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XC3S700AN-4FGG484CES – Xilinx Spartan-3AN FPGA with Nonvolatile Flash Memory

Original price was: $20.00.Current price is: $19.00.

The XC3S700AN-4FGG484CES is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s innovative Spartan-3AN family, combining the proven performance of traditional FPGAs with integrated nonvolatile Flash memory technology. This revolutionary FPGA solution delivers exceptional value for space-constrained applications requiring reliable, cost-effective programmable logic with built-in configuration storage.

1. Product Specifications

Core Architecture

  • FPGA Family: Xilinx Spartan-3AN Series
  • Logic Capacity: 700,000 system gates
  • Logic Cells: 13,248 logic cells
  • Operating Frequency: 667MHz maximum
  • Process Technology: Advanced 90nm CMOS technology
  • Supply Voltage: 1.2V core voltage (1.14V to 1.26V range)

Package & Physical Characteristics

  • Package Type: 484-pin Fine-pitch Ball Grid Array (FBGA)
  • Package Code: FGG484
  • Operating Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
  • Speed Grade: -4 (industrial standard performance)

Memory & Storage Features

  • Integrated Flash Memory: Up to 11+ Mb nonvolatile storage
  • Configuration Memory: Robust in-system Flash for bitstream storage
  • Program/Erase Cycles: 100,000 Flash memory cycles
  • Data Retention: 20 years Flash memory retention guarantee
  • MultiBoot Support: Multiple configuration files in single device

I/O Capabilities

  • Total I/O Pins: Up to 372 user I/O pins
  • Differential Pairs: Up to 227 differential signal pairs
  • SelectIO Standards: Multi-voltage, multi-standard interface support
  • I/O Standards: LVCMOS, LVTTL, HSTL, SSTL, True LVDS, RSDS, mini-LVDS
  • Hot-Swap Compliance: Full hot-swap support for live system insertion

Advanced Features

  • Digital Clock Managers (DCMs): Integrated clock management
  • Block RAM: Dedicated memory blocks for data storage
  • Multipliers: Hardware multiplication support
  • Unique Device DNA: Anti-cloning security with unique serial number
  • Configuration Watchdog: Automatic error recovery system
  • Suspend Mode: Low-power state retention capability

2. Price Information

The XC3S700AN-4FGG484CES offers competitive pricing across various quantity tiers:

Volume Pricing Structure

  • 60+ units: $179.41 per unit
  • 120+ units: $166.41 per unit
  • 240+ units: $140.40 per unit
  • 360+ units: $127.40 per unit
  • 480+ units: $115.44 per unit
  • 600+ units: $101.40 per unit
  • 6000+ units: $95.16 per unit

Pricing is subject to market fluctuations and availability. Contact authorized distributors for current quotes and bulk pricing options.

Cost Benefits

  • Reduced System Cost: Eliminates external configuration memory requirements
  • Lower PCB Complexity: Fewer components and simplified board design
  • Enhanced Reliability: Integrated solution reduces failure points

3. Documents & Media

Technical Documentation

  • Official Datasheet: Comprehensive specification document available in PDF format
  • Application Notes: Design guidelines and implementation examples
  • Reference Manuals: Detailed programming and configuration guides
  • Errata Documents: Known issues and recommended workarounds

Development Resources

  • Xilinx Vivado Design Suite: Primary development environment
  • ISE Design Tools: Legacy support for existing projects
  • IP Core Libraries: Pre-verified intellectual property blocks
  • Simulation Models: Behavioral and timing simulation support

Evaluation Materials

  • Development Boards: Compatible with various Xilinx evaluation platforms
  • Design Examples: Reference designs and starter projects
  • Tutorial Materials: Step-by-step implementation guides

4. Related Resources

Compatible Development Platforms

  • ZedBoard: ARM-based development platform
  • Basys 3: Educational FPGA board
  • Nexys4-DDR: Advanced development board with DDR memory
  • Digilent Arty S7: Compact Spartan-7 development board
  • Terasic DE10-Nano: SoC FPGA development kit

Software Tools

  • Xilinx Vivado: Next-generation design suite with synthesis and implementation
  • ISE WebPACK: Free development environment for Spartan devices
  • ChipScope Pro: Integrated logic analyzer for debugging
  • FPGA Editor: Advanced placement and routing editor

Alternative Parts

  • XC3S700AN-4FGG484C: Commercial temperature grade variant
  • XC3S700AN-5FGG484C: Higher speed grade option (-5)
  • XC3S700AN-6FGG484C: Premium speed grade (-6)
  • XC3S1400AN: Higher density option in same family

Technical Support

  • AMD/Xilinx Support Forums: Community-driven technical assistance
  • Application Engineers: Direct technical consultation services
  • Training Programs: Comprehensive FPGA design courses
  • Design Services: Professional implementation support

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Status: Not RoHS compliant (contains lead in package)
  • Lead-Free Status: Contains lead materials
  • REACH Compliance: Compliant with EU chemical regulations
  • Conflict Minerals: Compliant with conflict mineral reporting requirements

Export Control Classifications

  • HTS Code (US): 8542390001
  • HTS Code (China): 8542399000
  • TARIC Code (EU): 8542399000
  • ECCN Classification: 3A991.d (Electronics Export Control)
  • Export License: No special license required (NLR – No License Required)

Quality & Certification

  • Automotive Grade: Qualified for automotive applications
  • Medical Grade: Suitable for medical device implementations
  • ISO Standards: Manufactured under ISO 9001 quality systems
  • Temperature Cycling: Tested for industrial temperature ranges

Packaging & Handling

  • Moisture Sensitivity: Level 3 per JEDEC J-STD-020
  • Electrostatic Discharge: Class 1 ESD sensitive device
  • Storage Requirements: Controlled temperature and humidity storage
  • Reflow Profile: Compatible with standard lead-free reflow processes

Applications: The XC3S700AN-4FGG484CES excels in space-constrained applications including blade servers, medical devices, automotive infotainment systems, telematics, GPS navigation, consumer electronics, and industrial control systems where integrated nonvolatile configuration storage provides significant advantages.

Key Advantages: World’s first nonvolatile FPGA with MultiBoot capability, eliminating external configuration memory, reducing board space, improving reliability, and enabling field upgrades through multiple stored configurations.