Product Specifications
The XC3SD1800A-5FGG676C features robust specifications that meet the requirements of complex digital designs:
Core Architecture:
- Logic Cells: 1,800,000 system gates
- CLB Slices: 15,552 configurable logic blocks
- Distributed RAM: 244 Kb
- Block RAM: 1,161 Kb total memory
- DSP48 Slices: 84 dedicated multiply-accumulate units
I/O and Connectivity:
- Package: 676-pin Fine-Pitch Ball Grid Array (FBGA)
- User I/O Pins: 519 maximum
- Speed Grade: -5 (high performance)
- Operating Voltage: 1.2V core, 3.3V I/O
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
Performance Characteristics:
- Maximum frequency: Up to 550 MHz
- Low power consumption with advanced power management
- Support for multiple I/O standards including LVDS, SSTL, and HSTL
- On-chip clock management with digital clock managers (DCMs)
Pricing Information
The XC3SD1800A-5FGG676C is competitively priced within the high-density FPGA market segment. Pricing varies based on order quantity, packaging options, and distributor channels. Contact authorized Xilinx distributors for current pricing, volume discounts, and availability. Educational institutions and qualifying research organizations may be eligible for special academic pricing programs.
Documents & Media
Technical Documentation:
- XC3SD1800A-5FGG676C Datasheet: Complete electrical and timing specifications
- Spartan-3A DSP Family User Guide: Comprehensive implementation guidelines
- Package and Pinout Information: Detailed pin assignments and mechanical drawings
- Migration Guide: Transition assistance from previous FPGA generations
Design Resources:
- Reference designs and application notes
- Simulation models (IBIS, SPICE)
- CAD library symbols and footprints
- Development board schematics and layouts
Software Tools:
- ISE Design Suite compatibility information
- Vivado Design Suite migration paths
- IP core integration documentation
Related Resources
Development Platforms:
- Spartan-3A DSP Starter Kit for rapid prototyping
- ML505 Evaluation Platform for advanced development
- Third-party development boards featuring the XC3SD1800A-5FGG676C
Companion Products:
- Configuration memory devices (Platform Flash, SPI Flash)
- Power management solutions optimized for Spartan-3A DSP
- Clock generation and distribution components
- High-speed connector and cable assemblies
Design Services:
- Xilinx Alliance Program partners for custom development
- Training courses and certification programs
- Technical support and consultation services
Environmental & Export Classifications
Environmental Compliance: The XC3SD1800A-5FGG676C meets stringent environmental standards and regulations:
- RoHS compliant (lead-free manufacturing process)
- REACH regulation compliance for chemical substances
- Conflict minerals reporting in accordance with SEC requirements
- Halogen-free package options available
Export Control Information:
- Export Control Classification Number (ECCN): 3A991.a.2
- Country of Origin: Varies by manufacturing location
- HTS Classification: 8542.39.0001
- No export license required for most destinations under EAR99
Quality and Reliability:
- AEC-Q100 automotive qualification available
- Military temperature grade options (-55ยฐC to +125ยฐC)
- Extended lifecycle support for industrial applications
- Comprehensive quality management system certification
Package Specifications:
- Moisture sensitivity level: MSL-3
- Storage temperature: -65ยฐC to +150ยฐC
- Lead-free and green package options
- Tape and reel packaging for automated assembly
The XC3SD1800A-5FGG676C represents a mature, well-supported FPGA solution that balances performance, features, and cost-effectiveness for a wide range of digital signal processing applications. Its combination of logic density, DSP resources, and comprehensive development ecosystem makes it an excellent choice for both prototype development and volume production.
