“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XCV405E-8BG560C | Xilinx Virtex-E Extended Memory FPGA – High-Performance Field Programmable Gate Array

Original price was: $20.00.Current price is: $19.00.

Product Overview

The XCV405E-8BG560C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-E Extended Memory (Virtex-EM) family. This advanced programmable logic device combines exceptional processing capabilities with extended memory features, making it an ideal solution for demanding applications requiring high-speed digital signal processing and complex logic implementation.

1. Product Specifications

Core Technical Specifications

  • Part Number: XCV405E-8BG560C
  • Manufacturer: Xilinx Inc. (now AMD Xilinx)
  • Product Family: Virtex-E Extended Memory (Virtex-EM)
  • Package Type: 560-Pin Metal Ball Grid Array (MBGA)
  • Technology Node: 0.18ฮผm CMOS process
  • Supply Voltage: 1.8V (1.71V – 1.89V operating range)
  • Speed Grade: -8 (high performance)

Logic and Memory Specifications

  • Logic Gates: 129,600 system gates
  • Logic Cells: 10,800 logic cells
  • CLB Array: 40 x 60 Configurable Logic Blocks
  • Block RAM: 573,440 bits (70kB)
  • Distributed RAM: 153,600 bits
  • Maximum Frequency: Up to 416MHz (speed grade dependent)

Input/Output Capabilities

  • User I/O Pins: 404 user I/O
  • Differential I/O Pairs: 183 differential pairs
  • Total Package Pins: 560 pins
  • I/O Standards: Supports multiple I/O standards including LVTTL, LVCMOS, and differential signaling

Operating Conditions

  • Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
  • Junction Temperature: TJ max specified
  • Power Consumption: Optimized for low-power applications
  • Mounting Type: Surface Mount Technology (SMT)

2. Pricing Information

Current Market Pricing (2025)

The XCV405E-8BG560C pricing varies based on quantity, supplier, and market conditions:

  • Small Quantities (1-10 units): Request for Quote (RFQ)
  • Medium Volumes (11-100 units): Contact distributors for volume pricing
  • Large Volumes (100+ units): Significant discounts available through authorized distributors

Availability Status

  • Current Stock Status: Available from multiple authorized distributors
  • Lead Time: 2-8 weeks depending on quantity and supplier
  • Minimum Order Quantity: Varies by distributor (typically 1-25 pieces)

Note: Pricing for the XCV405E-8BG560C fluctuates based on market demand and supply chain conditions. For current pricing and availability, please contact authorized Xilinx distributors or request a quote through electronic component suppliers.

3. Documents & Media

Technical Documentation

  • Official Datasheet: XCV405E-8BG560C.pdf (118 pages)
    • Complete electrical specifications
    • Pin configuration diagrams
    • Package mechanical drawings
    • Timing characteristics and performance data

Design Resources

  • User Guides: Virtex-E Extended Memory FPGA User Guide
  • Application Notes:
    • High-speed design considerations
    • Power management guidelines
    • Signal integrity best practices
  • Reference Designs: Available through Xilinx Design Hub

Development Tools

  • Design Software:
    • Xilinx ISE Design Suite (legacy support)
    • Vivado Design Suite (recommended for new designs)
  • Programming Tools:
    • Impact programming utility
    • ChipScope Pro analyzer support
  • Simulation Models: Available for major EDA tools

Package Information

  • 3D Package Models: Available for mechanical design verification
  • Footprint Libraries: PCB footprints for major CAD tools
  • Thermal Models: For thermal analysis and design optimization

4. Related Resources

Compatible Development Boards

  • Evaluation Platforms: Various third-party development boards
  • Starter Kits: Compatible with Xilinx development ecosystems
  • Reference Designs: Network switching and video processing applications

Software and IP Cores

  • LogiCORE IP: Comprehensive library of verified IP cores
  • DSP IP: Digital signal processing cores optimized for Virtex-E
  • Communication IP: Ethernet, PCI, and other communication protocols

Technical Support Resources

  • Xilinx Support: Official technical support and documentation
  • Community Forums: User communities and design discussions
  • Training Materials: Online courses and certification programs
  • Application Engineering: Direct support for complex design challenges

Compatible Components

  • Configuration Devices:
    • Platform Flash PROMs
    • Serial configuration memories
  • Clock Management:
    • Clock generators and PLLs
    • Crystal oscillators and timing solutions
  • Power Management:
    • Voltage regulators and power supplies
    • Power sequencing solutions

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliance: RoHS 2011/65/EU compliant (lead-free)
  • REACH Regulation: Compliant with EU REACH requirements
  • Halogen-Free: Available in halogen-free package options
  • Lead-Free: Pb-free soldering process compatible
  • Green Manufacturing: Manufactured using environmentally responsible processes

Quality and Reliability Standards

  • Quality System: ISO 9001:2015 certified manufacturing
  • Reliability Testing:
    • Thermal cycling qualification
    • Highly Accelerated Life Testing (HALT)
    • Electrostatic discharge (ESD) protection
  • Moisture Sensitivity Level (MSL): MSL 3 (refer to package specifications)
  • Radiation Tolerance: Standard commercial grade (not radiation hardened)

Export Control Classifications

  • ECCN (Export Control Classification Number): 3A001.a.7
  • Schedule B Number: 8542.31.0001
  • Country of Origin: Varies by manufacturing facility
  • Export Restrictions: Subject to U.S. export administration regulations

Packaging and Shipping

  • Packaging Type: Anti-static tape and reel or tray packaging
  • Shipping Classification: Standard electronic components
  • Storage Requirements:
    • Temperature: -40ยฐC to +125ยฐC
    • Humidity: <85% RH (non-condensing)
    • ESD protection required during handling

Lifecycle Status

  • Product Status: Production (legacy product with ongoing support)
  • Lifecycle Stage: Mature product with stable availability
  • End-of-Life Notice: No current EOL announced
  • Long-term Support: Continued support through AMD Xilinx

About the XCV405E-8BG560C

The XCV405E-8BG560C represents a proven solution in the Xilinx Virtex-E Extended Memory family, offering designers the perfect balance of performance, flexibility, and cost-effectiveness. With its robust 0.18ฮผm CMOS technology and extensive I/O capabilities, this FPGA is ideal for applications requiring high-speed data processing, advanced digital signal processing, and complex logic implementation.

Key Applications Include:

  • Network switching and routing equipment
  • High-performance video processing systems
  • Industrial automation and control
  • Communications infrastructure
  • Medical imaging equipment
  • Aerospace and defense systems

For technical specifications, pricing, and availability of the XCV405E-8BG560C, contact your local Xilinx distributor or authorized electronic component supplier.