The XCV812E-9FGG900C is a premium Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E Extended Memory (Virtex-EM) family. This cutting-edge programmable logic device delivers exceptional performance for demanding applications requiring high memory bandwidth and advanced processing capabilities.
Product Specifications
Core Features
- Part Number: XCV812E-9FGG900C
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Product Family: Virtex-E Extended Memory (Virtex-EM) 1.8V FPGAs
- Technology Node: 0.18ฮผm CMOS process with 6-layer metal copper interconnect
- Package Type: 900-pin Fine-pitch Ball Grid Array (FBGA)
- Operating Voltage: 1.8V (1.71V to 1.89V range)
Technical Specifications
- Logic Elements: 21,168 logic cells/elements
- System Gates: 254,016K gates equivalent
- I/O Pins: 556 user I/O pins
- Block RAM: 1,146,880 RAM bits (enhanced memory configuration)
- Operating Frequency: Up to 357MHz performance grade
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
- Package Dimensions: 900-ball FBGA footprint
Key Performance Features
- High Memory Bandwidth: Optimized for applications requiring extensive memory resources
- Copper Interconnect Technology: First FPGA family to deploy copper interconnect for superior performance
- Enhanced Block RAM: Additional block RAM compared to standard Virtex-E devices
- Advanced Architecture: Optimized for place-and-route efficiency
- Network-Ready: Ideal for high-speed networking applications up to 160 Gb/s
Pricing Information
The XCV812E-9FGG900C pricing varies based on quantity, delivery requirements, and market conditions. For current pricing and availability:
- Request Quote: Contact authorized distributors for competitive pricing
- Volume Discounts: Available for large quantity orders
- Lead Time: Typically 2-12 weeks depending on stock availability
- Minimum Order: Varies by distributor (typically 1+ pieces for prototyping)
Note: Prices fluctuate based on market demand and semiconductor availability. Contact suppliers for real-time pricing.
Documents & Media
Technical Documentation
- Official Datasheet: Virtex-E Extended Memory FPGA datasheet (PDF format)
- User Guide: Virtex-EM Family Configuration and Design Guide
- Application Notes: High-speed design guidelines and implementation notes
- Reference Designs: Example implementations for network switching applications
- Pin-out Diagrams: Complete I/O pin assignment documentation
Development Resources
- Design Tools: Compatible with Xilinx ISE and Vivado Design Suite
- IP Cores: Access to extensive Xilinx IP library
- Simulation Models: VHDL and Verilog behavioral models
- CAD Libraries: Footprint and symbol libraries for major CAD tools
Media Resources
- Product Photos: High-resolution package images
- Block Diagrams: Architecture overview diagrams
- Performance Benchmarks: Speed and power consumption data
- Video Tutorials: Design methodology and best practices
Related Resources
Compatible Products
- Development Boards: Virtex-E evaluation platforms and starter kits
- Programming Cables: JTAG and parallel programming solutions
- Supporting ICs: Configuration memory devices and power management ICs
- Heat Sinks: Thermal management solutions for high-performance applications
Software Tools
- Xilinx ISE: Integrated Software Environment for design entry and implementation
- ModelSim: Simulation and verification tools
- ChipScope Pro: Integrated logic analyzer for debugging
- CORE Generator: IP core customization and integration tools
Alternative Parts
- XCV812E-8FGG900C: Lower speed grade alternative
- XCV812E-7FG900C: Different package option with fewer pins
- XCV1000E-8FGG900C: Higher capacity option in same family
- Modern Equivalents: Zynq UltraScale+ and Virtex UltraScale+ alternatives
Application Areas
- Network Infrastructure: High-speed routers and switches (160 Gb/s capable)
- Video Processing: High-definition video graphics systems
- Signal Processing: Advanced DSP applications requiring high memory bandwidth
- Industrial Automation: High-performance control systems
- Telecommunications: Base station and networking equipment
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets Restriction of Hazardous Substances directive
- Lead-Free: Compatible with lead-free soldering processes
- Halogen-Free: Environmentally friendly packaging materials
- REACH Compliant: Meets European chemical safety regulations
- Conflict Minerals: Sourced responsibly per industry standards
Operating Environment
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
- Vibration Resistance: Per JEDEC standards
Export Control Classifications
- ECCN: Export Control Classification Number varies by destination
- HTS Code: Harmonized Tariff Schedule classification for customs
- Country Restrictions: Subject to semiconductor export control regulations
- License Requirements: May require export licenses for certain destinations
- ITAR Status: Not subject to International Traffic in Arms Regulations
Quality Standards
- ISO 9001: Manufactured under ISO 9001 quality management system
- Automotive Grade: Available in automotive-qualified versions (contact for details)
- Military Specifications: MIL-STD compliant versions available
- Reliability Testing: Extensive qualification and reliability testing performed
Packaging & Shipping
- ESD Protection: Anti-static packaging for component protection
- Moisture Sensitivity: Level 3 moisture sensitivity rating
- Tray Packaging: Available in industry-standard trays
- Tape & Reel: High-volume packaging options available
The XCV812E-9FGG900C represents the pinnacle of Virtex-EM FPGA technology, delivering unmatched performance for memory-intensive applications. Contact authorized distributors today for pricing, availability, and technical support.
Keywords: XCV812E-9FGG900C, Virtex-EM FPGA, AMD Xilinx, programmable logic, high-speed networking, extended memory, 900-pin FBGA
