The XCKU5P-2FFVA676E is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing markets.
Product Specifications
The XCKU5P-2FFVA676E features cutting-edge 16nm FinFET+ technology, offering an optimal balance of performance, power efficiency, and cost-effectiveness. This FPGA incorporates 356,160 logic cells and 1,728 DSP slices, making it ideal for signal processing, machine learning inference, and high-speed data processing applications.
Key technical specifications include 27 Mb of block RAM, 1,824 user I/O pins, and support for DDR4-2400 memory interfaces. The device operates across commercial temperature ranges and supports multiple high-speed serial transceivers with data rates up to 32.75 Gbps. The XCKU5P-2FFVA676E utilizes the FFVA676 package, providing excellent thermal performance and signal integrity for complex designs.
The architecture supports advanced features including hardened PCIe Gen3 blocks, 100G Ethernet MAC, and integrated security features. Power consumption is optimized through intelligent clock gating and dynamic voltage scaling, ensuring efficient operation across various workloads.
Price Information
Pricing for the XCKU5P-2FFVA676E varies based on quantity, lead time, and supplier. Commercial pricing typically ranges from $2,000 to $4,500 per unit for standard quantities. Volume discounts are available for orders exceeding 100 units, with additional savings possible for annual agreements.
Educational institutions and research organizations may qualify for special academic pricing. Contact authorized Xilinx distributors for current pricing, availability, and volume discount structures. Lead times typically range from 12 to 26 weeks depending on market conditions and order quantities.
Documents & Media
Comprehensive documentation for the XCKU5P-2FFVA676E includes detailed datasheets, user guides, and application notes. The official Xilinx documentation package contains electrical specifications, thermal characteristics, and packaging information essential for design implementation.
Key resources include the Kintex UltraScale+ FPGA Data Sheet, PCB Design Guidelines, and Power Estimation spreadsheets. Vivado Design Suite provides complete development tools, including synthesis, implementation, and debugging capabilities specifically optimized for the XCKU5P-2FFVA676E.
Video tutorials, webinars, and reference designs are available through the Xilinx Developer Zone. These resources cover topics from basic FPGA concepts to advanced implementation techniques, helping engineers maximize the potential of the XCKU5P-2FFVA676E in their applications.
Related Resources
The XCKU5P-2FFVA676E ecosystem includes comprehensive development boards, evaluation kits, and third-party IP cores. Compatible development platforms enable rapid prototyping and system validation before production deployment.
Xilinx Alliance Partners provide specialized IP cores, design services, and application-specific solutions tailored for the XCKU5P-2FFVA676E. These partnerships extend the device’s capabilities across various market segments including automotive, industrial automation, and communications infrastructure.
Technical support resources include community forums, application engineering support, and comprehensive training programs. The Xilinx University Program offers educational resources and development tools for academic institutions implementing the XCKU5P-2FFVA676E in research and teaching applications.
Environmental & Export Classifications
The XCKU5P-2FFVA676E complies with international environmental standards including RoHS, REACH, and conflict minerals regulations. The device meets automotive-grade reliability requirements and supports extended temperature operation for harsh environment applications.
Export classification follows standard semiconductor regulations with specific attention to cryptographic capabilities and high-performance computing features. The XCKU5P-2FFVA676E is subject to export administration regulations, and proper licensing may be required for certain international destinations.
Environmental operating conditions support commercial temperature ranges from 0ยฐC to 85ยฐC, with junction temperatures up to 100ยฐC. The device packaging meets JEDEC standards for moisture sensitivity and thermal cycling, ensuring reliable operation across diverse deployment scenarios.
Manufacturing processes adhere to ISO 14001 environmental management standards, with ongoing initiatives to reduce carbon footprint and improve sustainability throughout the product lifecycle. The XCKU5P-2FFVA676E supports green design methodologies through optimized power management and efficient resource utilization.
The XCKU5P-2FFVA676E represents the pinnacle of FPGA technology, combining high performance, flexibility, and reliability in a single device. Whether implementing complex signal processing algorithms, accelerating machine learning workloads, or developing next-generation communication systems, this FPGA provides the computational power and versatility needed for today’s most demanding applications.
