Product Specification
The XC3S1600E-5FGG400C is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3E family, designed to deliver exceptional performance for demanding digital signal processing and embedded applications. This versatile FPGA combines advanced architecture with cost-effective solutions for engineers and developers.
Key Technical Specifications:
Logic Capacity & Architecture:
- Logic cells: 33,192 equivalent gates providing substantial processing power
- System gates: 1.6 million gates for complex digital implementations
- Configurable Logic Blocks (CLBs): 3,688 CLBs for flexible design implementation
- Distributed RAM: 231 Kb for efficient data storage and retrieval
Memory & Storage:
- Block RAM: 648 Kb of dedicated memory blocks
- Memory blocks: 36 dedicated 18Kb block RAMs
- Configuration memory: SRAM-based for fast reconfiguration
I/O and Connectivity:
- Package type: 400-pin Fine-Pitch Ball Grid Array (FBGA)
- I/O pins: 376 user I/O pins for extensive connectivity options
- Voltage compatibility: Multiple I/O standards supported including LVTTL, LVCMOS, SSTL, HSTL
Performance Characteristics:
- Speed grade: -5 (high-performance grade)
- Operating frequency: Up to 326 MHz system clock
- Power consumption: Optimized for low-power applications
- Temperature range: Commercial grade (0ยฐC to +85ยฐC)
Price
The XC3S1600E-5FGG400C offers exceptional value for professional FPGA applications. Pricing varies based on quantity, distribution channel, and current market conditions. For accurate pricing information:
- Small quantities (1-99 units): Contact authorized distributors for current pricing
- Volume pricing (100+ units): Significant discounts available for bulk orders
- Engineering samples: Available through Xilinx direct sales representatives
Contact authorized Xilinx distributors or visit the official Xilinx website for real-time pricing and availability. Educational discounts may be available for qualifying institutions.
Documents & Media
Technical Documentation:
- Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation and design guidelines
- Reference Manual: Detailed architecture and programming information
- Application Notes: Design tips, best practices, and implementation examples
- Errata: Known issues and recommended workarounds
Design Resources:
- Development Board Schematics: Reference designs for rapid prototyping
- Constraint Files: Pre-configured timing and placement constraints
- IP Core Library: Compatible intellectual property blocks
- Tutorial Videos: Step-by-step implementation guides
Software Tools:
- ISE Design Suite: Complete development environment compatibility
- ChipScope Pro: Integrated debugging and analysis tools
- CORE Generator: IP core customization and integration
Related Resources
Development Platforms:
- Spartan-3E Starter Kit: Ideal for learning and prototyping with the XC3S1600E-5FGG400C
- Evaluation boards: Professional development platforms featuring the XC3S1600E-5FGG400C
- Third-party modules: Compatible expansion boards and accessories
Software Compatibility:
- Xilinx ISE Design Suite 14.7: Full development environment support
- Vivado Design Suite: Migration path for future designs
- ModelSim: Simulation and verification tools
- Synopsys Synplify: Advanced synthesis solutions
Application Areas:
- Digital signal processing (DSP) applications
- Communications infrastructure equipment
- Industrial automation and control systems
- Medical imaging and instrumentation
- Automotive electronics and ADAS systems
- Aerospace and defense applications
Technical Support:
- Xilinx Community Forums: Peer-to-peer technical discussions
- Knowledge Base: Searchable technical articles and solutions
- Technical Support: Direct access to Xilinx engineering experts
- Training Resources: Online courses and certification programs
Environmental & Export Classifications
Environmental Compliance:
The XC3S1600E-5FGG400C meets stringent environmental and safety standards:
- RoHS Compliance: Fully compliant with RoHS 2011/65/EU directive
- REACH Regulation: Complies with European chemical safety requirements
- Conflict Minerals: Sourced through responsible supply chain practices
- Lead-free packaging: Environmental-friendly solder and packaging materials
Operating Conditions:
- Operating temperature: 0ยฐC to +85ยฐC (commercial grade)
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
Export Control Classifications:
- ECCN (Export Control Classification Number): Classified under US Department of Commerce regulations
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufacturing location compliance documentation
- Export License Requirements: May require export licenses for certain destinations
Quality Standards:
- ISO 9001: Manufactured under certified quality management systems
- Automotive qualification: AEC-Q100 qualified versions available
- Reliability testing: Comprehensive stress testing and qualification procedures
- Traceability: Full manufacturing lot traceability and documentation
Packaging and Handling:
- Moisture sensitivity: MSL 3 (Moisture Sensitivity Level 3)
- ESD protection: Class 1C electrostatic discharge sensitivity
- Storage requirements: Dry pack storage recommended
- Handling procedures: Anti-static precautions required during handling
The XC3S1600E-5FGG400C represents an excellent choice for engineers seeking reliable, high-performance FPGA solutions with comprehensive development support and environmental compliance. Its robust feature set and proven Spartan-3E architecture make it suitable for a wide range of applications from prototyping to volume production.
