Product Specification
The XC6VHX380T-2FFG1155C delivers outstanding performance with its comprehensive feature set:
Core Architecture:
- Logic Cells: 380,000 logic cells providing extensive programmable resources
- Speed Grade: -2 speed grade offering optimized performance characteristics
- Package Type: FFG1155 Fine-Pitch Ball Grid Array for high-density applications
- I/O Pins: 600 user I/O pins enabling extensive connectivity options
Memory Resources:
- Block RAM: 1,344 Kb total block RAM capacity
- Distributed RAM: Substantial distributed memory for flexible data storage
- Memory Controllers: Integrated memory interface blocks for DDR3/DDR2 support
DSP Capabilities:
- DSP48E1 Slices: 864 dedicated DSP slices for high-performance signal processing
- Multiply-Accumulate Operations: Hardware-optimized for complex mathematical computations
- Clock Management: Advanced clock management tiles with low-jitter PLLs
Connectivity Features:
- High-Speed Serial Transceivers: Multiple GTX transceivers supporting up to 6.6 Gbps
- PCI Express: Integrated PCIe endpoint and root port capabilities
- Ethernet MAC: 10/100/1000 Ethernet MAC for network connectivity
Price
The XC6VHX380T-2FFG1155C pricing varies based on quantity, supplier, and market conditions. Contact authorized distributors for current pricing:
- Single Unit Price: Contact for quote
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: Typically 12-16 weeks for standard orders
- Availability: Check with authorized Xilinx distributors for current stock levels
Price factors include packaging requirements, testing specifications, and delivery timeline. Extended temperature range versions may be available at premium pricing.
Documents & Media
Essential documentation and resources for the XC6VHX380T-2FFG1155C include:
Technical Documentation:
- Product Data Sheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation guidelines and best practices
- Package and Pinout Information: Detailed pin assignments and package drawings
- Power Consumption Guidelines: Thermal management and power estimation tools
Design Resources:
- Reference Designs: Pre-validated designs for common applications
- Application Notes: Implementation guidance for specific use cases
- Vivado Design Suite: Complete development environment and tools
- IP Core Library: Extensive collection of verified IP blocks
Quality Documentation:
- Quality and Reliability Reports: Statistical quality data and reliability projections
- Qualification Reports: Environmental and stress testing results
- Certificate of Compliance: RoHS and conflict minerals documentation
Related Resources
The XC6VHX380T-2FFG1155C ecosystem includes comprehensive development and support resources:
Development Tools:
- Xilinx Vivado Design Suite: Integrated development environment
- ChipScope Pro: Advanced debugging and verification tools
- System Generator: MATLAB/Simulink integration for DSP development
- EDK (Embedded Development Kit): Embedded processor development tools
Evaluation Platforms:
- ML605 Evaluation Board: Full-featured development platform
- Custom Development Boards: Third-party solutions for specific applications
- FMC (FPGA Mezzanine Card): Modular expansion options
Support Resources:
- Xilinx Forums: Community-driven technical support
- Application Engineering: Direct technical consultation services
- Training Programs: Comprehensive FPGA design education
- Third-Party IP: Extensive ecosystem of compatible IP solutions
Environmental & Export Classifications
The XC6VHX380T-2FFG1155C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS Compliant: Restriction of Hazardous Substances directive compliance
- REACH Regulation: European chemical safety regulation compliance
- Conflict Minerals: 3TG conflict minerals reporting compliance
- Green Product: Environmentally conscious manufacturing processes
Operating Conditions:
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Industrial Temperature Range: -40ยฐC to +100ยฐC (extended versions available)
- Supply Voltage: Multiple power domains with precise voltage requirements
- Humidity Resistance: Suitable for various environmental conditions
Export Classifications:
- ECCN Classification: Export Control Classification Number compliance
- Country of Origin: Manufacturing location documentation
- Export Licensing: Compliance with international trade regulations
- ITAR Status: International Traffic in Arms Regulations classification
Quality Standards:
- ISO 9001 Manufacturing: Quality management system certification
- Automotive Qualification: AEC-Q100 qualified versions available
- Military Standards: MIL-STD qualified variants for defense applications
- Long-Term Availability: Extended product lifecycle support programs
The XC6VHX380T-2FFG1155C represents the pinnacle of FPGA technology, combining exceptional performance, comprehensive features, and robust reliability for the most demanding applications in telecommunications, aerospace, defense, and high-performance computing markets.
