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XCKU15P-L2FFVA1156E: High-Performance Kintex UltraScale+ FPGA

Original price was: $20.00.Current price is: $19.00.

The XCKU15P-L2FFVA1156E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing.

Product Specifications

Core Architecture

  • Device Family: Kintex UltraScale+
  • Part Number: XCKU15P-L2FFVA1156E
  • Logic Cells: Approximately 1.45 million system logic cells
  • CLB Flip-Flops: 1,728,000
  • CLB LUTs: 864,000
  • Block RAM: 38.4 Mb total block RAM
  • UltraRAM: 54 Mb distributed throughout the device

Advanced Features

  • DSP Slices: 1,968 DSP48E2 slices for high-performance signal processing
  • PCIe Support: Integrated PCIe Gen3 x16 and Gen4 x8 interfaces
  • Transceivers: 32 GTY transceivers supporting up to 32.75 Gbps
  • Package: FFVA1156 (35mm ร— 35mm flip-chip fine-pitch BGA)
  • Speed Grade: -2L (low power variant)
  • Temperature Grade: Extended commercial (0ยฐC to 85ยฐC)

Memory and Connectivity

  • Memory Controllers: DDR4-2666, DDR3, LPDDR4, QDR-IV support
  • I/O Banks: 12 high-performance I/O banks
  • Maximum User I/Os: 520 differential pairs
  • Clock Management: 24 mixed-mode clock managers (MMCM)

Price Information

The XCKU15P-L2FFVA1156E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and performance. Contact authorized distributors for current pricing, as costs vary based on:

  • Order quantity and volume discounts
  • Regional availability and distribution
  • Package and shipping requirements
  • Technical support and development tools

For the most competitive pricing on the XCKU15P-L2FFVA1156E, we recommend obtaining quotes from multiple authorized Xilinx distributors and considering long-term supply agreements for volume applications.

Documents & Media

Technical Documentation

  • Product Brief: Comprehensive overview of XCKU15P-L2FFVA1156E features and capabilities
  • Datasheet: Detailed electrical specifications, timing parameters, and package information
  • User Guide: Complete implementation guide for the Kintex UltraScale+ family
  • Migration Guide: Step-by-step instructions for upgrading from previous FPGA generations

Development Resources

  • Vivado Design Suite: Complete development environment with synthesis, implementation, and debugging tools
  • Reference Designs: Pre-verified IP cores and application examples
  • Application Notes: Best practices for power optimization, timing closure, and system integration
  • Video Tutorials: Step-by-step guidance for common design flows and optimization techniques

Package Information

  • Package Drawing: Mechanical specifications for FFVA1156 package
  • Pin Assignment Files: Complete pinout information for design tools
  • Thermal Models: Junction-to-ambient and junction-to-case thermal resistance data

Related Resources

Development Boards

  • KCU116 Evaluation Kit: Complete development platform featuring the XCKU5P with similar architecture
  • Custom Carrier Boards: Third-party solutions optimized for specific applications
  • Prototyping Modules: Compact form-factor boards for proof-of-concept development

IP Portfolio

  • Xilinx IP Catalog: Over 100 pre-verified IP cores including DSP, connectivity, and memory controllers
  • Partner IP Solutions: Third-party IP cores optimized for Kintex UltraScale+ devices
  • Open Source IP: Community-developed cores and reference implementations

Software Tools

  • Vitis Unified Software Platform: Comprehensive development environment for embedded software and acceleration
  • PetaLinux Tools: Complete Linux BSP development suite
  • System Generator: Model-based design tools for DSP applications

Training and Support

  • Online Training Modules: Self-paced courses covering FPGA design fundamentals
  • Technical Forums: Community support and knowledge sharing platform
  • Application Engineering: Direct access to Xilinx technical experts

Environmental & Export Classifications

Environmental Compliance

The XCKU15P-L2FFVA1156E meets stringent environmental standards:

  • RoHS Compliant: Lead-free manufacturing process compliant with EU RoHS directive
  • REACH Regulation: Complies with European chemical safety requirements
  • Conflict Minerals: Sourced through responsible supply chains per Dodd-Frank Act requirements
  • Halogen-Free: Low halogen content for environmentally conscious applications

Operating Conditions

  • Ambient Temperature: 0ยฐC to +85ยฐC (extended commercial grade)
  • Junction Temperature: Up to +100ยฐC maximum
  • Supply Voltage: Multiple voltage domains from 0.72V to 3.3V
  • Power Consumption: Optimized for low-power applications with advanced power management

Export Control Information

  • ECCN Classification: 3A001.a.7 (subject to US Export Administration Regulations)
  • HTS Code: 8542.33.0001 for customs and trade documentation
  • Country Restrictions: Export restrictions may apply to certain countries and end-users
  • License Requirements: May require export licenses for specific applications and destinations

Quality and Reliability

  • Automotive Grade: AEC-Q100 qualified variants available for automotive applications
  • Industrial Temperature: Extended temperature range options for harsh environments
  • Quality Management: ISO 9001:2015 certified manufacturing processes
  • Reliability Testing: Comprehensive qualification including HTOL, TC, and JEDEC standards

The XCKU15P-L2FFVA1156E represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support and strict environmental compliance for mission-critical applications across diverse industries.