1. Product Specifications
Core Specifications
- Part Number: XCVU33P-1FSVH2104E
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Virtex UltraScale+ HBM FPGA
- Package Type: 2104-BBGA, FCBGA (2104FCBGA)
- Speed Grade: -1 (Standard performance grade)
- I/O Count: 208 I/O pins
- Logic Cells: 961,800 (962K)
- Logic Elements: 961,800
Technical Specifications
- Process Technology: 20nm manufacturing process
- Operating Voltage: 0.825V ~ 0.876V (VCCINT)
- Operating Temperature: 0ยฐC ~ 100ยฐC (TJ – Junction Temperature)
- Temperature Grade: Extended (E) – suitable for commercial applications
- Mounting Type: Surface Mount Technology (SMT)
- Terminal Finish: Tin Silver Copper
- Moisture Sensitivity Level: Level 4 (MSL 4)
Performance Features
- Maximum Operating Frequency: Up to 600MHz
- High-Speed Transceivers: Next-generation transceivers for high-bandwidth applications
- Memory Support: Advanced memory interfaces including DDR3/DDR4 support
- DSP Capabilities: Integrated DSP blocks for signal processing applications
- MicroBlaze Processor: Compatible with MicroBlaze soft processor (200+ DMIPs)
Environmental & Quality Standards
- RoHS Compliance: RoHS3 Compliant (Lead-free)
- Product Status: Active
- JESD-609 Code: e1 (Environmental classification)
- Peak Reflow Temperature: 240ยฐC (Maximum)
- Time at Peak Temperature: 30 seconds (Maximum)
2. Pricing Information
The XCVU33P-1FSVH2104E is available through multiple authorized distributors with competitive pricing structures:
Distribution Channels
- DigiKey Electronics: Authorized distributor with same-day shipping
- Mouser Electronics: Global distributor with comprehensive inventory
- Sourcengine: Factory-direct sourcing with bulk pricing options
- Octopart: Price comparison across 10+ distributors
- FPGAkey: Specialized FPGA distributor with real-time pricing
Pricing Structure
- Single Unit: Contact distributors for current pricing
- Bulk Quantities: Volume discounts available for quantities of 1,000+
- OEM Pricing: Special pricing available for original equipment manufacturers
- Lead Time: Standard lead time varies by distributor (typically 25+ weeks for factory orders)
Packaging Options
- Tray Packaging: Standard factory packaging
- Cut Tape: Custom quantities available
- Reel Packaging: Full reel quantities for high-volume applications
- MouseReel: Custom reel service (additional reeling fee applies)
3. Documents & Media
Technical Documentation
- Official Datasheet: Available in PDF format from AMD/Xilinx
- User Guide: Comprehensive implementation guide
- Reference Manual: Detailed technical specifications
- Application Notes: Design implementation examples
- Errata Documentation: Known issues and workarounds
Design Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Pre-verified IP cores and modules
- Example Designs: Reference implementations
- Constraint Files: Timing and placement constraints
- Pin Assignment Files: I/O pin mapping documentation
CAD Models & Symbols
- FPGA Symbol Libraries: Schematic symbols for major CAD tools
- 3D Package Models: Mechanical drawings and 3D models
- Footprint Libraries: PCB layout footprints
- IBIS Models: Signal integrity simulation models
4. Related Resources
Development Tools
- Vivado Design Suite: Industry-leading FPGA design software
- Vivado HLS: High-level synthesis tools
- SDK (Software Development Kit): Embedded software development
- System Generator: Model-based design for DSP applications
- ChipScope Pro: Integrated logic analyzer
Compatible Products
- XCVU33P-2FSVH2104E: Higher speed grade variant (-2 speed grade)
- XCVU33P-3FSVH2104E: Highest performance variant (-3 speed grade)
- XCVU35P Series: Higher logic density alternatives
- XCVU31P Series: Cost-optimized alternatives
Development Boards
- Evaluation Boards: Professional development platforms
- Starter Kits: Entry-level development solutions
- Reference Designs: Application-specific implementations
- ZedBoard: Popular development platform
- Custom Carrier Boards: Application-specific solutions
Application Areas
- Data Center Acceleration: High-performance computing acceleration
- Artificial Intelligence: Machine learning and AI inference
- 5G Infrastructure: Telecommunications and networking
- Cloud Computing: Virtualized computing environments
- Signal Processing: Advanced DSP applications
- Industrial Automation: Real-time control systems
5. Environmental & Export Classifications
Export Control Information
- ECCN Classification: 3A001.A.7.B (Export Administration Regulations)
- ECCN Governance: EAR (Export Administration Regulations)
- HTS Code: 8542.39.00.01 (Harmonized Tariff Schedule)
- USHTS Code: 8542390001
- TARIC Code: 8542399000
- Schedule B Code: 8542.39.00.00
Environmental Classifications
- RoHS Status: RoHS3 Compliant (Restriction of Hazardous Substances)
- REACH Compliance: Compliant with EU REACH regulations
- Conflict Minerals: Compliant with conflict minerals regulations
- WEEE Directive: Compliant with Waste Electrical and Electronic Equipment directive
Quality Standards
- ISO Certification: Manufactured in ISO-certified facilities
- Quality Grade: Industrial grade components
- Reliability Standards: Meets industry reliability requirements
- Traceability: Full component traceability available
Shipping & Handling
- ESD Protection: Electrostatic discharge protection required
- Moisture Control: Dry pack shipping for MSL 4 components
- Temperature Control: Maintain storage temperature requirements
- Handling Precautions: Follow proper handling procedures for sensitive components
The XCVU33P-1FSVH2104E represents AMD’s commitment to delivering high-performance FPGA solutions for next-generation applications. Contact authorized distributors for current pricing, availability, and technical support.
