The XC3S1400AN-5FGG676C is a powerful Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for complex digital signal processing and embedded system applications. This advanced FPGA combines high-density logic resources with integrated flash memory, making it an ideal solution for demanding industrial, automotive, and telecommunications projects.
Product Specifications
The XC3S1400AN-5FGG676C features robust technical specifications that make it suitable for high-performance applications:
Core Architecture:
- 1,400K system gates providing extensive logic capacity
- 25,344 logic cells for complex digital designs
- 126 dedicated multipliers for efficient DSP operations
- 576 Kb of distributed RAM for flexible memory solutions
- 1,872 Kb of block RAM for high-speed data storage
Memory and Storage:
- Integrated 4 Mb Platform Flash for configuration storage
- Non-volatile memory eliminates need for external configuration devices
- Fast configuration times with reliable data retention
I/O and Connectivity:
- 502 user I/O pins in FGG676 package
- Multiple I/O standards support including LVDS, SSTL, and HSTL
- High-speed differential signaling capabilities
- Dedicated clock management resources
Performance Characteristics:
- Speed grade -5 for high-frequency operations
- Operating temperature range: 0ยฐC to +85ยฐC (commercial grade)
- Low power consumption with multiple power management modes
- Advanced process technology for optimal performance-per-watt ratio
Package Details:
- FGG676 Fine-Pitch Ball Grid Array package
- 27mm x 27mm package size for compact designs
- Lead-free and RoHS compliant construction
- Excellent thermal performance characteristics
Price Information
The XC3S1400AN-5FGG676C is competitively priced within the high-performance FPGA market segment. Pricing varies based on order quantities, distribution channels, and current market conditions. For accurate pricing information and volume discounts, contact authorized Xilinx distributors or access official pricing through electronic component suppliers. Educational institutions and research organizations may qualify for special academic pricing programs.
Documents & Media
Comprehensive technical documentation supports the XC3S1400AN-5FGG676C implementation:
Technical Documentation:
- Complete datasheet with electrical specifications and timing parameters
- User guide covering architecture details and design considerations
- Configuration user guide for Platform Flash programming
- Package and pinout documentation for PCB design
- Migration guides from other FPGA families
Design Resources:
- Reference designs and application notes
- HDL coding guidelines and best practices
- Timing analysis and constraint methodology guides
- Power estimation and thermal management guidelines
- Board design recommendations and layout guidelines
Software Support:
- ISE Design Suite compatibility for design entry and implementation
- ChipScope Pro for integrated logic analysis
- PlanAhead for advanced design planning and analysis
- Programming and debugging utilities
Related Resources
The XC3S1400AN-5FGG676C integrates seamlessly with Xilinx’s comprehensive ecosystem:
Development Tools:
- Spartan-3AN Starter Kit for rapid prototyping
- Compatible evaluation boards and development platforms
- Third-party development tools and IP cores
- Design service partners and consultation resources
Compatible Products:
- Other Spartan-3AN family members for scalable solutions
- Complementary Xilinx FPGAs for system-level designs
- Compatible memory interfaces and peripheral components
- Power management and clocking solutions
Learning Resources:
- Online training courses and webinars
- University program materials and curricula
- Technical forums and community support
- Application-specific design examples and tutorials
Environmental & Export Classifications
The XC3S1400AN-5FGG676C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- Lead-free construction with Pb-free termination
- REACH regulation compliance for European markets
- Green product classification with environmental documentation
Quality and Reliability:
- Commercial temperature grade operation (0ยฐC to +85ยฐC)
- Automotive-qualified versions available for harsh environments
- Extended reliability testing and qualification data
- ISO 9001 certified manufacturing processes
Export Classifications:
- Export Control Classification Number (ECCN) designation
- Harmonized Tariff Schedule (HTS) classification
- Country of origin documentation
- Compliance with international trade regulations
Packaging and Handling:
- Moisture sensitivity level (MSL) rating for proper storage
- Electrostatic discharge (ESD) handling requirements
- Tape and reel packaging options for automated assembly
- Traceability documentation for quality control
The XC3S1400AN-5FGG676C represents an excellent choice for engineers seeking a high-performance FPGA solution with integrated flash memory capabilities. Its combination of substantial logic resources, dedicated DSP blocks, and non-volatile configuration storage makes it particularly well-suited for applications requiring reliable, standalone operation in demanding environments.
