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XC3S1600E-4FGG484C FPGA: High-Performance Spartan-3E Field Programmable Gate Array

Original price was: $20.00.Current price is: $19.00.

The XC3S1600E-4FGG484C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3E family, designed to deliver exceptional performance for digital signal processing, embedded processing, and general-purpose logic applications. This versatile FPGA combines high logic density with cost-effective pricing, making it an ideal choice for both prototyping and production environments.

Product Specification

The XC3S1600E-4FGG484C offers impressive specifications that meet demanding application requirements:

Logic Resources:

  • 1,608,704 system gates
  • 33,192 logic cells
  • 4,176 CLB slices
  • 36 dedicated multipliers (18×18 bit)

Memory Configuration:

  • 648 Kb total block RAM
  • 36 block RAM modules (18 Kb each)
  • Distributed RAM capability

I/O Capabilities:

  • 376 user I/O pins
  • Multiple I/O standards support including LVTTL, LVCMOS, SSTL, HSTL
  • Differential signaling support

Package Details:

  • FGG484 package (Fine-pitch Ball Grid Array)
  • 484-pin configuration
  • Speed grade: -4 (commercial temperature range)
  • Operating temperature: 0ยฐC to +85ยฐC

Clock Management:

  • Up to 8 Digital Clock Managers (DCMs)
  • Clock frequency synthesis and phase shifting
  • Low-jitter clock distribution

The XC3S1600E-4FGG484C supports various configuration methods including JTAG, SelectMAP, and serial configuration modes, providing flexibility for different system architectures.

Price

Pricing for the XC3S1600E-4FGG484C varies based on quantity, supplier, and market conditions. Typical pricing ranges:

  • Single unit: $180-250 USD
  • Small quantities (10-99): $150-200 USD per unit
  • Volume pricing (100+): Contact authorized distributors for bulk pricing

Authorized Distributors:

  • Digi-Key Electronics
  • Mouser Electronics
  • Arrow Electronics
  • Avnet
  • Future Electronics

The XC3S1600E-4FGG484C offers excellent price-to-performance ratio compared to competing FPGA solutions, making it cost-effective for medium-scale digital designs requiring substantial logic resources.

Documents & Media

Technical Documentation:

  • XC3S1600E-4FGG484C Datasheet: Complete electrical specifications, timing parameters, and package information
  • Spartan-3E FPGA Family Data Sheet: Comprehensive family overview and feature comparison
  • User Guide: Detailed implementation guidelines and best practices
  • Application Notes: Design optimization techniques and reference designs

Development Resources:

  • ISE Design Suite: Complete development environment for XC3S1600E-4FGG484C
  • Reference Designs: Pre-verified IP cores and example projects
  • Evaluation Boards: Development platforms featuring the XC3S1600E-4FGG484C

Package and Pinout Information:

  • Package drawings: Mechanical specifications for FGG484 package
  • Pinout files: Complete pin assignment documentation
  • PCB design guidelines: Layout recommendations for optimal performance

All documentation for the XC3S1600E-4FGG484C is available through Xilinx’s official documentation portal and authorized distributor websites.

Related Resources

Development Tools:

  • Xilinx ISE Design Suite: Primary development environment supporting XC3S1600E-4FGG484C
  • ChipScope Pro: On-chip debugging and analysis tool
  • CORE Generator: IP core customization utility

Compatible IP Cores:

  • MicroBlaze soft processor
  • Ethernet MAC controllers
  • DDR/DDR2 memory controllers
  • DSP48 math functions
  • Communication interfaces (UART, SPI, I2C)

Evaluation Platforms:

  • Spartan-3E Starter Kit
  • Custom evaluation boards featuring XC3S1600E-4FGG484C
  • Third-party development modules

Design Services:

  • Xilinx Alliance Program partners
  • FPGA design consultation services
  • Custom IP development

The XC3S1600E-4FGG484C ecosystem provides comprehensive support for accelerated development and successful project implementation.

Environmental & Export Classifications

Environmental Compliance: The XC3S1600E-4FGG484C meets stringent environmental standards:

  • RoHS compliant: Lead-free manufacturing process
  • REACH compliant: Meets European chemical safety regulations
  • Halogen-free: Environmentally responsible packaging materials

Operating Conditions:

  • Commercial temperature range: 0ยฐC to +85ยฐC
  • Supply voltage: 1.2V core, 3.3V I/O (multiple I/O voltage support)
  • Power consumption: Optimized for low-power applications
  • ESD protection: Human Body Model (HBM) and Charged Device Model (CDM) qualified

Export Classifications:

  • ECCN (Export Control Classification Number): 3A001.a.7
  • HTS (Harmonized Tariff Schedule): 8542.31.0001
  • Country of Origin: Varies by manufacturing location

Quality and Reliability:

  • Automotive qualification: AEC-Q100 Grade 2 (-40ยฐC to +105ยฐC) versions available
  • MTBF: Mean Time Between Failures exceeds industry standards
  • Quality certifications: ISO 9001, AS9100 manufacturing standards

The XC3S1600E-4FGG484C undergoes rigorous testing and quality assurance processes to ensure reliable operation across diverse application environments and regulatory requirements.


The XC3S1600E-4FGG484C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs requiring substantial logic resources and flexible I/O capabilities.