1. Product Specifications
Key Technical Specifications
Memory Architecture:
- Memory Capacity: 256K-bit (262,144 bits)
- Organization: 32K x 8-bit
- Memory Type: One-Time Programmable (OTP) PROM
- Technology: Low-power CMOS floating-gate process
Electrical Characteristics:
- Supply Voltage: 5V operation
- Operating Temperature Range: Commercial and Industrial grades available
- Data Retention: Guaranteed 20-year minimum life span
- Access Time: Fast configuration support with short access times
Package Details:
- Package Type: 20-pin PLCC (Plastic Leaded Chip Carrier)
- Package Code: EPC designation indicates PLCC packaging
- Lead-free (Pb-free) packaging options available
- Compact form factor for space-constrained applications
Interface Features:
- Serial interface to FPGA requiring only one user I/O pin
- Compatible with Master Serial and Slave Serial configuration modes
- Cascadable design for storing longer or multiple bitstreams
- Programmable reset polarity (active High or active Low)
- Chip Enable Output (CEO) for device chaining
Performance Characteristics:
- Fast configuration capability
- Low power consumption during operation
- Simple interface design minimizes external components
- Compatible with Xilinx Alliance and Foundation software
2. Price Information
Current Market Pricing:
- The XC17256EPC is available through authorized electronic component distributors
- Pricing varies based on quantity, packaging options, and supplier
- Volume discounts available for bulk orders
- Contact authorized distributors for current pricing and availability
- Alternative part numbers in the XC17256 family may offer different price points
Purchasing Channels:
- Authorized Xilinx distributors
- Electronic component suppliers (DigiKey, Mouser, etc.)
- Industrial electronics distributors
- OEM and contract manufacturer channels
3. Documents & Media
Official Documentation:
- XC17256 Family Datasheet (DS027) – Complete technical specifications
- Configuration PROM User Guide – Implementation guidelines
- Programming specifications and procedures
- Package and pinout information
- Electrical characteristics and timing diagrams
Design Resources:
- Reference designs and application notes
- FPGA configuration examples
- Programming file format specifications
- Board layout guidelines and recommendations
- Thermal management considerations
Software Support:
- Xilinx Vivado Design Suite compatibility
- ISE Design Tools support (legacy)
- Programming software compatibility matrix
- Device programming procedures and tools
4. Related Resources
Compatible FPGA Families:
- Xilinx Spartan FPGA series
- Xilinx Virtex FPGA families
- Other Xilinx FPGA devices requiring serial configuration
Related Configuration PROMs:
- XC17128EPC – 128K-bit version for smaller designs
- XC17512EPC – 512K-bit version for larger configurations
- XC18V series – In-system programmable alternatives
- XCF Platform Flash – Higher density programmable options
Development Tools:
- FPGA development boards with configuration PROM sockets
- PROM programmers and programming adapters
- Configuration cable and programming hardware
- Evaluation kits and reference designs
Application Areas:
- Industrial automation and control systems
- Communications infrastructure equipment
- Test and measurement instrumentation
- Automotive electronics applications
- Medical device implementations
5. Environmental & Export Classifications
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant versions available
- Lead-free packaging options meet environmental regulations
- REACH (Registration, Evaluation, Authorization of Chemicals) compliant
- Conflict minerals compliance documentation available
Quality Standards:
- Manufactured to automotive quality standards where applicable
- ISO 9001 quality management system compliance
- Industry-standard reliability testing and qualification
- Moisture sensitivity level (MSL) classification provided
Export Classifications:
- Export Control Classification Number (ECCN) available upon request
- Country of origin marking for customs purposes
- Standard commercial electronic component classification
- No export restrictions for most commercial applications
Operating Environment:
- Commercial temperature range: 0ยฐC to +70ยฐC
- Industrial temperature range: -40ยฐC to +85ยฐC (select variants)
- Standard commercial humidity and shock specifications
- ESD protection measures implemented
Packaging and Handling:
- Moisture-sensitive device packaging where applicable
- Anti-static handling procedures recommended
- Proper storage conditions for long-term reliability
- Tube, tray, or reel packaging options available
The XC17256EPC represents a proven solution for FPGA configuration storage, offering reliable performance, industry-standard packaging, and comprehensive design support for a wide range of embedded system applications.
