XCF08PFG48BRT – Platform Flash In-System Programmable Configuration PROM

1. Product Specifications

Memory Specifications

• Memory Type: Platform Flash PROM (Programmable Read-Only Memory)
• Memory Density: 8 Megabits (8Mb)
• Memory Architecture: Flash-based non-volatile memory
• Interface Type: Serial, Parallel, and JTAG compatible
• Clock Frequency: Up to 50MHz operation

Electrical Characteristics

• Supply Voltage (VCC): 1.8V nominal
• Operating Voltage Range: 1.65V to 2.0V
• I/O Voltage Compatibility: 1.5V to 3.3V
• Current Consumption: Low power operation optimized for portable applications

Physical Package

• Package Type: 48-pin Fine-pitch Ball Grid Array (FBGA)
• Package Designation: FG48 (Fine-pitch Grid, 48 pins)
• Mounting Type: Surface Mount Device (SMD)
• Package Dimensions: Compact footprint for space-constrained designs

Operating Conditions

• Operating Temperature Range: -40°C to +85°C (Industrial grade)
• Storage Temperature Range: -65°C to +150°C
• Endurance: 20,000 Program/Erase cycles minimum
• Data Retention: 20 years typical at 55°C

Configuration Modes

• Master Serial Configuration: Direct FPGA configuration
• Slave Serial Configuration: Controlled configuration mode
• Master SelectMAP: Parallel configuration interface
• Slave SelectMAP: Parallel controlled configuration
• JTAG Programming: IEEE 1149.1/1532 boundary-scan support

Key Features

• In-system programmable via JTAG interface
• IEEE Standard 1149.1/1532 boundary-scan support
• Cascadable for storing multiple or larger bitstreams
• Built-in data decompressor for advanced compression
• Design revision technology for multiple configurations
• Low power consumption design
• High reliability flash memory technology

2. Price

Current Market Pricing (USD)

XCF08PFG48BRT pricing varies based on quantity and supplier:

• Unit Price (1-9 pieces): $35.00 – $45.00 USD
• Small Quantity (10-99 pieces): $28.00 – $38.00 USD
• Medium Volume (100-999 pieces): $22.00 – $32.00 USD
• High Volume (1000+ pieces): Contact for volume pricing

Note: Prices are approximate and subject to market fluctuations. Contact authorized distributors for current pricing and availability.

Authorized Distributors

• Digi-Key Electronics
• Mouser Electronics
• Arrow Electronics
• Avnet
• Future Electronics

Lead Time

• Standard Lead Time: 2-4 weeks
• Stock Availability: Check with distributors for current inventory
• Minimum Order Quantity: Typically 1 piece for prototyping

3. Documents & Media

Technical Documentation

• Official Datasheet: XCF08P Platform Flash PROM Datasheet (DS123)
• Programming Guide: In-System Programming Reference
• Application Notes: FPGA Configuration Best Practices
• PCN Documentation: Product Change Notifications
• Quality & Reliability Reports: Available upon request

Design Resources

• PCB Footprint Libraries: Available for major CAD tools
• IBIS Models: Signal integrity simulation models
• 3D Package Models: Mechanical design files
• Reference Designs: Example implementation circuits
• Programming Software: Vivado Design Suite, iMPACT

Media Assets

• Product Images: High-resolution package photos
• Package Drawings: Detailed mechanical specifications
• Pin Configuration Diagrams: Functional pin assignments
• Block Diagrams: Internal architecture illustrations
• Application Schematics: Typical usage examples

Software Support

• Vivado Design Suite: Primary development environment
• iMPACT: Legacy programming tool
• Quartus Support: Cross-platform compatibility
• Device Drivers: Operating system support files

4. Related Resources

Compatible FPGAs

• Xilinx Spartan Series FPGAs
• Xilinx Virtex Series FPGAs
• Xilinx Zynq SoC devices
• Xilinx Kintex Series FPGAs
• Legacy Xilinx FPGA families

Related Products

• XCF04PFG48BRT: 4Mb version for smaller designs
• XCF16PFG48BRT: 16Mb version for larger bitstreams
• XCF32PFG48BRT: 32Mb version for complex applications
• XCF08PVOG48C: Alternative package option (TSOP)
• XCF08PFSG48C: Alternative package variant

Development Tools

• Xilinx Vivado: Complete FPGA design suite
• Programming Cables: USB/JTAG programming interfaces
• Evaluation Boards: Development platforms featuring XCF08P
• Socket Adapters: For prototyping and testing

Application Areas

• Industrial Automation Systems
• Telecommunications Equipment
• Medical Device Electronics
• Automotive Electronics
• Aerospace and Defense Applications
• Network Infrastructure Equipment
• Test and Measurement Instruments

Technical Support

• Xilinx Technical Support: Online knowledge base and forums
• Application Engineers: Design consultation services
• Training Resources: Online courses and documentation
• Community Forums: Peer-to-peer technical discussions

5. Environmental & Export Classifications

Environmental Compliance

• RoHS Compliant: Meets EU RoHS 2011/65/EU directive requirements
• Lead-Free: Pb-free package and manufacturing process
• REACH SVHC: Compliant with REACH regulation for hazardous substances
• Conflict Minerals: Compliant with conflict minerals regulations
• Green Product: Environmentally conscious manufacturing

Quality Standards

• ISO 9001: Quality management system certified
• ISO 14001: Environmental management system
• IATF 16949: Automotive quality standard (where applicable)
• IPC Standards: Manufacturing and assembly compliance

Export Control Classifications

• ECCN (Export Control Classification Number): 3A001.a.2.c
• HTS (Harmonized Tariff Schedule): 8542.32.0000
• Country of Origin: Typically manufactured in Asia-Pacific facilities
• Export Restrictions: Subject to US export administration regulations

Regulatory Certifications

• CE Marking: European Conformity for applicable directives
• FCC Part 15: US electromagnetic compatibility (where applicable)
• UL Recognition: Safety standard compliance
• CSA Certification: Canadian safety standards

Packaging & Shipping

• Moisture Sensitivity Level: MSL 3 (168 hours at 30°C/60% RH)
• ESD Classification: Class 1 (≥1000V HBM)
• Packaging Format: Tape and reel, tray packaging available
• Storage Requirements: Dry environment, temperature controlled

End-of-Life Information

• Product Lifecycle: Mature product with long-term availability
• Recommended Replacements: Contact Xilinx for migration paths
• Disposal Instructions: Follow local electronic waste regulations
• Material Composition: Available for recycling programs

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For the most current technical specifications, pricing, and availability information, please consult the official Xilinx documentation or contact authorized distributors. Product specifications subject to change without notice.