The XCKU13P-L1FFVE900I is a premium field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered for demanding applications requiring exceptional processing power and energy efficiency. This advanced FPGA solution delivers outstanding performance for data center acceleration, wireless infrastructure, and high-performance computing applications.
Product Specifications
Core Architecture
The XCKU13P-L1FFVE900I features AMD Xilinx’s 16nm FinFET+ process technology, providing optimal balance between performance and power consumption. This FPGA incorporates advanced architectural enhancements that make it ideal for compute-intensive applications.
Key Technical Specifications:
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 2,286,000
- CLB LUTs: 1,143,000
- Block RAM: 38.1 Mb total block RAM
- UltraRAM: 62.8 Mb integrated UltraRAM
- DSP Slices: 1,968 DSP48E2 slices
- Package Type: FFVE900 (900-pin Flip Chip BGA)
- Speed Grade: -1L (Low power variant)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Advanced Features
The XCKU13P-L1FFVE900I incorporates cutting-edge features including integrated 100G Ethernet MACs, PCIe Gen4 connectivity, and high-speed transceivers supporting up to 32.75 Gbps data rates. The device supports DDR4-2666 memory interfaces and includes dedicated security features for robust system protection.
Pricing Information
XCKU13P-L1FFVE900I pricing varies based on order quantity and distribution channel. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. Lead times may vary depending on market conditions and demand.
Pricing Considerations:
- Unit price decreases with higher volume orders
- Extended temperature range variants may carry premium pricing
- Development kit options available separately
- Support and licensing costs may apply for specific IP cores
Documents & Media
Technical Documentation
Comprehensive documentation is available for the XCKU13P-L1FFVE900I through AMD Xilinx’s official documentation portal:
- Product Data Sheet: Complete electrical and mechanical specifications
- User Guide: Detailed implementation guidelines and best practices
- Package and Pinout Information: Pin assignments and packaging details
- Power and Thermal Guidelines: Power estimation and thermal management
- Migration Guide: Transition assistance from previous FPGA families
Development Resources
- Vivado Design Suite: Complete development environment
- IP Core Library: Pre-verified intellectual property blocks
- Reference Designs: Proven implementation examples
- Application Notes: Specific use-case implementations
- Video Tutorials: Step-by-step development guidance
Related Resources
Development Platforms
The XCKU13P-L1FFVE900I is supported by comprehensive development ecosystems designed to accelerate time-to-market:
Evaluation Boards:
- KCU116 Evaluation Kit (compatible architecture)
- Custom development boards from third-party vendors
- Prototyping platforms for specific applications
Software Tools:
- Vivado Design Suite (latest version recommended)
- Vitis Unified Software Platform
- PetaLinux for embedded Linux development
- Model Composer for algorithm development
Technical Support
AMD Xilinx provides extensive support resources for XCKU13P-L1FFVE900I implementation:
- Community forums with expert assistance
- Technical support tickets for licensed users
- Training courses and certification programs
- Local field application engineer support
Environmental & Export Classifications
Environmental Compliance
The XCKU13P-L1FFVE900I meets stringent environmental standards ensuring responsible manufacturing and disposal:
RoHS Compliance: Fully compliant with RoHS directive 2011/65/EU REACH Registration: Registered under EU REACH regulation Conflict Minerals: Compliant with conflict-free mineral sourcing requirements Halogen-Free: Package materials meet halogen-free specifications
Export Control Classifications
ECCN (Export Control Classification Number): 3A001.a.7 HTS (Harmonized Tariff Schedule): 8542.33.0001 Country of Origin: Various (check specific part marking)
Operating Specifications
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
The XCKU13P-L1FFVE900I represents cutting-edge FPGA technology, combining high performance with energy efficiency for next-generation electronic systems. Its robust feature set and comprehensive development ecosystem make it an excellent choice for demanding applications across telecommunications, aerospace, defense, and high-performance computing markets.
For detailed technical specifications, pricing information, and design support, consult with authorized AMD Xilinx distributors or visit the official AMD Xilinx website for the most current XCKU13P-L1FFVE900I documentation and resources.
