The XC3S700A-5FG400C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3 series, designed to deliver exceptional performance for embedded system applications. This versatile programmable logic device combines advanced features with cost-effective pricing, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
The XC3S700A-5FG400C features a robust architecture built on 90nm process technology. This FPGA contains 13,248 logic cells and 5,888 configurable logic blocks (CLBs), providing substantial processing capability for demanding applications. The device includes 360 Kbits of block RAM, offering ample on-chip memory for data buffering and storage operations.
Key specifications of the XC3S700A-5FG400C include a maximum user I/O count of 264 pins, supporting various interface standards including LVTTL, LVCMOS, and differential signaling options. The device operates across a commercial temperature range of 0ยฐC to 85ยฐC, ensuring reliable performance in diverse environmental conditions. With a core voltage of 1.2V and I/O voltage support from 1.2V to 3.3V, the XC3S700A-5FG400C provides flexible power management options.
The FPGA supports clock frequencies up to 326 MHz, enabling high-speed digital signal processing applications. Its 400-pin Fine-Pitch Ball Grid Array (FBGA) package provides excellent thermal characteristics and signal integrity for complex PCB designs.
Pricing Information
Pricing for the XC3S700A-5FG400C varies based on order quantity, lead time, and supplier relationships. Commercial distributors typically offer volume discounts for quantities exceeding 100 units. Educational institutions and research organizations may qualify for special academic pricing programs. Contact authorized Xilinx distributors for current pricing quotes and availability information.
The cost-effectiveness of the XC3S700A-5FG400C makes it particularly attractive for prototype development and small to medium-volume production runs. When evaluating total system cost, consider the integrated features that eliminate the need for external components, potentially reducing overall bill-of-materials expenses.
Documents & Media Resources
Comprehensive technical documentation supports the XC3S700A-5FG400C throughout the design cycle. The official datasheet provides detailed electrical characteristics, timing specifications, and packaging information essential for proper implementation. Application notes offer practical guidance for common design challenges and optimization techniques.
Xilinx provides the ISE Design Suite software for FPGA development, including synthesis, implementation, and debugging tools specifically optimized for Spartan-3 devices. The software includes extensive libraries and IP cores that accelerate development time for the XC3S700A-5FG400C.
Reference designs and example projects demonstrate best practices for utilizing the XC3S700A-5FG400C in various applications. These resources include VHDL and Verilog code examples, constraint files, and implementation reports that serve as starting points for custom designs.
Related Technical Resources
The XC3S700A-5FG400C integrates seamlessly with Xilinx’s broader ecosystem of development tools and support resources. ChipScope Pro analyzer enables real-time debugging and verification of designs running on the FPGA. The CORE Generator system provides access to optimized IP cores for common functions like memory controllers, digital signal processing, and communication interfaces.
Online community forums and technical support channels offer assistance from both Xilinx engineers and experienced users. These resources prove invaluable when working through complex implementation challenges or optimization requirements specific to the XC3S700A-5FG400C.
Training materials and webinars cover advanced topics such as power optimization, timing closure, and design methodology best practices. These educational resources help engineers maximize the capabilities of the XC3S700A-5FG400C in their specific applications.
Environmental & Export Classifications
The XC3S700A-5FG400C complies with RoHS (Restriction of Hazardous Substances) directive requirements, ensuring environmental responsibility in manufacturing and disposal. The device meets WEEE (Waste Electrical and Electronic Equipment) guidelines for proper end-of-life handling.
Export classification for the XC3S700A-5FG400C falls under standard commercial electronics categories, with minimal restrictions for most international destinations. However, specific export control regulations may apply based on the end-use application and destination country. Consult current export administration regulations before international shipment.
The FPGA operates within specified electromagnetic compatibility (EMC) standards, minimizing interference with other electronic systems. Proper PCB layout and grounding techniques ensure compliance with FCC Part 15 and CE marking requirements for commercial electronic equipment.
Environmental testing validates the XC3S700A-5FG400C performance across specified temperature, humidity, and vibration ranges. These qualifications support deployment in industrial automation, automotive, and telecommunications applications where environmental resilience is critical.
The XC3S700A-5FG400C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based system designs. Its proven Spartan-3 architecture, comprehensive development support, and environmental compliance make it a reliable choice for engineers developing next-generation embedded systems.
