The XCKU15P-1FFVE1760I represents AMD Xilinx’s advanced Kintex UltraScale+ FPGA technology, delivering exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing. This powerful field-programmable gate array combines cutting-edge 16nm FinFET process technology with optimized architecture to meet the most challenging design requirements.
Product Specifications
The XCKU15P-1FFVE1760I features comprehensive specifications designed for high-performance applications:
Core Architecture:
- Logic Cells: 1,451,000 system logic cells providing extensive programmable logic capacity
- CLB Flip-Flops: 1,827,600 configurable logic block flip-flops for flexible design implementation
- CLB LUTs: 913,800 configurable logic block lookup tables enabling complex logic functions
- Block RAM: 75.9 Mb total block RAM for efficient data storage and buffering
Memory and Processing:
- UltraRAM: 270 Mb of UltraRAM providing high-density memory integration
- DSP Slices: 1,968 DSP48E2 slices for high-performance signal processing applications
- CMTs: 12 clock management tiles for precise timing control
- GTY Transceivers: 20 high-speed serial transceivers supporting up to 32.75 Gbps data rates
Package and I/O:
- Package Type: FFVE1760 – 1760-pin Flip Chip BGA package
- Speed Grade: -1 industrial temperature grade (-40ยฐC to +100ยฐC)
- Total I/O Pins: 832 user I/O pins for extensive connectivity options
- Voltage Support: Multiple I/O voltage standards from 1.2V to 3.3V
Price Information
The XCKU15P-1FFVE1760I pricing varies based on quantity, lead time, and distributor. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume pricing discounts are typically available for orders exceeding standard quantities. The XCKU15P-1FFVE1760I offers excellent value considering its advanced features and high-performance capabilities.
Documents & Media
Essential documentation for the XCKU15P-1FFVE1760I includes:
Technical Documentation:
- Kintex UltraScale+ FPGAs Data Sheet containing detailed electrical specifications
- XCKU15P-1FFVE1760I pinout and package information
- Power consumption and thermal management guidelines
- Migration and compatibility guides from previous FPGA generations
Design Resources:
- Vivado Design Suite compatibility information for XCKU15P-1FFVE1760I development
- Reference designs and application notes
- Timing and constraint guidelines
- PCB design recommendations and layout considerations
Software Tools:
- Latest Vivado Design Suite supporting XCKU15P-1FFVE1760I development
- IP core libraries optimized for Kintex UltraScale+ architecture
- Debugging and analysis tools for system optimization
Related Resources
The XCKU15P-1FFVE1760I ecosystem includes comprehensive support resources:
Development Boards:
- Kintex UltraScale+ evaluation boards featuring XCKU15P variants
- Third-party development platforms supporting XCKU15P-1FFVE1760I integration
- Custom board design services and reference implementations
IP Cores and Solutions:
- AMD Xilinx IP Portfolio compatible with XCKU15P-1FFVE1760I
- Third-party IP cores optimized for Kintex UltraScale+ architecture
- Application-specific IP solutions for communications, video processing, and DSP
Training and Support:
- Technical training courses for XCKU15P-1FFVE1760I development
- Community forums and technical support resources
- Professional design services and consulting options
Environmental & Export Classifications
The XCKU15P-1FFVE1760I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for European markets
- Conflict minerals reporting compliance
- Environmental temperature range: -40ยฐC to +100ยฐC (industrial grade)
Quality Standards:
- Automotive qualification available for select variants
- Industrial temperature testing and validation
- Long-term reliability testing and qualification data
- Quality management system certifications
Export Classifications:
- Export Control Classification Number (ECCN) compliance
- International trade regulation adherence
- Country-specific import/export documentation requirements
- Trade compliance support for global distribution
Packaging and Handling:
- Moisture sensitivity level classification
- Anti-static packaging requirements
- Storage and handling guidelines
- Traceability and lot control procedures
The XCKU15P-1FFVE1760I represents the pinnacle of FPGA technology, combining exceptional performance, comprehensive features, and robust environmental compliance. Whether developing next-generation telecommunications infrastructure, aerospace systems, or high-performance computing solutions, the XCKU15P-1FFVE1760I provides the flexibility and performance required for the most demanding applications.
