributors or sales representatives, as pricing fluctuates based on market conditions and order volume commitments.
Documents & Media Resources
Comprehensive technical documentation supports the XC3S250E4TQG144C throughout the design cycle. The official datasheet provides detailed electrical specifications, timing parameters, and packaging information essential for system integration. Pin assignment documentation ensures proper board layout and signal routing.
Application notes demonstrate best practices for power management, signal integrity, and thermal considerations specific to the XC3S250E4TQG144C. Reference designs showcase common implementation patterns for communication interfaces, digital signal processing, and control applications.
Development tools include ISE Design Suite compatibility for synthesis, implementation, and debugging. ChipScope Pro analyzer support enables real-time system verification and troubleshooting. IBIS models and simulation libraries facilitate accurate pre-silicon verification and signal integrity analysis.
Related Development Resources
The XC3S250E4TQG144C integrates with Xilinx’s comprehensive development ecosystem. Spartan-3E starter kits provide hands-on evaluation platforms featuring the device alongside common peripherals and interfaces. These development boards accelerate prototyping and proof-of-concept activities.
IP core libraries extend functionality with pre-verified components for memory controllers, communication protocols, and signal processing functions. MicroBlaze soft processor compatibility enables embedded software development within the FPGA fabric. Third-party design services and consulting support are available for complex implementation requirements.
Online communities and forums provide peer support and design examples specific to Spartan-3E applications. Training courses and webinars cover FPGA fundamentals through advanced implementation techniques relevant to XC3S250E4TQG144C projects.
Environmental & Export Classifications
The XC3S250E4TQG144C meets strict environmental compliance standards including RoHS directive compliance for lead-free manufacturing processes. The device carries ECCN (Export Control Classification Number) 3A001.a.2 under U.S. export regulations, requiring appropriate export licensing for certain international destinations.
Operating temperature range spans 0ยฐC to 85ยฐC for commercial grade devices, with extended temperature variants available for industrial applications. The device demonstrates excellent reliability with MTBF ratings exceeding 1 million hours under normal operating conditions.
Moisture sensitivity level (MSL) classification ensures proper handling during assembly processes. Anti-static handling procedures and recommended storage conditions maintain device integrity throughout the supply chain. Conflict minerals compliance documentation supports responsible sourcing requirements for commercial applications.
The XC3S250E4TQG144C represents proven FPGA technology optimized for mainstream applications requiring reliable performance, design flexibility, and cost effectiveness. Its comprehensive support ecosystem and extensive documentation make it an excellent choice for both new designs and legacy system updates requiring modern FPGA capabilities.
