Product Overview
The XCV812E-7BGG560I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-E Extended Memory family. This advanced programmable logic device delivers exceptional processing capabilities and flexibility for demanding applications requiring high-speed signal processing and extensive memory integration.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex-E Extended Memory (EM)
- Manufacturer: Xilinx Inc. (now AMD)
- Technology: 0.18ฮผm CMOS, 6-layer metal process
- Supply Voltage: 1.8V (1.71V – 1.89V operating range)
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial)
- Speed Grade: -7 (400MHz system performance)
Logic Resources
- System Gates: 254,016 gates
- Logic Cells: 21,168 configurable logic blocks (CLBs)
- LABs/CLBs: 4,704 total
- RAM Capacity: 1,146,880 bits (140kB) embedded memory
- I/O Pins: 404 user I/O
Package Details
- Package Type: 560-pin Ball Grid Array (BGA)
- Package Designation: BGG560I
- Mounting Type: Surface Mount Technology (SMT)
- Lead Status: RoHS non-compliant (legacy product)
- Packaging: Anti-static tray with ESD protection
Performance Characteristics
- Maximum Frequency: 400MHz
- High-speed I/O capability: Enhanced for demanding applications
- Optimized place-and-route architecture: Improved silicon efficiency
- Extended memory configuration: Superior memory-to-logic ratio
2. Pricing
Note: XCV812E-7BGG560I is a legacy/obsolete component with limited availability.
- Market Status: Discontinued by manufacturer
- Availability: Limited stock from authorized distributors and brokers
- Pricing: Contact authorized distributors for current pricing
- Lead Time: Extended lead times expected due to obsolete status
- Minimum Order Quantity: Varies by distributor
Price Range Estimate: Contact suppliers for current market rates as prices vary significantly based on availability and quantity.
3. Documents & Media
Technical Documentation
- Datasheet: XCV812E-7BGG560I Product Specification
- User Guide: Virtex-E Extended Memory Configuration Guide
- Application Notes: High-speed design considerations
- Package Information: BGG560 package mechanical drawings
- Pin Configuration: Detailed pinout diagrams and I/O specifications
Design Resources
- IBIS Models: Signal integrity simulation models
- FPGA Editor: Configuration and constraint files
- Reference Designs: Example implementations and best practices
- Migration Guide: Upgrade path recommendations for newer devices
Software Support
- Design Tools: Legacy ISE Design Suite support
- Programming: Impact and iMPACT configuration tools
- Simulation: ModelSim compatibility files
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment (legacy)
- Impact Programming Tool: Device configuration software
- ChipScope Pro: Integrated debugging solution
- CORE Generator: IP core integration tool
Compatible Products
- XCV812E-6BG560C: Lower speed grade alternative
- XCV812E-8BG560C: Higher speed grade option
- XCV1000E-7BGG560C: Higher capacity variant
- XCV600E-7BGG560I: Lower capacity alternative
Migration Options
- Spartan-6 Series: Cost-optimized modern alternative
- Virtex-6 Series: Performance upgrade path
- 7 Series FPGAs: Current generation replacement recommendations
Application Areas
- Communications: High-speed networking and telecommunications
- Industrial Control: Real-time processing systems
- Signal Processing: DSP-intensive applications
- Prototyping: ASIC and SoC verification platforms
- Aerospace & Defense: Mission-critical systems (commercial grade)
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Non-compliant (contains lead)
- REACH Compliance: Legacy product exemptions apply
- Conflict Minerals: Compliant with reporting requirements
- Environmental Grade: Commercial (0ยฐC to +85ยฐC)
Export Control Information
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- Export License: May require license for certain destinations
- Country of Origin: Manufactured in various locations
- Harmonized Code: 8542.31.0001
Quality Standards
- ISO Certification: ISO 9001:2015 quality management
- Reliability Grade: Commercial reliability standards
- Quality Level: Standard commercial grade
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
Storage and Handling
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: <95% non-condensing
- ESD Sensitivity: Class 1 (>1000V HBM)
- Shelf Life: Unlimited with proper storage
Important Notice: The XCV812E-7BGG560I is an obsolete product that is no longer in production. While existing inventory may be available through distributors, it is recommended to consider migration to current-generation Xilinx/AMD FPGAs for new designs. Contact your local Xilinx/AMD representative for migration guidance and modern alternative recommendations.
Keywords: XCV812E-7BGG560I, Xilinx Virtex-E, FPGA, programmable logic, embedded memory, BGA package, legacy components, obsolete FPGA
