The XC3S1200E-4FGG400C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3E family, designed to deliver exceptional performance for cost-sensitive applications. This versatile programmable logic device combines advanced features with proven reliability, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
Core Architecture
The XC3S1200E-4FGG400C features a robust architecture built on 90nm process technology, delivering optimal power efficiency and performance. This FPGA contains 1,200,000 system gates, providing ample resources for sophisticated digital designs.
Key Technical Specifications:
- Logic Cells: 17,280 logic cells for complex combinational and sequential logic
- Configurable Logic Blocks (CLBs): 1,080 CLBs with four 6-input lookup tables each
- Block RAM: 504 Kb of distributed block RAM for data storage and buffering
- Dedicated Multipliers: 28 embedded 18×18 multipliers for high-speed arithmetic operations
- I/O Pins: 324 user I/O pins with support for multiple voltage standards
- Speed Grade: -4 speed grade ensuring fast signal propagation and timing closure
Package Details
The XC3S1200E-4FGG400C comes in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package, offering excellent thermal performance and signal integrity. The compact form factor makes it suitable for space-constrained applications while maintaining robust electrical characteristics.
Performance Characteristics
- Operating Voltage: 1.2V core voltage with 3.3V, 2.5V, 1.8V, and 1.5V I/O support
- Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
- Maximum Frequency: Up to 300+ MHz internal clock frequency
- Power Consumption: Optimized for low-power applications with advanced power management features
Price Information
The XC3S1200E-4FGG400C offers excellent value for medium-density FPGA applications. Pricing varies based on quantity, distributor, and current market conditions. For accurate pricing information:
- Contact authorized Xilinx distributors for volume pricing
- Check major electronic component suppliers for current stock levels
- Consider long-term availability and lifecycle status for production designs
- Evaluate total cost of ownership including development tools and support
Note: Prices fluctuate based on market demand and supply chain conditions. Contact suppliers directly for current quotations.
Documents & Media
Technical Documentation
Access comprehensive technical resources for the XC3S1200E-4FGG400C:
Essential Documents:
- Spartan-3E FPGA Family Data Sheet with complete electrical specifications
- XC3S1200E-4FGG400C Device Pinout and Package Information
- Spartan-3E FPGA User Guide with configuration and design guidelines
- DC and AC Switching Characteristics documentation
- Package thermal characteristics and mechanical drawings
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Constraint files and reference designs
- Application notes for specific use cases
- Migration guides from other FPGA families
Software and Tools
The XC3S1200E-4FGG400C is supported by Xilinx’s comprehensive development ecosystem, including synthesis, implementation, and debugging tools optimized for Spartan-3E devices.
Related Resources
Compatible Development Boards
Several development platforms support the XC3S1200E-4FGG400C, enabling rapid prototyping and evaluation:
- Xilinx Spartan-3E Starter Kit for initial development
- Third-party evaluation boards with XC3S1200E variants
- Custom development platforms designed around the 400-pin FBGA package
Design Ecosystem
The XC3S1200E-4FGG400C integrates seamlessly with Xilinx’s broader ecosystem:
- IP Cores: Access to Xilinx LogiCORE IP portfolio for common functions
- Reference Designs: Proven implementations for communication, signal processing, and control applications
- Community Support: Active user community and technical forums
- Training Resources: Comprehensive learning materials and certification programs
Alternative Devices
Consider related Spartan-3E family members based on your specific requirements:
- Higher density options for more complex designs
- Lower density variants for cost-sensitive applications
- Different package options for various PCB constraints
Environmental & Export Classifications
Environmental Compliance
The XC3S1200E-4FGG400C meets stringent environmental standards:
RoHS Compliance: Fully compliant with Restriction of Hazardous Substances directive, ensuring lead-free and environmentally responsible manufacturing.
REACH Regulation: Conforms to European REACH requirements for chemical safety and environmental protection.
Conflict Minerals: Manufactured in compliance with conflict minerals reporting requirements, supporting responsible sourcing practices.
Export Control Information
The XC3S1200E-4FGG400C is subject to export control regulations:
- ECCN Classification: Specific Export Control Classification Number applies to this device
- Export Licensing: May require export licenses for certain destinations and end-uses
- Compliance Requirements: Users must verify compliance with applicable export control laws
Quality and Reliability
Manufacturing quality standards ensure reliable operation:
- Qualification Standards: Meets JEDEC and industry reliability standards
- Quality Assurance: Comprehensive testing throughout manufacturing process
- Lifecycle Management: Supported with proper advance discontinuation notices
Packaging and Shipping
Environmental considerations for packaging and distribution:
- Moisture Sensitivity: Appropriate MSL (Moisture Sensitivity Level) classification
- ESD Protection: Anti-static packaging for component protection
- Shipping Compliance: Meets international shipping and handling requirements
The XC3S1200E-4FGG400C represents a compelling solution for engineers seeking reliable, high-performance FPGA capabilities in a cost-effective package. Its combination of advanced features, comprehensive tool support, and proven reliability makes it an excellent choice for a wide range of digital design applications.
