The XC3S1400AN-4FGG676C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance and flexibility for a wide range of digital design applications. This advanced FPGA combines high logic density with integrated configuration memory, making it an ideal choice for embedded systems, signal processing, and communication applications.
Product Specifications
The XC3S1400AN-4FGG676C features impressive technical specifications that make it suitable for demanding applications:
Core Features:
- Logic Cells: 1,400,000 system gates
- Configuration Memory: Integrated In-System Flash memory
- Speed Grade: -4 (high-performance grade)
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 676 pins
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Memory and I/O Capabilities:
- Block RAM: Multiple configurable memory blocks
- Distributed RAM: Flexible memory implementation
- User I/O Pins: Extensive I/O capability for complex interfacing
- Differential I/O Support: High-speed signal processing capability
Advanced Features:
- Built-in configuration flash eliminates external configuration devices
- Multiple clock management resources including Digital Clock Managers (DCMs)
- Dedicated multiplier blocks for DSP applications
- JTAG boundary scan support for testing and debugging
Price Information
The XC3S1400AN-4FGG676C pricing varies based on quantity, supplier, and current market conditions. Typical pricing ranges from $50 to $150 per unit for standard quantities, with volume discounts available for larger orders. For current pricing and availability, contact authorized Xilinx distributors or electronic component suppliers.
Pricing Factors:
- Order quantity (higher volumes receive better pricing)
- Lead time requirements
- Package and shipping preferences
- Regional availability and distribution
Documents & Media
Essential documentation for the XC3S1400AN-4FGG676C includes:
Technical Documentation:
- Official Xilinx Spartan-3AN Family Datasheet
- Configuration and Programming Guide
- Pin-out and Package Information
- PCB Design Guidelines and Layout Recommendations
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- Power consumption analysis and thermal management guides
- Signal integrity guidelines for high-speed applications
Software Tools:
- Xilinx Vivado Design Suite support information
- IP core compatibility documentation
- Simulation and verification resources
Related Resources
The XC3S1400AN-4FGG676C integrates well with various development tools and complementary products:
Development Boards:
- Spartan-3AN evaluation and development kits
- Third-party development platforms supporting the XC3S1400AN-4FGG676C
- Custom board design references and examples
Compatible Components:
- Memory interfaces (DDR, SRAM, Flash)
- Communication interfaces (Ethernet, USB, PCIe)
- Analog-to-digital converters and signal conditioning circuits
- Power management solutions optimized for FPGA applications
Design Tools:
- Xilinx Vivado Design Suite
- ModelSim simulation environment
- Third-party synthesis and place-and-route tools
- IP core libraries and reference designs
Environmental & Export Classifications
The XC3S1400AN-4FGG676C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting compliance
- Industrial temperature grade operation (-40ยฐC to +100ยฐC)
Export Classifications:
- Export Control Classification Number (ECCN) as per US Commerce Department
- International traffic in arms regulations (ITAR) compliance status
- Suitable for commercial and industrial applications worldwide
- Standard export licensing requirements apply
Quality Standards:
- ISO 9001 manufacturing quality certification
- Automotive grade versions available for specific applications
- Extended reliability testing and qualification
- Comprehensive quality assurance and testing procedures
The XC3S1400AN-4FGG676C represents an excellent choice for engineers and designers requiring high-performance FPGA solutions with integrated configuration memory. Its combination of logic capacity, built-in flash memory, and robust industrial-grade specifications makes it suitable for a wide range of applications from telecommunications to industrial automation systems.
