1. Product Specifications
Core Architecture
- Part Number: XCZU27DR-1FFVG1517E
- Family: Zynq UltraScale+ RFSoC
- Logic Cells: 930,300 cells
- Process Technology: 16nm FinFET+ technology
- Operating Voltage: 0.85V core voltage
- Speed Grade: -1 (645MHz maximum frequency)
Processing System
- ARM Cortex-A53: Quad-core 64-bit processor
- ARM Cortex-R5: Dual-core real-time processor
- Memory Interfaces: DDR4/DDR3L, LPDDR4 support
- High-Speed Connectivity: PCIe Gen3, USB 3.0, Gigabit Ethernet
RF Data Converters
- RF-ADCs: Up to 8 channels, 14-bit resolution, up to 5 GSPS sampling rate
- RF-DACs: Up to 8 channels, 14-bit resolution, up to 10 GSPS sampling rate
- Analog Bandwidth: Up to 6 GHz for both ADCs and DACs
- Frequency Support: All bands below 6 GHz for 5G deployment
Package Details
- Package Type: FFVG1517 (Fine-pitch Flip Chip Ball Grid Array)
- Pin Count: 1517 pins
- Package Size: Advanced BGA packaging for high-density applications
- Thermal Performance: Optimized for high-performance cooling solutions
Programmable Logic Features
- UltraScale+ Architecture: Advanced FPGA fabric
- DSP Slices: High-performance digital signal processing blocks
- Block RAM: Distributed memory architecture
- UltraRAM: Large on-chip memory blocks
- Clock Management: Multiple PLLs and clock domains
2. Price Information
The XCZU27DR-1FFVG1517E pricing varies based on quantity, supplier, and market conditions. Key pricing considerations include:
- Volume Pricing: Significant discounts available for bulk orders (1000+ units)
- Lead Time: Standard lead times range from 12-26 weeks depending on demand
- Price Fluctuation: Prices fluctuate based on global market conditions and component availability
- Regional Variations: Pricing may vary by geographic region and local distributors
Getting Current Pricing:
- Request quotes from authorized distributors
- Compare pricing across multiple suppliers for best value
- Consider total cost of ownership including development tools and support
Note: For current pricing and availability, contact authorized AMD distributors or use online component search engines.
3. Documents & Media
Official Documentation
- Product Brief: Overview of XCZU27DR-1FFVG1517E features and capabilities
- Data Sheet: Complete electrical specifications and characteristics
- User Guide: Implementation guidelines and best practices
- Package and Pinout: Detailed pin assignments and package information
- Errata: Known issues and workarounds
Development Resources
- Vivado Design Suite: Primary development environment for XCZU27DR-1FFVG1517E
- PetaLinux Tools: Linux development framework
- SDK and Runtime: Software development tools and libraries
- IP Catalog: Pre-verified IP cores and reference designs
Technical Documentation
- Application Notes: Implementation guides for specific use cases
- Reference Designs: Proven design examples and templates
- White Papers: Technical insights and performance analysis
- Video Tutorials: Step-by-step implementation guidance
Evaluation and Development Kits
While specific development boards for the XCZU27DR-1FFVG1517E may vary, related evaluation platforms include:
- ZCU111 Evaluation Kit: Features similar RFSoC technology
- Custom Development Boards: Available from third-party vendors
- Reference Design Platforms: For rapid prototyping and development
4. Related Resources
Software Tools and Environments
- Vivado Design Suite: Complete design environment with synthesis, implementation, and debugging
- Vitis Unified Software Platform: Accelerated application development
- MATLAB and Simulink: Model-based design integration
- GNU Radio: Open-source SDR development framework
Companion Devices
- Power Management ICs: Optimized power solutions for RFSoC applications
- Clock Generation: High-performance clock sources and jitter cleaners
- RF Front-End Components: Amplifiers, filters, and antenna solutions
- Memory Devices: DDR4 SDRAM and high-speed storage solutions
Industry Standards and Protocols
- 5G NR: Next-generation wireless communication standard
- LTE/LTE-A: Advanced cellular communication protocols
- DOCSIS 3.1/4.0: Cable modem and infrastructure standards
- CPRI/eCPRI: Common Public Radio Interface specifications
Application Areas
- 5G Base Stations: Massive MIMO and beamforming applications
- Software Defined Radio: Flexible radio communication systems
- Cable Infrastructure: DOCSIS and broadband applications
- Aerospace and Defense: Radar and electronic warfare systems
- Test and Measurement: High-speed signal generation and analysis
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with RoHS directive (Restriction of Hazardous Substances)
- REACH Compliance: Compliant with REACH regulation for chemical substances
- Conflict Minerals: Compliant with conflict minerals regulations
- Environmental Standards: Meets international environmental protection standards
Operating Conditions
- Operating Temperature Range: Commercial (0ยฐC to +85ยฐC) and industrial (-40ยฐC to +100ยฐC) grades available
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 10% to 90% non-condensing
- Altitude: Up to 2000 meters above sea level
Export and Trade Compliance
- HTS Code: 8542.31.00.01 – Integrated circuits and microassemblies
- ECCN Classification: May require export licenses for certain countries
- Country of Origin: Manufactured under AMD’s global supply chain
- Export Restrictions: Subject to US and international export control regulations
Quality and Reliability
- Qualification Standards: Automotive (AEC-Q100) and industrial standards
- Quality Management: ISO 9001 certified manufacturing processes
- Reliability Testing: Extensive qualification and reliability testing
- Lifecycle Support: Long-term availability and support commitment
Packaging and Handling
- ESD Protection: Anti-static packaging and handling procedures required
- Moisture Sensitivity: Appropriate storage and handling per JEDEC standards
- Traceability: Full lot traceability and quality documentation
- Shipping: Global shipping with proper ESD protection and documentation
Keywords: XCZU27DR-1FFVG1517E, AMD Zynq UltraScale+ RFSoC, 5G FPGA, Software Defined Radio, RF Data Converters, 930K Logic Cells, 16nm FPGA, Radio Frequency SoC
This product description is based on publicly available information. For the most current specifications, pricing, and availability, please consult official AMD documentation and authorized distributors.
