The XC7K410T-L2FBG676I is a premium member of Xilinx’s Kintex-7 FPGA family, engineered to deliver exceptional performance for bandwidth-intensive and logic-intensive applications. This advanced field-programmable gate array combines high capacity with energy efficiency, making it ideal for communications infrastructure, aerospace, defense, and high-performance computing applications.
Product Specifications
Core Architecture
The XC7K410T-L2FBG676I features Xilinx’s advanced 28nm HPL (High Performance Low Power) technology, providing an optimal balance of performance, power consumption, and cost. This FPGA delivers substantial logic capacity with 406,720 logic cells and 25,740 configurable logic blocks (CLBs).
Memory and DSP Resources
This device incorporates 1,540 18Kb block RAM modules, totaling 28.0 Mb of embedded memory for data buffering and storage applications. The XC7K410T-L2FBG676I also includes 1,540 DSP48E1 slices, enabling high-performance digital signal processing with built-in multiply-accumulate functionality.
I/O Capabilities
The FBG676 package provides 400 user I/O pins, supporting various voltage standards including 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, and 3.3V interfaces. This flexibility enables seamless integration with different system components and legacy interfaces.
Speed Grade and Package Details
- Speed Grade: -2L (Low Power variant)
- Package: FBG676 (Fine-pitch Ball Grid Array)
- Package Size: 27mm ร 27mm
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Part Number: XC7K410T-L2FBG676I
Pricing Information
The XC7K410T-L2FBG676I pricing varies based on order quantity, lead time, and distributor. For current pricing and availability:
- Small Quantities (1-9 units): Contact authorized distributors for quote
- Production Quantities (100+ units): Volume pricing available through Xilinx direct sales
- Sampling: Engineering samples may be available for qualified projects
Note: Prices fluctuate based on market conditions and semiconductor availability. Contact authorized distributors for real-time pricing.
Documents & Media
Technical Documentation
- Data Sheet: Complete electrical specifications, timing parameters, and AC/DC characteristics
- User Guide: Comprehensive implementation guide covering design methodology and best practices
- Package Information: Mechanical drawings, pin assignments, and thermal characteristics
- Migration Guide: Guidelines for upgrading from previous FPGA generations
Development Resources
- Vivado Design Suite: Free development environment supporting the XC7K410T-L2FBG676I
- IP Core Library: Pre-verified intellectual property blocks for faster development
- Reference Designs: Proven implementations for common applications
- Application Notes: Detailed guidance for specific use cases and optimization techniques
Simulation and Verification
- SPICE Models: For signal integrity analysis and board-level simulation
- Timing Models: For accurate timing closure and verification
- Power Estimation Tools: For thermal management and power supply design
Related Resources
Development Boards
Several evaluation and development platforms support the XC7K410T-L2FBG676I, enabling rapid prototyping and proof-of-concept development. These boards typically include essential peripherals, memory interfaces, and connectivity options.
Compatible IP Cores
The XC7K410T-L2FBG676I supports Xilinx’s extensive IP portfolio, including:
- High-speed serial transceivers for communications applications
- Memory controllers for DDR3/DDR4 interfaces
- Video processing IP for multimedia applications
- Networking protocols and packet processing engines
Third-Party Solutions
Numerous third-party vendors provide specialized IP cores, development tools, and consulting services specifically optimized for Kintex-7 FPGAs like the XC7K410T-L2FBG676I.
Training and Support
Xilinx offers comprehensive training programs, online documentation, and technical support forums to help engineers maximize the potential of the XC7K410T-L2FBG676I in their applications.
Environmental & Export Classifications
Environmental Compliance
The XC7K410T-L2FBG676I meets stringent environmental standards:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Sourced from conflict-free supply chains
- Halogen-Free: Environmentally conscious package materials
Export Control Classifications
- ECCN (Export Control Classification Number): 3A991.a.2
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Manufactured in ISO-certified facilities
- Export Restrictions: Subject to standard semiconductor export regulations
Quality and Reliability
The XC7K410T-L2FBG676I undergoes rigorous testing and quality assurance:
- Automotive Grade Available: AEC-Q100 qualified versions for automotive applications
- Extended Temperature Range: Industrial and military temperature grades
- Reliability Testing: Comprehensive stress testing and qualification programs
- Quality Standards: ISO 9001 certified manufacturing processes
Packaging and Handling
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Electrostatic Discharge: ESD sensitive device requiring proper handling procedures
- Storage Requirements: Controlled temperature and humidity storage recommended
- Shipping: Anti-static packaging with proper labeling and documentation
The XC7K410T-L2FBG676I represents a powerful solution for demanding applications requiring high performance, flexibility, and reliability. Its comprehensive feature set, robust ecosystem support, and proven track record make it an excellent choice for next-generation electronic systems across multiple industries.
