The XC6SLX45-3FG676C is a versatile field-programmable gate array (FPGA) from Xilinx’s proven Spartan-6 family, designed to deliver exceptional performance for cost-sensitive applications. This FPGA combines advanced 45nm process technology with comprehensive I/O capabilities, making it an ideal choice for industrial automation, communications, and embedded processing applications.
Product Specifications
The XC6SLX45-3FG676C features a robust architecture built around 43,661 logic cells and 2,180 configurable logic blocks (CLBs). This FPGA incorporates 116 dedicated DSP48A1 slices for high-performance digital signal processing operations, along with 2,088 Kb of block RAM for efficient data storage and buffering.
Key technical specifications of the XC6SLX45-3FG676C include a maximum operating frequency that supports demanding real-time applications. The device operates across commercial temperature ranges from 0ยฐC to +85ยฐC, ensuring reliable performance in various operating environments. With its -3 speed grade designation, this FPGA delivers optimized timing performance for applications requiring fast signal processing and low latency.
The 676-pin Fine-Pitch Ball Grid Array (FBGA) package provides excellent thermal characteristics and signal integrity. This packaging offers 408 user I/O pins, supporting multiple I/O standards including LVDS, LVCMOS, and SSTL for flexible interface connectivity. The XC6SLX45-3FG676C supports various voltage levels, making it compatible with both legacy and modern system designs.
Pricing Information
Pricing for the XC6SLX45-3FG676C varies based on order quantity, delivery requirements, and current market conditions. Volume pricing discounts are typically available for quantities exceeding standard minimum order requirements. For current pricing information and quotations, contact authorized Xilinx distributors or sales representatives who can provide competitive pricing based on your specific project requirements.
Educational institutions and research organizations may qualify for special academic pricing programs. Long-term supply agreements and consignment inventory options are available for high-volume applications requiring production planning certainty.
Documents & Media
Comprehensive technical documentation supports the XC6SLX45-3FG676C implementation process. The official datasheet provides detailed electrical specifications, timing parameters, and package information essential for design planning. Pin-out diagrams and package drawings facilitate PCB layout design and mechanical integration.
Design software support includes compatibility with Xilinx ISE Design Suite and Vivado Design Suite for newer projects. Reference designs and application notes demonstrate best practices for implementing common functions such as memory controllers, communication interfaces, and signal processing algorithms using the XC6SLX45-3FG676C.
Development boards featuring the XC6SLX45-3FG676C enable rapid prototyping and evaluation. These boards typically include essential peripherals, programming interfaces, and expansion headers for custom circuit integration.
Related Resources
The Spartan-6 FPGA family offers multiple device options that complement the XC6SLX45-3FG676C for scalable design implementations. Smaller devices like the XC6SLX25 provide cost-optimized solutions for less complex applications, while larger devices such as the XC6SLX75 offer expanded logic capacity for more demanding designs.
Configuration memory options include serial flash devices and configuration PROMs compatible with the XC6SLX45-3FG676C’s configuration requirements. Power management ICs specifically designed for FPGA applications ensure stable operation across all voltage domains.
Third-party intellectual property cores extend the XC6SLX45-3FG676C’s capabilities with pre-verified functions including soft processors, communication protocols, and specialized signal processing algorithms. These IP cores accelerate development timelines and reduce design risk.
Environmental & Export Classifications
The XC6SLX45-3FG676C meets stringent environmental compliance standards including RoHS directive compliance for lead-free manufacturing. The device qualifies for commercial temperature grade operation, suitable for most indoor applications and controlled industrial environments.
Export classification information indicates the XC6SLX45-3FG676C falls under standard commercial export categories. However, specific export requirements may vary by destination country and end-use application. Consult current export control regulations and trade compliance guidelines before international shipment.
Environmental stress testing validates the XC6SLX45-3FG676C’s reliability under various conditions including thermal cycling, humidity exposure, and mechanical stress. These qualifications ensure consistent performance throughout the device’s operational lifetime in target applications.
The XC6SLX45-3FG676C represents a proven solution for applications requiring reliable FPGA performance, comprehensive I/O capabilities, and cost-effective implementation. Its combination of logic capacity, DSP resources, and flexible packaging makes it suitable for diverse application requirements across multiple industries.
